Notice of Participation in Internepcon Japan 2011

We are pleased to announce that we will be exhibiting at the 40th Internepcon Japan.
Dates: January 19 (Wednesday) - 21 (Friday), 2011
Venue: Tokyo Big Sight
Booth Number: 33-29
Enhancing productivity and contributing to improved operational efficiency!
We will showcase products that can be used for the storage, transportation, protection, and retention of a variety of semiconductors/electronic components, precision parts, jigs, and tools.
We will respond to a wide range of requests from research/development/evaluation departments to manufacturing/inspection processes and shipping.
As new products, we will display highly adhesive related products that make it easy to pick up (remove mounted items) for transporting fragile materials and ultra-thin precision parts, as well as wafer cases that enable the transportation of ultra-thin wafers through a unique cushioning mechanism.

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