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  1. Home
  2. Chemical
  3. 奥野製薬工業 大阪・放出、東京、名古屋など
  4. We will exhibit at Chemical Material Japan 2024.
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  • Oct 16, 2024
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Oct 16, 2024

We will exhibit at Chemical Material Japan 2024.

奥野製薬工業 奥野製薬工業 大阪・放出、東京、名古屋など
Our company will exhibit at Chemical Material Japan 2024, which will be held at Tokyo Big Sight from November 21 (Thursday) to November 22 (Friday). Okuno Pharmaceutical Industry will showcase numerous new products from three divisions: surface treatment, inorganic materials, and food, so please stop by. Our booth location is South Exhibition Hall 1 & 2 [C-11]. Contents: Surface treatment technology for xEVs - UBM formation process for aluminum electrodes on wafers - Lithium dendrite growth suppressants - High insulation and corrosion-resistant coatings for magnetic powders - Bio-template technology using microalgae with microcoils OKUNO's commitment to zero emissions - Plating technology using recycled materials Dissimilar material bonding - High-reliability granular copper plating chemicals that achieve high adhesion with sealing resins Improving the reliability of electronic components - Glass materials for electronic devices, such as glass powders, glass frits, and glass pastes Coatings that ensure safety and security - Coatings for food utensils that are free of fluorinated compounds and comply with the positive list system - 100% food-grade raw material antibacterial and virus removal coatings
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Chemical Materials Japan 2024 | News | Okuno Pharmaceutical Industry Co., Ltd.
Our company will exhibit at Chemical Materials Japan 2024, which will be held at Tokyo Big Sight from November 21 (Thursday) to November 22 (Friday), 2024. Okuno Pharmaceutical Industry will showcase numerous new products related to various industries from our three divisions: surface treatment, inorganic materials, and food. We look forward to your visit.

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Fluorine compound-free food utensil coating agent

Coating agents for food utensils that conform to the positive list system, providing non-stick properties, dirt resistance, and water and oil repellency equivalent to general fluorine coatings.

Fluorine compound-free non-stick and anti-fouling coating agent Top Cerarelease FG-1, when applied by spray and subjected to heat treatment at 150°C, results in a transparent silica-based coating film. It has non-stick properties equivalent to those of conventional fluorine coatings and also excels in oil resistance and corrosion resistance. Composed of three components: a main agent, a curing agent, and a non-stick agent, it does not contain fluorine compounds, making it compliant with PFAS regulations. It is a highly safe product that also meets the positive list system established for food contact materials and packaging.

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Formation of aluminum electrode UBM on wafer, electroless plating equipment for UBM formation.

Plating chemicals, total proposals for surface treatment processes and equipment. UBM formation for power semiconductors, electroless plating process/plating equipment.

We have newly developed the "TORYZA EL PROCESS," an electroless plating process for forming UBM for power semiconductors that suppresses aluminum electrode delamination and localized corrosion, making it suitable for high-temperature applications. Additionally, leveraging the know-how gained as a surface treatment and plating chemical manufacturer, we have designed and developed the "TORYZA EL SYSTEM," an electroless plating equipment for UBM formation in collaboration with equipment manufacturers. We offer a comprehensive proposal that includes plating chemicals, surface treatment processes, and equipment.

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Silica coating agent: Protector PW-S

Coating agent specifically for powders, ideal for magnetic materials! High adhesion coating through liquid phase reaction! Achieves high corrosion resistance, rust prevention, and insulation!

Inorganic coatings using materials like glass excel in corrosion resistance and heat resistance, but they require heat treatment at temperatures above 500°C. Our silica-based coating agent, Protector PW-S, has solved this problem. Here’s what’s amazing! - Coating agent specifically for powder and magnetic materials - Simple process - Thickness can be increased by adjusting reaction time - Compatible with film thicknesses from 10 to 100 nm - We propose optimal processes and chemicals for various metals from pre-treatment to post-treatment - Excellent corrosion resistance, rust prevention, and insulation properties - Can form an extremely uniform coating Our specialized sales staff will propose tailored processes and chemicals according to your needs. We can also introduce you to contractors, so please feel free to contact us.

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  • Coating Agent

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High-reliability granular copper plating additive that achieves high adhesion to sealing resin.

Granular copper plating film for lead frames that contributes to the improvement of adhesion strength with sealing resin.

Power semiconductors that can operate in high-load environments are used in various fields such as industrial equipment, solar power generation, electric vehicles, communication devices, and energy conversion equipment. In recent years, as high voltage and high current capabilities have advanced, there is a growing need for packaging technologies that offer higher connection reliability. If the lead frame, which connects the semiconductor device and circuit, experiences delamination at the interface of the substrate resin under thermal load, it can lead to short circuits or disconnections. Our company has newly developed an additive that forms a granular copper plating to achieve high adhesion between the frame, coating, and mold resin.

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Glass powder and glass frit for electronic materials

We contribute to the development of new industries such as electronics and information technology! We develop high-performance glass and its processing technology to support a comfortable lifestyle!

At Okuno Pharmaceutical Industry, we aim to "challenge the impossible and foster creativity," and we widely supply high-functionality and high-performance glass materials, such as sintering aids used in electronic component electrodes and overcoats for electrode protection. Glass powder is the unsung hero, constantly supporting our comfortable lives all around us. For inquiries about the high functionality of glass powder and advanced processing technologies, please feel free to contact Okuno Pharmaceutical at any time.

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Related catalog(6)

Fluorine compound-free food utensil coating agent

Fluorine compound-free food utensil coating agent

PRODUCT
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Aluminum electrode on wafer UBM formation, electroless plating equipment for UBM formation for wafers.

Aluminum electrode on wafer UBM formation, electroless plating equipment for UBM formation for wafers.

PRODUCT
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Silica Coating Agent for Magnetic Powder: Protector PW-S

Silica Coating Agent for Magnetic Powder: Protector PW-S

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High-reliability granular copper plating additive Top Cluster AR that achieves high adhesion with sealing resin.

High-reliability granular copper plating additive Top Cluster AR that achieves high adhesion with sealing resin.

PRODUCT
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Glass powder and glass frit for electronic materials

Glass powder and glass frit for electronic materials

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Okuno Pharmaceutical Industry's latest technology for antibacterial and antiviral plating/coating.

Okuno Pharmaceutical Industry's latest technology for antibacterial and antiviral plating/coating.

TECHNICAL
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奥野製薬工業
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奥野製薬工業 大阪・放出、東京、名古屋など
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Aluminum casting repair: Metal crack repair without applying heat.

  • NEW
  • PRODUCT

The "Mechanical Stitching Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without causing any thermal impact on the base material. Repairs can be carried out in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If a detailed technical explanation is needed, please contact us.

May 14, 2026

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[Cast Prototype] 3D Printer Molding Prototype with Cast Sand Molds

  • NEW
  • PRODUCT

● The production time for casting prototypes can be shortened! Since model making is not required, the production time for prototypes, which previously took about a month, can be significantly reduced. ● Model costs can be reduced! By directly creating sand molds from 3D data, there is no need for model production costs. If changes to the model are necessary, they can be addressed by modifying the 3D data. ● Similar products with different shapes and dimensions can be prototyped simultaneously! Different products, such as similar shapes or variations in dimensions, can be created in a single molding process. This allows for the verification of multiple types in a short period.

May 14, 2026

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【Metal Crack Repair】We repair cracks in metal products without applying heat.

  • NEW
  • COMPANY

The "Mechanical Stitching Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without any thermal impact on the base material. Repairs can be conducted in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If a detailed technical explanation is required, please contact us.

May 14, 2026

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Metal Crack Repair: MS Method for Repairing Cracks and Fractures in Machinery Equipment

  • NEW
  • PRODUCT

Metal cracks are one of the concerns in equipment maintenance operations. Conventional welding repair methods can alter the base material around the crack due to heat, leading to residual stress and deformation, which always carries the risk of "crack recurrence" and "secondary damage." Hinode Water Supply Equipment Co., Ltd.'s "Mechanical Stitching Method" is a new technique that allows for the repair of metal cracks without applying heat. By using special bolts and reinforcement plates, the crack is physically removed without affecting the base material at all. Repairs can be made even in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. For more details, please contact us or download the catalog.

May 14, 2026

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HK-2

Recommended for earthquake measures for automatic doors and equipment! Seismic device HK-2.

  • NEW
  • PRODUCT

Japan is among the top 10 countries in the world with frequent earthquakes. The 2020 White Paper on Land, Infrastructure, Transport and Tourism has also reported an increase in the probability of significant earthquakes occurring. For the Nankai Trough earthquake, the probability of an earthquake with a magnitude of 8 to 9 occurring within the next 30 years is estimated to be 70 to 80%. At Hotron, we recommend the introduction of seismic devices for earthquake measures in buildings and equipment. The seismic device 'HK-2' is a product that automatically performs various controls that have been pre-set when it detects strong shaking equivalent to a seismic intensity of 5 lower or higher. For example, it can automatically execute actions such as: "Open automatic doors and gates to secure evacuation routes and access for emergency vehicles" "Transmit signals to the control room and stop facility equipment" "Unlock the keys to locked lockers" "Automatically play voice guidance" ◎ For more details, please download the materials or contact us.

May 14, 2026

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