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  6. Void-free final surface treatment, ICP-COA process

Void-free final surface treatment, ICP-COA process

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last updated:Mar 02, 2023

奥野製薬工業 大阪・放出、東京、名古屋など
奥野製薬工業 大阪・放出、東京、名古屋など
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Okuno Pharmaceutical Industry has established a final surface treatment process that forms a void-free and uniform plating film on the circuit surface.

Okuno Pharmaceutical Industry has established a final surface treatment process that forms a void-free and uniform plating film on circuit surfaces. The "ICP-COA process" is a low film thickness Ni-P/Au plating process that utilizes a reducing cobalt catalyst. This process consists of a reducing cobalt catalyst solution "ICP Accel COA" and an electroless Ni-P plating for cobalt catalysts "ICP Nicoron COA-GM." In conventional processes using palladium, the copper material corrodes during the catalyst application step, leading to the formation of voids between the copper material and the plating film, which has been a challenge. In this process, a uniform catalyst film can be formed through reduction deposition, enabling the reduction of the film thickness of electroless nickel plating (electroless nickel plating thickness: conventional process: 3.0µm, ICP-COA process: 0.5µm). Furthermore, since a void-free and well-covered film can be obtained, it is possible to reduce the film thickness of electroless Ni plating without compromising solder joint reliability.

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Void-free final surface treatment, ICP-COA process

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  • Related Link - https://www.okuno.co.jp/product/mf/

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We are developing various plating and surface treatment chemicals and high-performance products for automobiles, electric vehicles, home appliances, and various electronics, so please feel free to contact us.

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Void-free final surface treatment using reduced cobalt catalyst solution, ICP-COA process.

Void-free final surface treatment using reduced cobalt catalyst solution, ICP-COA process.

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A comprehensive unveiling of new plating chemicals related to semiconductors and environmental compliance!

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This is Yamanaka from the Marketing Strategy Department of Okuno Pharmaceutical Industry. We have just released new product information for printed circuit boards/semiconductor package substrates, environmentally friendly electroless nickel plating chemicals, and various surface treatment chemicals all at once. 【New Product Information】 Void-free final surface treatment using a reducing cobalt catalyst solution, ICP-COA process https://www.ipros.jp/catalog/detail/694141?hub=60+794925 Plating technology for package substrates: Copper sulfate plating additive "Toprutina HLS" for high aspect ratio substrates https://www.ipros.jp/catalog/detail/694132?hub=60+794925 Contributes to productivity improvement. Electroless nickel plating solution usable for up to 20 turns https://www.ipros.jp/catalog/detail/694071?hub=60+794925 Okuno Pharmaceutical Industry will continue to contribute to future manufacturing through science to solve the challenges facing our planet. Please feel free to consult us about any issues related to surface treatment and plating.

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奥野製薬工業

奥野製薬工業 大阪・放出、東京、名古屋など

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Our company is a research and development-oriented enterprise that supports global manufacturing through science in the fields of surface treatment, inorganic materials, and food. 【Surface Treatment Division】 - We launched a new brand of surface treatment chemicals for semiconductor back-end processes called "TORYZA," offering various plating chemicals and equipment such as copper plating additives for ultra-fine wiring and electroless plating processes for UBM formation. - We propose surface treatment chemicals for plastic plating that provide high added value, such as beautiful metallic appearance, luxury feel, and antibacterial and antiviral properties. - We offer process chemicals for anodizing and dyeing aluminum alloys that beautifully enhance the appearance of casings for smartphones and other devices. We also have environmentally friendly processes and surface treatment chemicals for antibacterial and antiviral applications in our lineup. - We provide electroless nickel plating chemicals and various environmentally friendly products, including low-temperature and long-life types, that impart new functions to materials, such as corrosion resistance, wear resistance, and lubricity. 【Inorganic Materials Division】 Total production from design, processing, to mass production of glass. Contributing to the enhancement of design and functionality with high-quality glass materials. 【Food Division】 Bringing "deliciousness" and "safety" to the dining table. Challenging the development of high-function products composed of food ingredients.

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