Circuit board prototype - Company Ranking(7 companyies in total)
Last Updated： Aggregation Period:Jul 23, 2025〜Aug 19, 2025
This ranking is based on the number of page views on our site.
Display Company Information
| Company Name | Featured Products | ||
|---|---|---|---|
| Product Image, Product Name, Price Range | overview | Application/Performance example | |
Affordable! High quality! Short delivery time! Web-based PCB prototyping service.
10,000 yen-100,000 yen |
【Price Example】 Size: 50×50mm / 2-layer FR4 / Thickness 1.6mm / Copper foil 35μm / Silk one side (white) / Solder mask both sides (green) / Solder leveling finish / Order quantity 1 piece ★ Price including tax: 14,999 yen (this price includes initial costs) 【Overview of Manufacturing Specifications】 - Material: FR4/CEM3/FR1 - Thickness: 0.4/0.6/0.8/1.0/1.2/1.6/2.0/2.6/3.2mm - Minimum hole diameter: 0.3mm - Minimum pad diameter: 0.6mm - Minimum pattern width/spacing: 0.15mm - Surface treatment: Solder leveling (lead-free and leaded) / Gold flash / Gold plating / Heat-resistant preflux / Gold plating only on terminal parts - Color of solder mask: Green/Red/Blue/Yellow/White/Black - Color of silk: White/Yellow/Black * In addition to rigid substrates (glass epoxy or paper phenolic), we also support flexible substrates, aluminum substrates, etc. Please feel free to contact us for more details or inquiries. | Prototype circuit board manufacturing / pattern design / component mounting / component procurement / metal mask creation / circuit design / support for everything from small-scale prototypes to mass production circuit boards. | |
|
---
--- |
--- | ||
東和テック
-
- Featured Products
-
Affordable! High quality! Short delivery time! Web-based PCB prototyping service.
- overview
- 【Price Example】 Size: 50×50mm / 2-layer FR4 / Thickness 1.6mm / Copper foil 35μm / Silk one side (white) / Solder mask both sides (green) / Solder leveling finish / Order quantity 1 piece ★ Price including tax: 14,999 yen (this price includes initial costs) 【Overview of Manufacturing Specifications】 - Material: FR4/CEM3/FR1 - Thickness: 0.4/0.6/0.8/1.0/1.2/1.6/2.0/2.6/3.2mm - Minimum hole diameter: 0.3mm - Minimum pad diameter: 0.6mm - Minimum pattern width/spacing: 0.15mm - Surface treatment: Solder leveling (lead-free and leaded) / Gold flash / Gold plating / Heat-resistant preflux / Gold plating only on terminal parts - Color of solder mask: Green/Red/Blue/Yellow/White/Black - Color of silk: White/Yellow/Black * In addition to rigid substrates (glass epoxy or paper phenolic), we also support flexible substrates, aluminum substrates, etc. Please feel free to contact us for more details or inquiries.
- Application/Performance example
- Prototype circuit board manufacturing / pattern design / component mounting / component procurement / metal mask creation / circuit design / support for everything from small-scale prototypes to mass production circuit boards.
-
東和テック
Membership (free) is required to view all content.
Already a Member? Log In Here
