We will exhibit at the 26th Semiconductor and Sensor Packaging Exhibition.

Our company will be exhibiting at the 26th Semiconductor and Sensor Packaging Exhibition / Semiconductor Backend Process Specialty Show (ISP), which will be held at Tokyo Big Sight from January 22 (Wednesday) to January 24 (Friday), 2025.
Under the theme of "OKUNO contributing to the development of printed circuit boards and semiconductor package substrates," we will showcase plating chemicals and plating equipment for semiconductor backend processes, semiconductor package substrates, plating chemicals and processes for flexible substrates and glass substrates, as well as the latest surface treatments for power devices. Our booth location is E63-62 in East Hall 7.
You can view the summary of our exhibited products from the related link. All of our staff sincerely look forward to your visit.

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