"OCT-equipped heating observation imaging furnace" contributes to the world's first research! Direct observation of internal structural changes at high temperatures.

Minimize work inside the glove box ◎ Screening of solid electrolyte materials / Impedance evaluation by temperature characteristics ◎ Multiple uniform, short time, and accurate test evaluation

It excels in material screening of solid electrolytes and impedance evaluation according to temperature characteristics! ▼Features▼ 1. Reproduces various heating patterns of inorganic electrolyte heating and sintering processes in a short time. - Temperature can be adjusted with an accuracy of ±1°C within a temperature range of 50°C to 1200°C. - The heating rate is also a maximum of 300°C/min, allowing for various heating patterns to be tested in a short time even from room temperature. 2. Efficient simultaneous evaluation of impedance measurements for lithium-ion conductivity (conductivity). - Structure allows for heating with electrodes attached to the top and bottom of the coin cell. - The coin cell holder is prepared for 4 slots. - Uniform heating/measuring of 4 samples simultaneously under the same conditions. - Various coin cell diameters available from Φ20 to Φ8mm. 3. Simple operation and design that prevents exposure to the atmosphere / atmosphere control. - Work inside the glove box involves only setting the samples. - Inside the quartz tube, a quartz coin cell holder is maintained, and only the coin cell is accurately heated. - The completely sealed transparent quartz tube is heated from the outside using light heating. - Gas introduction systems and atmosphere control during heating are also easy to manage. Please contact us for more details.

• Secondary Cells/Batteries
• Lithium-ion battery
• Electric furnace

It is a compactly designed high-temperature heating observation device. It can be used on your microscope or micro-scope.

The IR-TPS is a high-temperature stage for microscopes that has been developed to achieve the contradictory goals of "high functionality and low cost." In addition to the standard configuration, advanced system equipment can be built with high-quality options. It can be used for research such as material analysis and quality control under precise temperature control in air, inert gas, or vacuum environments. 【Features】 ○ Uniform high-temperature heating of the sample at a speed of up to 1500°C within 60 seconds using infrared concentration ○ Energy-saving clean heating ○ Easy maintenance For more details, please contact us or refer to the catalog.

• Analytical Equipment and Devices

The "Mechanical Stitch Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without causing any thermal impact to the base material. Repairs can be carried out in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If a detailed technical explanation is needed, please contact us.

The "Mechanical Stitching Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without causing any thermal impact on the base material. Repairs can be carried out in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If a detailed technical explanation is needed, please contact us.

Features: ● Equipped with Intel Core Ultra 7 255H/7 155H/5 225H/5 125H ● LPDDR5x 16GB/32GB/64GB onboard ● M.2 NVMe 256GB onboard ● USB 2.0 x 8, USB 3.2 (10Gbps) x 4 ● PCIe Gen 4 [x8] x 1, PCIe Gen 3 [x1] x 4, PCIe Gen 3 [x4] x 1 (2 lanes co-lay with SATA; BOM option) ● 2.5GbE x 2 ● COM-HPC Mini standard, size 95mm x 70mm ● Optional items ECB-980A: Development carrier board HPC-ARHm-FAN01: CPU fan HPC-ARHm-HSP01: Heat spreader (Note: heat dissipation is required in the enclosure)

Features: ● Equipped with Jetson AGX Orin 32GB/64GB ● Gigabit LAN ×1, 10Gigabit LAN ×1 ● USB 3.2 Gen 2 (Type-A) ×4 ● DB-9 connector ×1 (for DIO 8 channels) ● DB-9 connector ×2 (supports RS-232/422/485: Rx/Tx/RTS/CTS) ● Jetpack 6.0.0 pre-installed

Features: ● Equipped with Intel Atom x7835RE/x7433RE ● LPDDR5x 8GB/16GB onboard ● eMMC 32GB/64GB onboard ● LVDS x 1, DDI x 1 ● USB 2.0 x 8, USB 3.2 Gen 2 x 2 ● PCIe x1 x 4 ● COMe Type 10 standard, 84mm x 55mm size ● Operating temperature -40 to 85℃ ● Optional items ECB-920A-0001: Development carrier board NANOCOM-ADN-FAN01: CPU fan NANOCOM-ADN-HSP01: Heat spreader (※ Heat dissipation is required in the enclosure)