Copper sulfate plating additive for semiconductor wafers - TORYZA LCN SD

Our company will be exhibiting at the 1st [Kyushu] Semiconductor Industry Exhibition, which will be held at Marine Messe Fukuoka Hall B from September 25 (Wednesday) to 26 (Thursday), 2024. At our booth, we will showcase the latest surface treatment chemicals and process technologies for wafers and package substrates, so please stop by. For more details, please check the related link [We will be exhibiting at the 1st [Kyushu] Semiconductor Industry Exhibition].

Okuno Pharmaceutical Industry has newly developed surface treatment chemicals and process technologies that contribute to the high performance and multifunctionality of printed circuit boards and semiconductor package substrates. The new products will be introduced at the 53rd International Electronic Circuit Industry Exhibition, JPCA Show 2024, which will be held from June 12 (Wednesday) to June 14 (Friday) at Tokyo Big Sight. At the venue, we will showcase the latest surface treatment chemicals and process technologies for wafers, package substrates, printed wiring boards, FPCs, and power modules. Additionally, we will present new technologies such as high-reliability granular copper plating with excellent adhesion to encapsulation resins, lithium dendrite growth suppressants, and plating technologies using recycled materials, so please stop by. For more details, please check the related link [We will be exhibiting at the 53rd International Electronic Circuit Industry Exhibition, JPCA Show 2024].

Okuno Pharmaceutical Industry has developed new surface treatment chemicals and plating processes for semiconductors to respond to the evolution of semiconductors. The new products will be introduced at the 25th Semiconductor and Sensor Packaging Exhibition, which will be held at Tokyo Big Sight from January 24 (Wednesday) to January 26 (Friday), 2024. At the venue, we will present plating chemicals and processes for semiconductor wafers and package substrates, ultra-fine wiring, and the latest surface treatments for power devices, under the theme of OKUNO contributing to the development of printed circuit boards and semiconductor package substrates. We will also showcase the new "TORYZA" series for semiconductor back-end processes, including an electroless plating process for UBM formation on wafers and dedicated plating equipment, so please stop by. For more details, please check the related link [Exhibiting at the Semiconductor and Sensor Packaging Exhibition/Specialized Exhibition for Semiconductor Back-End Processes (ISP)].

Semiconductor devices, interposers that relay between semiconductor devices and printed circuit boards, and the wiring of packages used for directly mounting semiconductor chips onto printed circuit boards utilize plating technology for purposes such as transmitting electrical signals, sharing power, and heat dissipation. Okuno Pharmaceutical Industry has newly developed surface treatment chemicals and plating processes for semiconductors to keep up with the evolution of semiconductors. ◆ UBM formation for aluminum electrodes on wafers Plating process and dedicated plating equipment TORYZA EL PROCESS, TORYZA EL SYSTEM ◆ For semiconductor wafers Newly developed copper sulfate plating chemicals TORYZA LCN series For more details, please contact us.