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  6. Copper plating additive for high aspect ratio substrates "Topluchina HLS"

Copper plating additive for high aspect ratio substrates "Topluchina HLS"

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last updated:Mar 02, 2023

奥野製薬工業 大阪・放出、東京、名古屋など
奥野製薬工業 大阪・放出、東京、名古屋など
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Copper sulfate plating additive for high aspect ratio substrates for package substrates "Topluchina HLS"

This is the latest plating technology for semiconductor package substrates (IC substrates). Currently, electronic devices such as smartphones, computers, and servers are becoming more high-performance, leading to a reduction in the diameter of through-holes that electrically connect the layers of printed circuit boards, as well as a decrease in pitch. As a result, there is an advancement in the high aspect ratio and high density of through-holes. We have newly developed a copper sulfate plating additive for high aspect ratio substrates that can accommodate both soluble and insoluble anodes, aimed at improving the productivity and quality stability of printed circuit board production. This product excels in depositability within through-holes and vias, achieving high throwing power across a wide range of current densities.

    Chemicals
20230302-1.PNG

Copper plating additive for high aspect ratio substrates "Topluchina HLS"

20230302-1.PNG
20230302-1.PNG
  • Related Link - https://www.okuno.co.jp/product/mf/

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We are developing various plating and surface treatment chemicals and high-performance products for automobiles, electric vehicles, home appliances, and various electronics, so please feel free to contact us.

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Automobiles, electronic devices

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Copper sulfate plating additive for high aspect ratio boards for package substrates "Topluchina HLS"

Copper sulfate plating additive for high aspect ratio boards for package substrates "Topluchina HLS"

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A comprehensive unveiling of new plating chemicals related to semiconductors and environmental compliance!

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This is Yamanaka from the Marketing Strategy Department of Okuno Pharmaceutical Industry. We have just released new product information for printed circuit boards/semiconductor package substrates, environmentally friendly electroless nickel plating chemicals, and various surface treatment chemicals all at once. 【New Product Information】 Void-free final surface treatment using a reducing cobalt catalyst solution, ICP-COA process https://www.ipros.jp/catalog/detail/694141?hub=60+794925 Plating technology for package substrates: Copper sulfate plating additive "Toprutina HLS" for high aspect ratio substrates https://www.ipros.jp/catalog/detail/694132?hub=60+794925 Contributes to productivity improvement. Electroless nickel plating solution usable for up to 20 turns https://www.ipros.jp/catalog/detail/694071?hub=60+794925 Okuno Pharmaceutical Industry will continue to contribute to future manufacturing through science to solve the challenges facing our planet. Please feel free to consult us about any issues related to surface treatment and plating.

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奥野製薬工業

奥野製薬工業 大阪・放出、東京、名古屋など

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Our company is a research and development-oriented enterprise that supports global manufacturing through science in the fields of surface treatment, inorganic materials, and food. 【Surface Treatment Division】 - We launched a new brand of surface treatment chemicals for semiconductor back-end processes called "TORYZA," offering various plating chemicals and equipment such as copper plating additives for ultra-fine wiring and electroless plating processes for UBM formation. - We propose surface treatment chemicals for plastic plating that provide high added value, such as beautiful metallic appearance, luxury feel, and antibacterial and antiviral properties. - We offer process chemicals for anodizing and dyeing aluminum alloys that beautifully enhance the appearance of casings for smartphones and other devices. We also have environmentally friendly processes and surface treatment chemicals for antibacterial and antiviral applications in our lineup. - We provide electroless nickel plating chemicals and various environmentally friendly products, including low-temperature and long-life types, that impart new functions to materials, such as corrosion resistance, wear resistance, and lubricity. 【Inorganic Materials Division】 Total production from design, processing, to mass production of glass. Contributing to the enhancement of design and functionality with high-quality glass materials. 【Food Division】 Bringing "deliciousness" and "safety" to the dining table. Challenging the development of high-function products composed of food ingredients.

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