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  6. High current compatible through-hole copper plating additive

High current compatible through-hole copper plating additive

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last updated:Oct 31, 2022

奥野製薬工業 大阪・放出、東京、名古屋など
奥野製薬工業 大阪・放出、東京、名古屋など
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Newly developed for through-hole plating of printed circuit boards, ideal for high multilayer boards equipped with IC substrates and semiconductor package boards.

With the miniaturization, high functionality, and high density of electronic devices, there is an increasing demand for high-performance through-hole plating for module substrates and high-layer printed wiring boards. Our company has developed a sulfuric acid copper plating additive, Topluchina MSD, specifically for through-holes that can handle high currents, primarily for module substrates and high-layer printed wiring boards. This product achieves high throwing power at high current densities and contributes to improved productivity by reducing maintenance through stable operation.

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High current compatible through-hole copper plating additive

image13.JPG
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  • Related Link - https://www.okuno.co.jp/product/feature/top_lucina…

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Electronic devices such as computers and smartphones are evolving daily. Along with this, there is a demand for miniaturization, high density, and improved work efficiency in the final surface treatment for semiconductor package substrates. Our company has newly developed an electroplating additive for through-hole plating of printed circuit boards. Okuno Pharmaceutical Industry offers a wide variety of processing chemicals primarily for the plating process of printed circuit boards, covering the entire wet process. Additionally, we propose the latest products and processes for the manufacturing processes of semiconductor packaging substrates, IC substrates, and interposers produced by the semi-additive process, so please feel free to contact us.

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Semiconductor package substrate IC substrate

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Copper sulfate plating additive for beer filling: Topluchina GAP

Copper sulfate plating additive for beer filling: Topluchina GAP

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High current compatible through-hole copper plating additive.

High current compatible through-hole copper plating additive.

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Fine pattern compatible high film thickness uniformity via filling copper plating additive.

Fine pattern compatible high film thickness uniformity via filling copper plating additive.

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Company information

奥野製薬工業

奥野製薬工業 大阪・放出、東京、名古屋など

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Our company is a research and development-oriented enterprise that supports global manufacturing through science in the fields of surface treatment, inorganic materials, and food. 【Surface Treatment Division】 - We launched a new brand of surface treatment chemicals for semiconductor back-end processes called "TORYZA," offering various plating chemicals and equipment such as copper plating additives for ultra-fine wiring and electroless plating processes for UBM formation. - We propose surface treatment chemicals for plastic plating that provide high added value, such as beautiful metallic appearance, luxury feel, and antibacterial and antiviral properties. - We offer process chemicals for anodizing and dyeing aluminum alloys that beautifully enhance the appearance of casings for smartphones and other devices. We also have environmentally friendly processes and surface treatment chemicals for antibacterial and antiviral applications in our lineup. - We provide electroless nickel plating chemicals and various environmentally friendly products, including low-temperature and long-life types, that impart new functions to materials, such as corrosion resistance, wear resistance, and lubricity. 【Inorganic Materials Division】 Total production from design, processing, to mass production of glass. Contributing to the enhancement of design and functionality with high-quality glass materials. 【Food Division】 Bringing "deliciousness" and "safety" to the dining table. Challenging the development of high-function products composed of food ingredients.

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