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  6. Solution for Weak-Micro Vias: High Connection Reliability Electroless Copper Plating Solution

Solution for Weak-Micro Vias: High Connection Reliability Electroless Copper Plating Solution

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last updated:Oct 07, 2024

奥野製薬工業 大阪・放出、東京、名古屋など
奥野製薬工業 大阪・放出、東京、名古屋など
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Achieving thin film deposition of electroless copper plating! Electroless copper plating process for semi-additive manufacturing with excellent connection reliability.

We have developed a new electroless copper plating process called "OPC FLET process" to meet the demands for fine wiring and contribute to the densification of semiconductor package substrates. In addition to the OPC FLET copper, which excels in uniform deposition within via holes, we have also developed a new electroless copper plating solution that achieves low film thickness and high reliability for through holes in printed circuit boards. We offer a range of products that can meet various customer needs.

    Chemicals
20241007イプロス2.png

Solution for Weak-Micro Vias: High Connection Reliability Electroless Copper Plating Solution

20241007イプロス2.png
20241007イプロス2.png
  • Related Link - https://www.okuno.co.jp/product/feature/opc_flet_p…

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basic information

We are developing various plating and surface treatment chemicals and high-performance products for automobiles, electric vehicles, home appliances, and various electronics, so please feel free to contact us.

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Printed circuit board, printed wiring board, circuit formation

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OPC FLET Process: A High-Connection Reliability Electroless Copper Plating Process to Solve Weak Micro Vias

OPC FLET Process: A High-Connection Reliability Electroless Copper Plating Process to Solve Weak Micro Vias

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奥野製薬工業

奥野製薬工業 大阪・放出、東京、名古屋など

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Our company is a research and development-oriented enterprise that supports global manufacturing through science in the fields of surface treatment, inorganic materials, and food. 【Surface Treatment Division】 - We launched a new brand of surface treatment chemicals for semiconductor back-end processes called "TORYZA," offering various plating chemicals and equipment such as copper plating additives for ultra-fine wiring and electroless plating processes for UBM formation. - We propose surface treatment chemicals for plastic plating that provide high added value, such as beautiful metallic appearance, luxury feel, and antibacterial and antiviral properties. - We offer process chemicals for anodizing and dyeing aluminum alloys that beautifully enhance the appearance of casings for smartphones and other devices. We also have environmentally friendly processes and surface treatment chemicals for antibacterial and antiviral applications in our lineup. - We provide electroless nickel plating chemicals and various environmentally friendly products, including low-temperature and long-life types, that impart new functions to materials, such as corrosion resistance, wear resistance, and lubricity. 【Inorganic Materials Division】 Total production from design, processing, to mass production of glass. Contributing to the enhancement of design and functionality with high-quality glass materials. 【Food Division】 Bringing "deliciousness" and "safety" to the dining table. Challenging the development of high-function products composed of food ingredients.

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