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  1. Home
  2. Chemical
  3. 奥野製薬工業 大阪・放出、東京、名古屋など
  4. A comprehensive unveiling of new plating chemicals related to semiconductors and environmental compliance!
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  • Mar 02, 2023
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Mar 02, 2023

A comprehensive unveiling of new plating chemicals related to semiconductors and environmental compliance!

奥野製薬工業 奥野製薬工業 大阪・放出、東京、名古屋など
This is Yamanaka from the Marketing Strategy Department of Okuno Pharmaceutical Industry. We have just released new product information for printed circuit boards/semiconductor package substrates, environmentally friendly electroless nickel plating chemicals, and various surface treatment chemicals all at once. 【New Product Information】 Void-free final surface treatment using a reducing cobalt catalyst solution, ICP-COA process https://www.ipros.jp/catalog/detail/694141?hub=60+794925 Plating technology for package substrates: Copper sulfate plating additive "Toprutina HLS" for high aspect ratio substrates https://www.ipros.jp/catalog/detail/694132?hub=60+794925 Contributes to productivity improvement. Electroless nickel plating solution usable for up to 20 turns https://www.ipros.jp/catalog/detail/694071?hub=60+794925 Okuno Pharmaceutical Industry will continue to contribute to future manufacturing through science to solve the challenges facing our planet. Please feel free to consult us about any issues related to surface treatment and plating.
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Void-free final surface treatment, ICP-COA process

Okuno Pharmaceutical Industry has established a final surface treatment process that forms a void-free and uniform plating film on the circuit surface.

Okuno Pharmaceutical Industry has established a final surface treatment process that forms a void-free and uniform plating film on circuit surfaces. The "ICP-COA process" is a low film thickness Ni-P/Au plating process that utilizes a reducing cobalt catalyst. This process consists of a reducing cobalt catalyst solution "ICP Accel COA" and an electroless Ni-P plating for cobalt catalysts "ICP Nicoron COA-GM." In conventional processes using palladium, the copper material corrodes during the catalyst application step, leading to the formation of voids between the copper material and the plating film, which has been a challenge. In this process, a uniform catalyst film can be formed through reduction deposition, enabling the reduction of the film thickness of electroless nickel plating (electroless nickel plating thickness: conventional process: 3.0µm, ICP-COA process: 0.5µm). Furthermore, since a void-free and well-covered film can be obtained, it is possible to reduce the film thickness of electroless Ni plating without compromising solder joint reliability.

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Copper plating additive for high aspect ratio substrates "Topluchina HLS"

Copper sulfate plating additive for high aspect ratio substrates for package substrates "Topluchina HLS"

This is the latest plating technology for semiconductor package substrates (IC substrates). Currently, electronic devices such as smartphones, computers, and servers are becoming more high-performance, leading to a reduction in the diameter of through-holes that electrically connect the layers of printed circuit boards, as well as a decrease in pitch. As a result, there is an advancement in the high aspect ratio and high density of through-holes. We have newly developed a copper sulfate plating additive for high aspect ratio substrates that can accommodate both soluble and insoluble anodes, aimed at improving the productivity and quality stability of printed circuit board production. This product excels in depositability within through-holes and vias, achieving high throwing power across a wide range of current densities.

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Contributes to increased productivity. Electroless nickel plating solution usable for up to 20 turns.

There is a track record of maintaining a precipitation rate of approximately 20 μm/h for more than 10 turns since the construction of the bath. It is possible to reduce the amount of waste liquid and achieve cost reduction.

Electroless nickel-phosphorus plating tends to have a decreased deposition rate as the number of turns progresses, and it is common to refresh the bath after 5 to 6 turns. Since updating the bath requires significant effort and time, there is a strong demand for longer-lasting electroless nickel solutions. In response, our company has optimized the balance of chelating agent combinations and concentrations to develop an electroless nickel plating solution that experiences minimal reduction in deposition rate for over 10 turns from the start of the bath. The development of this product can enhance productivity, reduce waste liquid volume and energy costs, and contribute to lowering environmental impact. 【Top Nicoron LLM-LF】 - There is little change in deposition rate and phosphorus content due to bath aging. - Usable for up to 20 turns. - Low film stress with minimal changes in stress due to continuous use. Please feel free to contact us for anything other than the above. Inquiries can be made through the contact information below.

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奥野製薬工業 大阪・放出、東京、名古屋など
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Please take a look at the technical document for the leak test, the "Technical Manual"!

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  • CATALOG

Fukuda Co., Ltd., which develops, manufactures, and sells leak testing equipment to inspect airtightness and sealing performance, provides a technical document that clearly explains the methods and theories of airtight testing, titled "Technical Manual." We are offering it as a PDF file. Please take this opportunity to download and view it!

Jul 09, 2026

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Please take a look at Fukuda's digital pressure gauge!

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"MI-170 series" With RS-232C communication, measurement result output and setting data input/output can be performed. Up to 8 types of condition settings, such as upper and lower limit settings, can be configured. Pressure sensors can be selected from 4 types based on accuracy, gauge pressure, and differential pressure. The mounting size conforms to the DIN96 standard. By combining with the separate type air leak tester LPU-100 series, it can also be used as an air leak tester. "DG-960 series" Pressure sensors can be selected from 4 types based on accuracy, gauge pressure, and differential pressure. The mounting size conforms to the DIN96 standard. "MIZ-0175 series" A new multi-indicator that enhances the functionality of the versatile and high-performance conventional model "MI-170," improving operability and visibility through downsizing and the adoption of an LCD display. It allows a maximum sampling rate of 4000 times per second for stable measurements and is equipped with various correction functions and noise cancellation features, providing a wealth of functionalities.

Jul 09, 2026

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Fukuda's leak test, leak inspection, leak detection, leak test, integrity test.

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Fukuda Co., Ltd. has been pursuing leak detection for 60 years and is committed to advancing the future of leak testing. 【 Supporting Various Leak Tests: Air Leak Test / Gas Leak Test (Hydrogen Gas, Helium Gas) 】 We develop, manufacture, and sell leak testing equipment to inspect airtightness and sealing properties. We will propose the appropriate testers and devices for each inspection target. 【 Target Industries and Examples of Inspection Targets 】 - Automotive Industry: Engines, FC components, valves and piping, various parts - Electronic Components Industry: Smartphones, keyless switches, various small sensors - Pharmaceuticals / Food / Cosmetics Industry: Bottle containers, syringes, vials, eye drop containers, pillow packaging, PTP packaging We will propose the most suitable leak testers for each industry. 【 ISO Certification 】JIS Q 9001:2015 (ISO 9001:2015)

Jul 09, 2026

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Test results of the General Incorporated Foundation Kaken Test Center regarding silver fabric (excerpt)

SPACECOOL exhibits at the 12th Extreme Heat Countermeasures Exhibition, a specialized trade show for heat prevention measures.

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SPACECOOL Co., Ltd. will exhibit at the 12th Heat Countermeasure Exhibition, a specialized trade show focused on solving heat-related issues, to be held at Tokyo Big Sight from July 15 (Wednesday) to July 17 (Friday), 2026. At this exhibition, we will showcase products from the "SPACECOOL Consumer Products Lab.," including the "SPACECOOL Umbrella Type 2," which will be launched in June 2026, as well as products currently under development. The "SPACECOOL Fabric Type 2" used in the exhibited products significantly suppresses the intrusion of heat from sunlight and promotes heat dissipation by radiating the heat transferred to the umbrella as infrared rays into space. The "SPACECOOL Umbrella Type 2" achieves high light-blocking and UV shielding performance, with a heat shielding rate of 80% (in the case of silver). We invite you to visit our booth when you come to the venue. Exhibition Overview: Dates: July 15 (Wednesday) to July 17 (Friday), 2026, 10:00 AM to 5:00 PM (until 4:00 PM on the final day) Venue: Tokyo Big Sight, East Hall 7 Our Booth Number: 7-ZF13 *Advance registration is required for attendance (free of charge).

Jul 09, 2026

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Metal Crack Repair: MS Method for Repairing Cracks and Fractures in Machinery Equipment

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Metal cracks are one of the concerns in equipment maintenance operations. Conventional welding repair methods can change the base material around the crack due to heat, leading to residual stress and deformation, which always carries the risk of "crack recurrence" and "secondary damage." Hinode Water Supply Equipment Co., Ltd.'s "Mechanical Stitching Method" is a new technique that allows for the repair of metal cracks without applying heat. By using special bolts and reinforcement plates, the crack is physically removed without affecting the base material at all. Repairs can be made even in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. For more details, please contact us or download the catalog.

Jul 09, 2026

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