stage - Company Ranking(44 companyies in total)
Last Updated： Aggregation Period:Jul 16, 2025〜Aug 12, 2025
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Display Company Information
| Company Name | Featured Products | ||
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| Product Image, Product Name, Price Range | overview | Application/Performance example | |
| 【Specifications (Excerpt)】 ■ Table Surface: Diameter 80mm ■ Guidance Method: Linear Guide ■ Movement Range XY: ±15mm ■ Feed Method (Common to Both Axes): Ball Screw ■ Material: Aluminum Alloy ■ Weight: Approximately 1.7kg *For more details, please refer to the PDF document or feel free to contact us. | For more details, please refer to the PDF document or feel free to contact us. | ||
| 【Specifications】 ■RSTZ-003 Table Size: Φ500mm Through Hole: Φ250mm Load Capacity: 300kgf (when evenly loaded) Motor Model: PK513-H100S (Oriental Motor) Drive Unit Resolution: 0.02μm Maximum Stroke in Axial Direction*: X-axis ±15mm, Y-axis ±17.5mm, Z-axis ±7.5mm θz-axis ±4.7°, θx-axis ±2.3°, θy-axis ±2.7° ■RSTZ-004 Table Size: Φ350mm Through Hole: Φ140mm Load Capacity: 120kgf (when evenly loaded) Motor Model: PK513-H100S (Oriental Motor) Drive Unit Resolution: 0.02μm Maximum Stroke in Axial Direction*: X-axis ±9mm, Y-axis ±10.3mm, Z-axis ±4.5mm θz-axis ±4.3°, θx-axis ±2.1°, θy-axis ±2.4° *When moving in multiple axial directions, the range will be narrower than the above strokes. | 【Examples of Use】 ■Wafer bonding ■Micro LED laser transfer ■Nanoimprint ■Sputtering (film deposition) ■Exposure ■Printed electronics | ||
| 【Other Features】 - Due to the structural design, it does not use bearings that impose restrictions on the size of the through holes, allowing for the creation of large-diameter through holes. - By modularizing the drive unit, the table size and shape can be freely designed according to the mounted workpiece. - We can also propose the addition of a Z mechanism, which is required for applications such as bonding. - Customization options are available for stroke changes, high load specifications, changes in appearance color, and other specifications. *For more details, please refer to the PDF document or feel free to contact us. | 【Applications】 ■ Wafer bonding equipment ■ Exposure equipment ■ Electrical inspection equipment for various substrates ■ Submicron alignment of various types *For more details, please refer to the PDF document or feel free to contact us. | ||
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神津精機
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- Featured Products
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Ultra-thin Precision XY Stage 'CYAT-070'
- overview
- 【Specifications (Excerpt)】 ■ Table Surface: Diameter 80mm ■ Guidance Method: Linear Guide ■ Movement Range XY: ±15mm ■ Feed Method (Common to Both Axes): Ball Screw ■ Material: Aluminum Alloy ■ Weight: Approximately 1.7kg *For more details, please refer to the PDF document or feel free to contact us.
- Application/Performance example
- For more details, please refer to the PDF document or feel free to contact us.
Ultra-high precision 6-axis alignment stage "RSTZ Series"
- overview
- 【Specifications】 ■RSTZ-003 Table Size: Φ500mm Through Hole: Φ250mm Load Capacity: 300kgf (when evenly loaded) Motor Model: PK513-H100S (Oriental Motor) Drive Unit Resolution: 0.02μm Maximum Stroke in Axial Direction*: X-axis ±15mm, Y-axis ±17.5mm, Z-axis ±7.5mm θz-axis ±4.7°, θx-axis ±2.3°, θy-axis ±2.7° ■RSTZ-004 Table Size: Φ350mm Through Hole: Φ140mm Load Capacity: 120kgf (when evenly loaded) Motor Model: PK513-H100S (Oriental Motor) Drive Unit Resolution: 0.02μm Maximum Stroke in Axial Direction*: X-axis ±9mm, Y-axis ±10.3mm, Z-axis ±4.5mm θz-axis ±4.3°, θx-axis ±2.1°, θy-axis ±2.4° *When moving in multiple axial directions, the range will be narrower than the above strokes.
- Application/Performance example
- 【Examples of Use】 ■Wafer bonding ■Micro LED laser transfer ■Nanoimprint ■Sputtering (film deposition) ■Exposure ■Printed electronics
Ultra-High Precision Alignment Stage 'RST Aligner'
- overview
- 【Other Features】 - Due to the structural design, it does not use bearings that impose restrictions on the size of the through holes, allowing for the creation of large-diameter through holes. - By modularizing the drive unit, the table size and shape can be freely designed according to the mounted workpiece. - We can also propose the addition of a Z mechanism, which is required for applications such as bonding. - Customization options are available for stroke changes, high load specifications, changes in appearance color, and other specifications. *For more details, please refer to the PDF document or feel free to contact us.
- Application/Performance example
- 【Applications】 ■ Wafer bonding equipment ■ Exposure equipment ■ Electrical inspection equipment for various substrates ■ Submicron alignment of various types *For more details, please refer to the PDF document or feel free to contact us.
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神津精機
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