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  1. Home
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  3. 奥野製薬工業 大阪・放出、東京、名古屋など
  4. We will exhibit at Chemical Material Japan 2024.
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  • Oct 16, 2024
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Oct 16, 2024

We will exhibit at Chemical Material Japan 2024.

奥野製薬工業 奥野製薬工業 大阪・放出、東京、名古屋など
Our company will exhibit at Chemical Material Japan 2024, which will be held at Tokyo Big Sight from November 21 (Thursday) to November 22 (Friday). Okuno Pharmaceutical Industry will showcase numerous new products from three divisions: surface treatment, inorganic materials, and food, so please stop by. Our booth location is South Exhibition Hall 1 & 2 [C-11]. Contents: Surface treatment technology for xEVs - UBM formation process for aluminum electrodes on wafers - Lithium dendrite growth suppressants - High insulation and corrosion-resistant coatings for magnetic powders - Bio-template technology using microalgae with microcoils OKUNO's commitment to zero emissions - Plating technology using recycled materials Dissimilar material bonding - High-reliability granular copper plating chemicals that achieve high adhesion with sealing resins Improving the reliability of electronic components - Glass materials for electronic devices, such as glass powders, glass frits, and glass pastes Coatings that ensure safety and security - Coatings for food utensils that are free of fluorinated compounds and comply with the positive list system - 100% food-grade raw material antibacterial and virus removal coatings
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Chemical Materials Japan 2024 | News | Okuno Pharmaceutical Industry Co., Ltd.
Our company will exhibit at Chemical Materials Japan 2024, which will be held at Tokyo Big Sight from November 21 (Thursday) to November 22 (Friday), 2024. Okuno Pharmaceutical Industry will showcase numerous new products related to various industries from our three divisions: surface treatment, inorganic materials, and food. We look forward to your visit.

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Fluorine compound-free food utensil coating agent

Coating agents for food utensils that conform to the positive list system, providing non-stick properties, dirt resistance, and water and oil repellency equivalent to general fluorine coatings.

Fluorine compound-free non-stick and anti-fouling coating agent Top Cerarelease FG-1, when applied by spray and subjected to heat treatment at 150°C, results in a transparent silica-based coating film. It has non-stick properties equivalent to those of conventional fluorine coatings and also excels in oil resistance and corrosion resistance. Composed of three components: a main agent, a curing agent, and a non-stick agent, it does not contain fluorine compounds, making it compliant with PFAS regulations. It is a highly safe product that also meets the positive list system established for food contact materials and packaging.

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Formation of aluminum electrode UBM on wafer, electroless plating equipment for UBM formation.

Plating chemicals, total proposals for surface treatment processes and equipment. UBM formation for power semiconductors, electroless plating process/plating equipment.

We have newly developed the "TORYZA EL PROCESS," an electroless plating process for forming UBM for power semiconductors that suppresses aluminum electrode delamination and localized corrosion, making it suitable for high-temperature applications. Additionally, leveraging the know-how gained as a surface treatment and plating chemical manufacturer, we have designed and developed the "TORYZA EL SYSTEM," an electroless plating equipment for UBM formation in collaboration with equipment manufacturers. We offer a comprehensive proposal that includes plating chemicals, surface treatment processes, and equipment.

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Silica coating agent: Protector PW-S

Coating agent specifically for powders, ideal for magnetic materials! High adhesion coating through liquid phase reaction! Achieves high corrosion resistance, rust prevention, and insulation!

Inorganic coatings using materials like glass excel in corrosion resistance and heat resistance, but they require heat treatment at temperatures above 500°C. Our silica-based coating agent, Protector PW-S, has solved this problem. Here’s what’s amazing! - Coating agent specifically for powder and magnetic materials - Simple process - Thickness can be increased by adjusting reaction time - Compatible with film thicknesses from 10 to 100 nm - We propose optimal processes and chemicals for various metals from pre-treatment to post-treatment - Excellent corrosion resistance, rust prevention, and insulation properties - Can form an extremely uniform coating Our specialized sales staff will propose tailored processes and chemicals according to your needs. We can also introduce you to contractors, so please feel free to contact us.

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High-reliability granular copper plating additive that achieves high adhesion to sealing resin.

Granular copper plating film for lead frames that contributes to the improvement of adhesion strength with sealing resin.

Power semiconductors that can operate in high-load environments are used in various fields such as industrial equipment, solar power generation, electric vehicles, communication devices, and energy conversion equipment. In recent years, as high voltage and high current capabilities have advanced, there is a growing need for packaging technologies that offer higher connection reliability. If the lead frame, which connects the semiconductor device and circuit, experiences delamination at the interface of the substrate resin under thermal load, it can lead to short circuits or disconnections. Our company has newly developed an additive that forms a granular copper plating to achieve high adhesion between the frame, coating, and mold resin.

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Glass powder and glass frit for electronic materials

We contribute to the development of new industries such as electronics and information technology! We develop high-performance glass and its processing technology to support a comfortable lifestyle!

At Okuno Pharmaceutical Industry, we aim to "challenge the impossible and foster creativity," and we widely supply high-functionality and high-performance glass materials, such as sintering aids used in electronic component electrodes and overcoats for electrode protection. Glass powder is the unsung hero, constantly supporting our comfortable lives all around us. For inquiries about the high functionality of glass powder and advanced processing technologies, please feel free to contact Okuno Pharmaceutical at any time.

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Related catalog(6)

Fluorine compound-free food utensil coating agent

Fluorine compound-free food utensil coating agent

PRODUCT
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Aluminum electrode on wafer UBM formation, electroless plating equipment for UBM formation for wafers.

Aluminum electrode on wafer UBM formation, electroless plating equipment for UBM formation for wafers.

PRODUCT
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Silica Coating Agent for Magnetic Powder: Protector PW-S

Silica Coating Agent for Magnetic Powder: Protector PW-S

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High-reliability granular copper plating additive Top Cluster AR that achieves high adhesion with sealing resin.

High-reliability granular copper plating additive Top Cluster AR that achieves high adhesion with sealing resin.

PRODUCT
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Glass powder and glass frit for electronic materials

Glass powder and glass frit for electronic materials

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Okuno Pharmaceutical Industry's latest technology for antibacterial and antiviral plating/coating.

Okuno Pharmaceutical Industry's latest technology for antibacterial and antiviral plating/coating.

TECHNICAL
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奥野製薬工業
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奥野製薬工業 大阪・放出、東京、名古屋など
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AAEON Industrial 3.5-inch Standard CPU Board with Intel Core Ultra5/7 Series Processor 【GENE-MTH6】

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Features: ● Equipped with Intel Core Ultra 5 125H/Ultra 7 155H・155U ● DDR5 5600MHz SO-DIMM x2 slots (up to 96GB) (sold separately) ● LVDS x1, eDP x1, DP x1, HDMI x1 ● LAN x3, SATA 6Gb/s x1, 8-bit GPIO ● USB 3.2 Gen2 x2, USB 2.0 x4 ● M.2 2280 M-Key x1 (PCIe 4.0 [x4]/SATA), M.2 3052 B-Key x1, M.2 2230 E-Key x1 ● DC 9~36V input * Heat spreader and fan-equipped heat sink sold separately GENE-MTH6-FAN: Fan-equipped heat sink GENE-MTH6-HSP: Heat spreader * Memory, storage, and OS are sold separately.

Sep 25, 2025

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AAEON Industrial 3.5-inch Standard CPU Board with Intel Alder Lake-N Series【GENE-ADN5】

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Features: ● Equipped with Intel Core i3-N305 / Processor N97 ● DDR5 4800MHz SO-DIMM x1 slot (up to 16GB) (sold separately) ● LVDS Dual Channel 18/24 bit x1, VGA x1, HDMI x1 ● Intel 2.5GbE x2, SATA 6Gb/s x1, 8bit GPIO ● USB 3.2 Gen2 x2, USB 2.0 x4 ● Full size mPCIe/mSATA ● M.2 3052 B-Key x1, M.2 2230 E-Key x1 ● DC 9~36V input * Heatsink included * Memory, storage, and OS sold separately

Sep 25, 2025

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AAEON Intel Core Ultra7 255H/5 225H equipped 3.5-inch standard industrial CPU board [GENE-ARH6]

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  • PRODUCT

Features: ● Equipped with Intel Core Ultra 5 225H/7 255H (Arrow Lake) ● DDR5 6400MHz dual-channel SODIMM x 2 (up to 96GB) (sold separately) ● LVDS x 1, eDP x 1, HDMI x 1 ● LAN x 3, SATA 6Gb/s x 1, 8-bit GPIO ● USB 3.2 Gen2 x 2, USB 2.0 x 4 ● M.2 2280 M-key x 1, M.2 3052 B-key x 1, M.2 2230 E-key x 1 ● Supports DC input of 9 to 36V ● Fan-equipped heat sink available separately GENE-MTH6-FAN: Heat sink with fan GENE-MTH6-HSP: Heat spreader (requires heat dissipation in the enclosure) * This model does not include OS/memory/storage.

Sep 25, 2025

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Proposal for replacing the electric pump with an ejector

[Product Introduction Case Study] "Proposal for Replacing Electric Pumps with Ejectors"

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  • PRODUCT

Ejectors tend to be avoided due to their enormous consumption of compressed air. However, they also have many advantages, such as noise reduction, no heat generation, and no vibrations. When used properly, they can also achieve energy savings. ■ Space-saving, noise reduction, and heat prevention! Goodbye, electric pumps Large ejectors are ideal for replacing electric pumps. Their impact is significant and greatly contributes to improving the environment in manufacturing sites. Moreover, maintenance can be done without tools. For more details, visit: https://www.ipros.jp/catalog/detail/718575

Sep 25, 2025

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【Casting Prototype Metal Cracking】We repair cracks in metal products without applying heat.

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  • PRODUCT

The "Mechanical Stitching Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed without causing any thermal impact on the base material. Repairs can be made even in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If a detailed technical explanation is needed, please contact us.

Sep 25, 2025

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  • PFAS規制に対応 PFASフリー コーティング剤 ・潤滑性を付与 摩擦低減、耐摩耗性向上 ・離型性を付与 撥水・撥油性、非粘着 など、多様の用途で提案が可能 素材は、金属・プラスチック・ゴムなど問いません!
  • 3Dデータ活用WEBセミナー iCAD Technical Fair 10th 人手不足を解消! 設計製造DXの取組 最新3D活用を徹底解説 設計リードタイム1/2!生産性の向上 60日間で実現した2D→3D設計移行 1つのデータを全部門で使い倒す!
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