Isolator - Company Ranking(10 companyies in total)

Last Updated：Sep 10, 2025 Aggregation Period:Aug 13, 2025〜Sep 09, 2025
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Company Name	Company information	Featured Products
Company Name	Company information	Product Image, Product Name, Price Range	overview	Application/Performance example
ロッキー	Address Tokyo/ number of employees 60 Business Activities 1. Sales of in-house developed products and various electronic device boards 2. Development, design, and manufacturing of industrial and various electronic device boards - Development, design, and manufacturing of A/D, D/A, image processing, FPGA/DSP related boards - Manufacturing of communication-related OEM electronic devices and contract design and manufacturing 3. Sales of industrial electronic board products both overseas and domestically - FPGA, compact PCI, VME, industrial-related board products / communication terminal board products Key Partners Anritsu Corporation Aichi Corporation Asahi Kogyo Company Ikegami Tsushinki Co., Ltd. Ushio Electric Co., Ltd. NEC Engineering, Ltd. NTT Advanced Technology Corporation Omron Corporation & Group Companies Origin Corporation Olympus Corporation & Group Companies Ono Sokki Co., Ltd. Oki Electric Industry Co., Ltd. & Group Companies Katata Electric Co., Ltd. Canon Inc. & Group Companies Kubota Corporation High Energy Accelerator Research Organization (KEK) National Institute of Advanced Industrial Science and Technology (AIST) Takano Co., Ltd. Tamura Manufacturing Co., Ltd. Toshiba Corporation & Group Companies Tohoku Furu Corporation Topcon Corporation Dainippon Engineering Co., Ltd. Nagano Japan Radio Co., Ltd. Nikon Corporation & Group Companies Nihon Signal Co., Ltd. Nihon Musen Co., Ltd. Nihon Denshi Co., Ltd. NEC Corporation & Group Companies Nihon Bunko Co., Ltd. Purpose Corporation Hagiwara Electronics Co., Ltd. Hagiwara Tech Solutions Co., Ltd. Panasonic Corporation & Group Companies Hamamatsu Photonics K.K. Hitachi International Electric Co., Ltd. Hitachi, Ltd. & Group Companies Fujitsu Limited Fuji Electric Co., Ltd. Fujifilm Corporation & Group Companies HOYA Corporation Mitsubishi Electric Corporation & Group Companies Yokogawa Electric Corporation Others	GMR Isolator High Temperature / Ultra High Speed Specification (IL200 Series) Other	【Application】 ◆ ADC and DAC ◆ Multiplexed Data Transmission ◆ Data Interface ◆ Inter-board Communication ◆ Reduction of Digital Noise ◆ Operator Interface ◆ Ground Loop Elimination ◆ Peripheral Interface ◆ Parallel Bus ◆ Logic Level Shifting ◆ Plasma Display 【Features】 ◆ 5V/3.3V CMOS/TTL Compatible ◆ Data Rate 110Mbps ◆ Operating Temperature Range -40℃ to +85℃ ◆ Isolation Voltage 2500VRMS (1 minute) ◆ Pulse Width Distortion 2ns (Typ.) ◆ Transmission Delay Skew Time 4ns (Typ.) ◆ Transmission Delay Time 10ns (Typ.) ◆ Common Mode Noise Rejection 30kV/μs (Typ.) ◆ Channel-to-Channel Skew 2ns ◆ Package 0.3” or 0.15” 16-pin SOIC ◆ UL1577 and IEC61010-2001 Certified	For more details, please contact us.
ロッキー		GMR Isolator High Temperature / Ultra High Speed Specifications (IL710 Series) Other	<Application> ◆ Digital Fieldbus ◆ RS485 and RS422 ◆ Multiplexed Data Transfer ◆ Data Interface ◆ Inter-Board Communication ◆ Digital Noise Reduction ◆ Operator Interface ◆ Ground Loop Elimination ◆ Peripheral Interface ◆ Serial Communication ◆ Logic Level Shift <Features> ◆ +5V/+3.3V CMOS/TTL Compatible ◆ High Speed: 100Mbps Standard ◆ High Temperature: -40℃ to +100℃ ◆ Isolation Voltage 2500VRMS (1 minute) ◆ Standard Pulse Width Distortion 0.3ns (IL710S) ◆ Standard Transmission Delay Skew 4ns ◆ Standard Transmission Delay 10ns ◆ Standard Common Mode Noise Rejection Capability 30kV/μs ◆ 8-Pin MSOP SOIC PDIP Package ◆ UL1577 and IEC61010-2001 Certified	For more details, please contact us.
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ロッキー

Address

Tokyo/

number of employees

60

Business Activities

1. Sales of in-house developed products and various electronic device boards 2. Development, design, and manufacturing of industrial and various electronic device boards - Development, design, and manufacturing of A/D, D/A, image processing, FPGA/DSP related boards - Manufacturing of communication-related OEM electronic devices and contract design and manufacturing 3. Sales of industrial electronic board products both overseas and domestically - FPGA, compact PCI, VME, industrial-related board products / communication terminal board products

Key Partners

Anritsu Corporation Aichi Corporation Asahi Kogyo Company Ikegami Tsushinki Co., Ltd. Ushio Electric Co., Ltd. NEC Engineering, Ltd. NTT Advanced Technology Corporation Omron Corporation & Group Companies Origin Corporation Olympus Corporation & Group Companies Ono Sokki Co., Ltd. Oki Electric Industry Co., Ltd. & Group Companies Katata Electric Co., Ltd. Canon Inc. & Group Companies Kubota Corporation High Energy Accelerator Research Organization (KEK) National Institute of Advanced Industrial Science and Technology (AIST) Takano Co., Ltd. Tamura Manufacturing Co., Ltd. Toshiba Corporation & Group Companies Tohoku Furu Corporation Topcon Corporation Dainippon Engineering Co., Ltd. Nagano Japan Radio Co., Ltd. Nikon Corporation & Group Companies Nihon Signal Co., Ltd. Nihon Musen Co., Ltd. Nihon Denshi Co., Ltd. NEC Corporation & Group Companies Nihon Bunko Co., Ltd. Purpose Corporation Hagiwara Electronics Co., Ltd. Hagiwara Tech Solutions Co., Ltd. Panasonic Corporation & Group Companies Hamamatsu Photonics K.K. Hitachi International Electric Co., Ltd. Hitachi, Ltd. & Group Companies Fujitsu Limited Fuji Electric Co., Ltd. Fujifilm Corporation & Group Companies HOYA Corporation Mitsubishi Electric Corporation & Group Companies Yokogawa Electric Corporation Others

Featured Products

GMR Isolator High Temperature / Ultra High Speed Specification (IL200 Series)

overview

【Application】 ◆ ADC and DAC ◆ Multiplexed Data Transmission ◆ Data Interface ◆ Inter-board Communication ◆ Reduction of Digital Noise ◆ Operator Interface ◆ Ground Loop Elimination ◆ Peripheral Interface ◆ Parallel Bus ◆ Logic Level Shifting ◆ Plasma Display 【Features】 ◆ 5V/3.3V CMOS/TTL Compatible ◆ Data Rate 110Mbps ◆ Operating Temperature Range -40℃ to +85℃ ◆ Isolation Voltage 2500VRMS (1 minute) ◆ Pulse Width Distortion 2ns (Typ.) ◆ Transmission Delay Skew Time 4ns (Typ.) ◆ Transmission Delay Time 10ns (Typ.) ◆ Common Mode Noise Rejection 30kV/μs (Typ.) ◆ Channel-to-Channel Skew 2ns ◆ Package 0.3” or 0.15” 16-pin SOIC ◆ UL1577 and IEC61010-2001 Certified

Application/Performance example

For more details, please contact us.

GMR Isolator High Temperature / Ultra High Speed Specifications (IL710 Series)

overview

<Application> ◆ Digital Fieldbus ◆ RS485 and RS422 ◆ Multiplexed Data Transfer ◆ Data Interface ◆ Inter-Board Communication ◆ Digital Noise Reduction ◆ Operator Interface ◆ Ground Loop Elimination ◆ Peripheral Interface ◆ Serial Communication ◆ Logic Level Shift <Features> ◆ +5V/+3.3V CMOS/TTL Compatible ◆ High Speed: 100Mbps Standard ◆ High Temperature: -40℃ to +100℃ ◆ Isolation Voltage 2500VRMS (1 minute) ◆ Standard Pulse Width Distortion 0.3ns (IL710S) ◆ Standard Transmission Delay Skew 4ns ◆ Standard Transmission Delay 10ns ◆ Standard Common Mode Noise Rejection Capability 30kV/μs ◆ 8-Pin MSOP SOIC PDIP Package ◆ UL1577 and IEC61010-2001 Certified

Application/Performance example

For more details, please contact us.
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Address

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Business Activities

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Isolator - Company Ranking(10 companyies in total)

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