Added OPC Copaseed SCP, a copper paste for electroless copper plating catalysts for printed electronics.

Newly developed copper paste "OPC Copashield SCP" for direct printing of electroless copper plating seed layers onto film.

With the evolution of IoT, various devices and gadgets are now connected to the network in addition to computers and smartphones. In particular, fields such as wearable devices and smart home appliances are expected to expand, and printed electronics, which directly print electrical circuits onto flexible materials, are attracting attention. Okuno Pharmaceutical Industry has developed a copper paste called "OPC Copaseed SCP," which can directly print a seed layer for electroless copper plating onto film, by merging the surface treatment and screen printing technologies cultivated over many years as a technology in harmony with the environment. Currently, the subtractive method using single-sided copper-clad laminates (Flexible Copper Clad Laminates; FCCL) is the mainstream for manufacturing flexible printed circuit boards. Subtractive means subtraction in English, and it forms circuits by etching away unnecessary parts from the copper foil. Our company has developed a screen printing copper paste "OPC Copaseed SCP" and an electroless copper plating solution "OPC Copper HFS" for printed electronics. This process enables the reduction of environmental impact and improvement of productivity.

• Chemicals

Features ● Equipped with Intel Core Ultra 5 125H ● Dual Channel DDR5 5600MHz × 2 slots (up to 96GB) (sold separately) ● HDMI 2.0 × 4 ● M.2 3042/3052 B-Key × 1, 2230 E-Key × 1, 2280 M-Key × 1 (PCIe Gen4 [x4], NVMe) (sold separately) ● USB 2.0 × 5, USB 3.2 × 3, USB 3.2 Gen 1 (Type-C) × 1 ● LAN × 2 ● 12V DC input power ● OOB (Out-of-Band Management) module compatible: MOD-RMB (via i210-AT) * This model does not include memory, storage, or OS.

Features ● Compatible with Intel Core Ultra 200S series ● DDR5 SODIMM x 2 (up to 96GB) ● PCIe x4 x 1, M.2 3042/52 B-key x 1 ● USB2.0 x 4, USB3.2 Gen2 x 2 (rear I/O), USB3.2 Gen1 x 1, USB2.0 x 1 (pin header) ● SATA 6Gb/s x 2 ● HDMI 2.0 x 2, DP 1.4 x 1 ● DC input 19V ~ 24V * This model does not include memory, storage, or OS.

Features ● Equipped with Intel Processor N97 ● DDR5 SODIMM up to 16GB (sold separately) ● M.2 2280 M-Key x 1 (Auto Detect, PCIe [x1] & SATA Mode), M.2 2230 E-Key x 1, M.2 3042/52 B-Key x 1 ● USB3.2 x 1 (rear I/O), USB2.0 x 4 (pin header) ● PoE x 1, GbE LAN x 1 ● 12V DC input ● OOB onboard * This model does not include memory, storage, or OS.

● This is a leak testing device for small electronic components that does not use fluorinated inert liquids (PFAS-free). ● There is no longer a need for unstable visual confirmation through liquid immersion testing. It adopts a quantitative testing method that allows for stable pressure leak testing. ● It is a tabletop leak testing device specifically for gross leaks, with accuracy equal to or greater than that of liquid immersion testing. ● The detectable range is approximately 1×10⁻² Pa·m³/s to 1×10⁻⁶ Pa·m³/s (varies depending on the target product). ● It is suitable for sealed structures ranging from a few millimeters to a maximum of 80 × 70 mm. Please feel free to contact us for more information!

The "Mechanical Stitch Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without causing any thermal impact to the base material. Repairs can be carried out in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If a detailed technical explanation is needed, please contact us.