FPC - Company Ranking(12 companies in total)
Last Updated： Aggregation Period:Oct 15, 2025〜Nov 11, 2025
This ranking is based on the number of page views on our site.
Display Company Information
| Company Name | Featured Products | ||
|---|---|---|---|
| Product Image, Product Name, Price Range | overview | Application/Performance example | |
| MSAP (Modified Semi Additive Process) method Via filling: Filling through-hole holes with copper plating | Latest smartphones Precision medical devices, etc. | ||
| For more details, please refer to the PDF document or feel free to contact us. | For more details, please refer to the PDF document or feel free to contact us. | ||
| - CCL conversion of the substrate (high-temperature press capability) - Simulation design to production (MSAP possible) - Evaluation measure... | Evaluation tests for new substrate materials from substrate manufacturers, etc. | ||
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太洋テクノレックス 本社 和歌山
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- Featured Products
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Ultra-fine line high-density FPC (high-precision flexible printed circuit board)
- overview
- MSAP (Modified Semi Additive Process) method Via filling: Filling through-hole holes with copper plating
- Application/Performance example
- Latest smartphones Precision medical devices, etc.
Transparent FPC (Transparent Flexible Printed Circuit Board)
- overview
- For more details, please refer to the PDF document or feel free to contact us.
- Application/Performance example
- For more details, please refer to the PDF document or feel free to contact us.
Material Evaluation Services: FPC, MPI, PTFE (Flexible Substrate)
- overview
- - CCL conversion of the substrate (high-temperature press capability) - Simulation design to production (MSAP possible) - Evaluation measure...
- Application/Performance example
- Evaluation tests for new substrate materials from substrate manufacturers, etc.
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太洋テクノレックス 本社 和歌山
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