tweezers - Company Ranking(28 companyies in total)
Last Updated： Aggregation Period:Jul 23, 2025〜Aug 19, 2025
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Display Company Information
| Company Name | Featured Products | ||
|---|---|---|---|
| Product Image, Product Name, Price Range | overview | Application/Performance example | |
| A non-contact tweezers that transports wafers and chips to a designated location without contact by attaching a handle with a valve to a Bernoulli chuck that transports 50μm thick glass wafers by ejecting gas, allowing for manual operation of the valve like a pair of tweezers. Since it is non-contact, it does not scratch the wafers and allows for easy transportation without contact. | A non-contact tweezers that transports wafers, chips, and smartphone glass to designated locations through manual valve operation, without making contact. Since it is non-contact, it does not scratch the wafers or smartphone glass, allowing for easy non-contact transportation. | ||
Bernoulli tweezers
Other |
The "Bernoulli tweezers" have the function of holding substrates in a suspended state without contact by using air supply ON-OFF controlled by a valve attached to the handle, similar to tweezers, to grip wafers, chips, lenses, solar cell substrates, and glass substrates non-contact. By ejecting air, it creates a negative pressure inside according to the distance from the workpiece through the ejector effect and Bernoulli effect, and also generates positive pressure through the pressure chamber type air cushion effect and the cushioning effect of the airflow. | Using a valve attached to the handle, the air supply is turned ON and OFF by hand to grasp the wafer, chip, lens, solar cell substrate, and glass substrate in a non-contact manner, similar to using tweezers. | |
| The Bernoulli chuck "Float Chuck SAG (InP) type" performs ON-OFF operation of gas supply for high-temperature compound semiconductor wafers (GaAs, InP, GaP), allowing the compound semiconductor wafers, including InP wafers, to be non-contact suctioned and detached at a predetermined position. The Bernoulli chuck "Float Chuck SAG (InP) type" creates a negative pressure inside by ejecting gas, depending on the distance from the wafer, utilizing the ejector effect and Bernoulli effect, while also generating positive pressure through the pressure chamber type air cushion effect and the cushioning effect of gas flow, thereby enabling the non-contact suspension holding of InP wafers. | Non-contact transport of the following notched wafers of compound semiconductor wafers (GaAs, InP, GaP) is possible. - Φ2 to 4 inch wafers - Φ2 to 4 inch x 1/4 wafers - Φ2 to 4 inch x 1/2 wafers | ||
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ソーラーリサーチ研究所 大阪事業所
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- Featured Products
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Bernoulli tweezers (for ultra-thin glass over 50μm)
- overview
- A non-contact tweezers that transports wafers and chips to a designated location without contact by attaching a handle with a valve to a Bernoulli chuck that transports 50μm thick glass wafers by ejecting gas, allowing for manual operation of the valve like a pair of tweezers. Since it is non-contact, it does not scratch the wafers and allows for easy transportation without contact.
- Application/Performance example
- A non-contact tweezers that transports wafers, chips, and smartphone glass to designated locations through manual valve operation, without making contact. Since it is non-contact, it does not scratch the wafers or smartphone glass, allowing for easy non-contact transportation.
Bernoulli tweezers
- overview
- The "Bernoulli tweezers" have the function of holding substrates in a suspended state without contact by using air supply ON-OFF controlled by a valve attached to the handle, similar to tweezers, to grip wafers, chips, lenses, solar cell substrates, and glass substrates non-contact. By ejecting air, it creates a negative pressure inside according to the distance from the workpiece through the ejector effect and Bernoulli effect, and also generates positive pressure through the pressure chamber type air cushion effect and the cushioning effect of the airflow.
- Application/Performance example
- Using a valve attached to the handle, the air supply is turned ON and OFF by hand to grasp the wafer, chip, lens, solar cell substrate, and glass substrate in a non-contact manner, similar to using tweezers.
Non-contact tweezers for compound semiconductor wafers
- overview
- The Bernoulli chuck "Float Chuck SAG (InP) type" performs ON-OFF operation of gas supply for high-temperature compound semiconductor wafers (GaAs, InP, GaP), allowing the compound semiconductor wafers, including InP wafers, to be non-contact suctioned and detached at a predetermined position. The Bernoulli chuck "Float Chuck SAG (InP) type" creates a negative pressure inside by ejecting gas, depending on the distance from the wafer, utilizing the ejector effect and Bernoulli effect, while also generating positive pressure through the pressure chamber type air cushion effect and the cushioning effect of gas flow, thereby enabling the non-contact suspension holding of InP wafers.
- Application/Performance example
- Non-contact transport of the following notched wafers of compound semiconductor wafers (GaAs, InP, GaP) is possible. - Φ2 to 4 inch wafers - Φ2 to 4 inch x 1/4 wafers - Φ2 to 4 inch x 1/2 wafers
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ソーラーリサーチ研究所 大阪事業所
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