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  6. Introduction of plating chemicals for printed circuit boards / semiconductor package substrates.

Introduction of plating chemicals for printed circuit boards / semiconductor package substrates.

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last updated:May 13, 2025

奥野製薬工業 大阪・放出、東京、名古屋など
奥野製薬工業 大阪・放出、東京、名古屋など
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[JPCA Show 2025] Advanced surface treatment chemicals for glass plating processes and semiconductor backend processes/power modules.

Our company will be exhibiting at the JPCA Show 2025, which will be held at Tokyo Big Sight from June 4 (Wednesday) to June 6 (Friday), 2025. We will showcase surface treatment chemicals and process technologies that contribute to the high performance and multifunctionality of printed circuit boards and semiconductor package substrates, including the plating process for glass, which is expected to be the next-generation package substrate. As a comprehensive manufacturer of surface treatment chemicals, we will provide total solutions for plating chemicals, plating equipment, and surface treatment processes specifically for the back-end of semiconductor manufacturing. We invite you to visit our booth in East Hall 7, [7D-01]. Additionally, during the NPI presentation, we will give a talk on "High Aspect Ratio Through-Hole Filling Copper Sulfate Plating Additive Topluchina GCS for Glass Core Substrates" on June 5, 2025, from 10:30 to 10:50 at the NPI Presentation Venue D in East Hall 6. Okuno Pharmaceutical Industry will continue to solve any issues related to surface treatment in the electronics field. You can view the overview of our exhibited products below. *For more details, please refer to the related links or feel free to contact us.

    Plating EquipmentChemicals
JPCA+Show(日本語版).png

Introduction of plating chemicals for printed circuit boards / semiconductor package substrates.

JPCA+Show(日本語版).png
JPCA+Show(日本語版).png
  • Related Link - https://www.okuno.co.jp/news/250508_10.html

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catalog(9)

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Aluminum electrode UBM formation on wafer - plating process

Aluminum electrode UBM formation on wafer - plating process

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Electroless plating equipment for UBM formation for wafers

Electroless plating equipment for UBM formation for wafers

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Copper sulfate plating additive for wafers - TORYZA LCN series

Copper sulfate plating additive for wafers - TORYZA LCN series

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Electroless plating process for insulated circuit boards for power modules.

Electroless plating process for insulated circuit boards for power modules.

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High connection reliability electroless copper plating process for solving weak micro vias - OPC FLET process.

High connection reliability electroless copper plating process for solving weak micro vias - OPC FLET process.

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High current fine pattern via filling copper sulfate plating additive; large diameter via compatible copper sulfate plating additive.

High current fine pattern via filling copper sulfate plating additive; large diameter via compatible copper sulfate plating additive.

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High-reliability granular copper plating additive Top Cluster AR that achieves high adhesion with sealing resin.

High-reliability granular copper plating additive Top Cluster AR that achieves high adhesion with sealing resin.

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Fine pattern compatible high joint reliability - electroless nickel/gold plating process.

Fine pattern compatible high joint reliability - electroless nickel/gold plating process.

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Glass materials that are optimal for the formation of electrode protective films, sintering aids for ceramics and powdered metals, and the sealing and encapsulation of electronic components.

Glass materials that are optimal for the formation of electrode protective films, sintering aids for ceramics and powdered metals, and the sealing and encapsulation of electronic components.

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奥野製薬工業

奥野製薬工業 大阪・放出、東京、名古屋など

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Our company is a research and development-oriented enterprise that supports global manufacturing through science in the fields of surface treatment, inorganic materials, and food. 【Surface Treatment Division】 - We launched a new brand of surface treatment chemicals for semiconductor back-end processes called "TORYZA," offering various plating chemicals and equipment such as copper plating additives for ultra-fine wiring and electroless plating processes for UBM formation. - We propose surface treatment chemicals for plastic plating that provide high added value, such as beautiful metallic appearance, luxury feel, and antibacterial and antiviral properties. - We offer process chemicals for anodizing and dyeing aluminum alloys that beautifully enhance the appearance of casings for smartphones and other devices. We also have environmentally friendly processes and surface treatment chemicals for antibacterial and antiviral applications in our lineup. - We provide electroless nickel plating chemicals and various environmentally friendly products, including low-temperature and long-life types, that impart new functions to materials, such as corrosion resistance, wear resistance, and lubricity. 【Inorganic Materials Division】 Total production from design, processing, to mass production of glass. Contributing to the enhancement of design and functionality with high-quality glass materials. 【Food Division】 Bringing "deliciousness" and "safety" to the dining table. Challenging the development of high-function products composed of food ingredients.

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