FPC - Company Ranking(13 companies in total)
Last Updated: Aggregation Period:Jun 24, 2026〜Jul 21, 2026
This ranking is based on the number of page views on our site.
Display Company Information
| Company Name | Featured Products | ||
|---|---|---|---|
| Product Image, Product Name, Price Range | overview | Application/Performance example | |
| ■Specifications - FPC Length: Up to 3m - FPC Thickness: 80μm - FPC Width: 0.6mm or more - Wiring: We will accommodate customer needs... | Can be used with ultra-thin items such as catheters and guidewires. | ||
Heater FPC
Other |
【Specifications (Electrical Performance)】 ■ Heat resistance temperature: 150℃ ■ Insulation resistance: 100MΩ or more at DC500V ■ Insulation ... | ■Anti-fogging for camera lenses, prevention of condensation ■Prevention of liquid coagulation, such as ink and blood ■Temperature and hu... | |
Noise-resistant FPC
Other |
■Double-sided FPC ■GND enhancement through microstrip structure and coplanar design | ■Noise reduction cable for LCD main board ■Noise reduction cable between camera/sensor and main board ■Chip to Chip, Chip to Module jump... | |
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- Featured Products
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Low Resistance Long Length FPC for Catheters (for Medical Devices)
- overview
- ■Specifications - FPC Length: Up to 3m - FPC Thickness: 80μm - FPC Width: 0.6mm or more - Wiring: We will accommodate customer needs...
- Application/Performance example
- Can be used with ultra-thin items such as catheters and guidewires.
Heater FPC
- overview
- 【Specifications (Electrical Performance)】 ■ Heat resistance temperature: 150℃ ■ Insulation resistance: 100MΩ or more at DC500V ■ Insulation ...
- Application/Performance example
- ■Anti-fogging for camera lenses, prevention of condensation ■Prevention of liquid coagulation, such as ink and blood ■Temperature and hu...
Noise-resistant FPC
- overview
- ■Double-sided FPC ■GND enhancement through microstrip structure and coplanar design
- Application/Performance example
- ■Noise reduction cable for LCD main board ■Noise reduction cable between camera/sensor and main board ■Chip to Chip, Chip to Module jump...
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