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  6. High-reliability granular copper plating additive that achieves high adhesion to sealing resin.

High-reliability granular copper plating additive that achieves high adhesion to sealing resin.

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last updated:Jul 25, 2024

奥野製薬工業 大阪・放出、東京、名古屋など
奥野製薬工業 大阪・放出、東京、名古屋など
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Granular copper plating film for lead frames that contributes to the improvement of adhesion strength with sealing resin.

Power semiconductors that can operate in high-load environments are used in various fields such as industrial equipment, solar power generation, electric vehicles, communication devices, and energy conversion equipment. In recent years, as high voltage and high current capabilities have advanced, there is a growing need for packaging technologies that offer higher connection reliability. If the lead frame, which connects the semiconductor device and circuit, experiences delamination at the interface of the substrate resin under thermal load, it can lead to short circuits or disconnections. Our company has newly developed an additive that forms a granular copper plating to achieve high adhesion between the frame, coating, and mold resin.

    Chemicals
20240723_9.png

High-reliability granular copper plating additive that achieves high adhesion to sealing resin.

20240723_9.png
20240723_9.png

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basic information

We are developing various plating and surface treatment chemicals and high-performance products for automobiles, electric vehicles, home appliances, and various electronics, so please feel free to contact us.

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Applications/Examples of results

Printed circuit board, printed wiring board, circuit formation, semiconductor wafer.

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High-reliability granular copper plating additive Top Cluster AR that achieves high adhesion with sealing resin.

High-reliability granular copper plating additive Top Cluster AR that achieves high adhesion with sealing resin.

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We will exhibit at Chemical Material Japan 2024.

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Our company will exhibit at Chemical Material Japan 2024, which will be held at Tokyo Big Sight from November 21 (Thursday) to November 22 (Friday). Okuno Pharmaceutical Industry will showcase numerous new products from three divisions: surface treatment, inorganic materials, and food, so please stop by. Our booth location is South Exhibition Hall 1 & 2 [C-11]. Contents: Surface treatment technology for xEVs - UBM formation process for aluminum electrodes on wafers - Lithium dendrite growth suppressants - High insulation and corrosion-resistant coatings for magnetic powders - Bio-template technology using microalgae with microcoils OKUNO's commitment to zero emissions - Plating technology using recycled materials Dissimilar material bonding - High-reliability granular copper plating chemicals that achieve high adhesion with sealing resins Improving the reliability of electronic components - Glass materials for electronic devices, such as glass powders, glass frits, and glass pastes Coatings that ensure safety and security - Coatings for food utensils that are free of fluorinated compounds and comply with the positive list system - 100% food-grade raw material antibacterial and virus removal coatings

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奥野製薬工業

奥野製薬工業 大阪・放出、東京、名古屋など

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Our company is a research and development-oriented enterprise that supports global manufacturing through science in the fields of surface treatment, inorganic materials, and food. 【Surface Treatment Division】 - We launched a new brand of surface treatment chemicals for semiconductor back-end processes called "TORYZA," offering various plating chemicals and equipment such as copper plating additives for ultra-fine wiring and electroless plating processes for UBM formation. - We propose surface treatment chemicals for plastic plating that provide high added value, such as beautiful metallic appearance, luxury feel, and antibacterial and antiviral properties. - We offer process chemicals for anodizing and dyeing aluminum alloys that beautifully enhance the appearance of casings for smartphones and other devices. We also have environmentally friendly processes and surface treatment chemicals for antibacterial and antiviral applications in our lineup. - We provide electroless nickel plating chemicals and various environmentally friendly products, including low-temperature and long-life types, that impart new functions to materials, such as corrosion resistance, wear resistance, and lubricity. 【Inorganic Materials Division】 Total production from design, processing, to mass production of glass. Contributing to the enhancement of design and functionality with high-quality glass materials. 【Food Division】 Bringing "deliciousness" and "safety" to the dining table. Challenging the development of high-function products composed of food ingredients.

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