奥野製薬工業 Company Profile

Our company will exhibit at SURTECH 2025 (Surface Technology Elements Exhibition) held at Tokyo Big Sight from January 29 (Wednesday) to January 31 (Friday), 2025. Okuno Pharmaceutical Industry will introduce the UBM formation process for aluminum electrodes on wafers for semiconductor back-end processes. We will also showcase surface treatment and plating technologies that support various industries, including crack suppressants for aluminum anodizing, non-stick and anti-fouling coatings free of organic fluorine compounds (PFAS), and long-lasting, high-speed electroless nickel plating solutions. Our booth location is in East Hall 3, 【3U-09】. You can view the overview of our exhibited products from the related link. All of our staff sincerely look forward to your visit.

Our company will be exhibiting at the 26th Semiconductor and Sensor Packaging Exhibition / Semiconductor Backend Process Specialty Show (ISP), which will be held at Tokyo Big Sight from January 22 (Wednesday) to January 24 (Friday), 2025. Under the theme of "OKUNO contributing to the development of printed circuit boards and semiconductor package substrates," we will showcase plating chemicals and plating equipment for semiconductor backend processes, semiconductor package substrates, plating chemicals and processes for flexible substrates and glass substrates, as well as the latest surface treatments for power devices. Our booth location is E63-62 in East Hall 7. You can view the summary of our exhibited products from the related link. All of our staff sincerely look forward to your visit.

Our company will exhibit at Chemical Material Japan 2024, which will be held at Tokyo Big Sight from November 21 (Thursday) to November 22 (Friday). Okuno Pharmaceutical Industry will showcase numerous new products from three divisions: surface treatment, inorganic materials, and food, so please stop by. Our booth location is South Exhibition Hall 1 & 2 [C-11]. Contents: Surface treatment technology for xEVs - UBM formation process for aluminum electrodes on wafers - Lithium dendrite growth suppressants - High insulation and corrosion-resistant coatings for magnetic powders - Bio-template technology using microalgae with microcoils OKUNO's commitment to zero emissions - Plating technology using recycled materials Dissimilar material bonding - High-reliability granular copper plating chemicals that achieve high adhesion with sealing resins Improving the reliability of electronic components - Glass materials for electronic devices, such as glass powders, glass frits, and glass pastes Coatings that ensure safety and security - Coatings for food utensils that are free of fluorinated compounds and comply with the positive list system - 100% food-grade raw material antibacterial and virus removal coatings