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  6. Notice of Participation in the 26th Semiconductor and Sensor Packaging Exhibition

Notice of Participation in the 26th Semiconductor and Sensor Packaging Exhibition

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last updated:Dec 18, 2024

奥野製薬工業 大阪・放出、東京、名古屋など
奥野製薬工業 大阪・放出、東京、名古屋など
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We propose a new technology to solve your problems related to surface treatment for printed circuit boards and semiconductor package substrates.

Okuno Pharmaceutical Industry will exhibit at the 26th Semiconductor and Sensor Packaging Exhibition / Specialized Exhibition for Semiconductor Backend Processes (ISP), which will be held at Tokyo Big Sight from January 22 (Wednesday) to January 24 (Friday), 2025. Under the theme of "OKUNO," which contributes to the development of printed circuit boards and semiconductor package substrates, we will showcase a variety of products including plating chemicals and plating equipment for semiconductor backend processes, semiconductor package substrates, flexible substrates, plating chemicals and processes for glass substrates, and surface treatment for power devices. We invite you to visit our booth at Tokyo Big Sight, East Hall 7, E63-62. You can view an overview of the exhibited products from the related link. 【Exhibition Information】 ■ Dates: January 22 (Wednesday) to 24 (Friday), 2025 ■ Location: Tokyo Big Sight (East Hall) ■ Booth Number: E63-62 *For more details, please refer to the related link or download the catalog of related products.

    Printed Circuit Board
OKUNO.PNG

Notice of Participation in the 26th Semiconductor and Sensor Packaging Exhibition

OKUNO.PNG
OKUNO.PNG
  • Related Link - https://www.okuno.co.jp/news/241224_10.html

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catalog(8)

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Electroless plating equipment for UBM formation for wafers

Electroless plating equipment for UBM formation for wafers

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Aluminum electrode UBM formation on wafer - plating process

Aluminum electrode UBM formation on wafer - plating process

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Electroless plating process for insulation circuit boards for power semiconductors.

Electroless plating process for insulation circuit boards for power semiconductors.

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Copper sulfate plating additive for wafers - TORYZA LCN series

Copper sulfate plating additive for wafers - TORYZA LCN series

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OPC FLET Process: A High-Connection Reliability Electroless Copper Plating Process to Solve Weak Micro Vias

OPC FLET Process: A High-Connection Reliability Electroless Copper Plating Process to Solve Weak Micro Vias

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Electroless nickel-boron plating process on metal ink circuits on sintered substrates - Top FCP process

Electroless nickel-boron plating process on metal ink circuits on sintered substrates - Top FCP process

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Fine pattern compatible high joint reliability - electroless nickel/gold plating process.

Fine pattern compatible high joint reliability - electroless nickel/gold plating process.

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High-reliability granular copper plating additive Top Cluster AR that achieves high adhesion with sealing resin.

High-reliability granular copper plating additive Top Cluster AR that achieves high adhesion with sealing resin.

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News about this product(1)

We will exhibit at the 26th Semiconductor and Sensor Packaging Exhibition.

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Our company will be exhibiting at the 26th Semiconductor and Sensor Packaging Exhibition / Semiconductor Backend Process Specialty Show (ISP), which will be held at Tokyo Big Sight from January 22 (Wednesday) to January 24 (Friday), 2025. Under the theme of "OKUNO contributing to the development of printed circuit boards and semiconductor package substrates," we will showcase plating chemicals and plating equipment for semiconductor backend processes, semiconductor package substrates, plating chemicals and processes for flexible substrates and glass substrates, as well as the latest surface treatments for power devices. Our booth location is E63-62 in East Hall 7. You can view the summary of our exhibited products from the related link. All of our staff sincerely look forward to your visit.

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奥野製薬工業

奥野製薬工業 大阪・放出、東京、名古屋など

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Our company is a research and development-oriented enterprise that supports global manufacturing through science in the fields of surface treatment, inorganic materials, and food. 【Surface Treatment Division】 - We launched a new brand of surface treatment chemicals for semiconductor back-end processes called "TORYZA," offering various plating chemicals and equipment such as copper plating additives for ultra-fine wiring and electroless plating processes for UBM formation. - We propose surface treatment chemicals for plastic plating that provide high added value, such as beautiful metallic appearance, luxury feel, and antibacterial and antiviral properties. - We offer process chemicals for anodizing and dyeing aluminum alloys that beautifully enhance the appearance of casings for smartphones and other devices. We also have environmentally friendly processes and surface treatment chemicals for antibacterial and antiviral applications in our lineup. - We provide electroless nickel plating chemicals and various environmentally friendly products, including low-temperature and long-life types, that impart new functions to materials, such as corrosion resistance, wear resistance, and lubricity. 【Inorganic Materials Division】 Total production from design, processing, to mass production of glass. Contributing to the enhancement of design and functionality with high-quality glass materials. 【Food Division】 Bringing "deliciousness" and "safety" to the dining table. Challenging the development of high-function products composed of food ingredients.

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