We will exhibit at the 1st [Kyushu] Semiconductor Industry Exhibition.

Newly developed copper sulfate plating chemicals for wiring of semiconductor wafers.

As the functionality, performance, and miniaturization of semiconductors continue to evolve, new technologies related to three-dimensional integration of semiconductors are being developed one after another. Consequently, addressing the miniaturization of wiring (narrow pitch) and heat dissipation measures has become increasingly important. To meet various demands, our company has newly developed sulfuric acid copper plating chemicals, the TORYZA LCN series, for semiconductor wafer wiring.

• Chemicals

TORYZA LCN SP, the optimal electroplating solution for forming copper pillars on semiconductor wafers and package substrates.

Solder balls have been widely used in semiconductor packaging. However, due to the increase in pin count (the number of terminals on the substrate), the increase in the number of chips being packaged, and the reduction in bonding area, solder bumps with a diameter of about 100µm are becoming insufficient for high-density packaging. As an alternative, attention is being drawn to a method that involves forming a redistribution layer (RDL) on the semiconductor and using copper pillars for bonding. Our company has developed the optimal additive for copper pillars, TORYZA LCN SP. TORYZA LCN SP can also be used to form ultra-fine electrodes on the build-up layer of the package substrate.

• Chemicals

Supports high aspect ratio filling, copper sulfate plating additive for silicon interposers - TORYZA LCN SV.

With the advancement of semiconductor performance and functionality, packaging technologies related to chiplets that implement multiple chips with different functions on a single substrate and three-dimensional integration are gaining attention. Among these, silicon interposers with wiring formed on silicon are attracting interest because they can miniaturize the length and width of the wiring, thereby enhancing the transmission capability of high-frequency signals. Our company has developed TORYZA LCN SV as an additive for silicon interposers that supports high aspect ratio filling. TORYZA LCN SV excels in embedability into TSVs, achieving void-free and low film thickness high aspect ratio filling.

• Chemicals

Copper sulfate plating additive for semiconductor wafers, high heat dissipation and high current applications - TORYZA LCN SD.

Smartphones are widely used not only for calls but also for content viewing such as music and videos, online shopping, and in industries like automobiles, smart home appliances, and robotics. Mobile communication devices like cell phones and tablets have undergone significant evolution approximately every 10 years, with their maximum communication speeds increasing by about 1,000,000 times over the past 30 years. Additionally, semiconductors used in servers and high-performance computers are required to achieve even higher performance and multifunctionality. Our company has recently developed a new copper sulfate plating additive, TORYZA LCN SD, which is optimal for low aspect ratio via filling. TORYZA LCN SD can be widely applied to microbumps that join semiconductor chips and build-up wiring boards, as well as thermal vias used for heat dissipation in trench wiring on wafers and power semiconductors.

• Chemicals

FOWLP, FOPLP, and next-generation semiconductor package substrates, as well as ultra-fine wiring copper sulfate plating additives - TORYZA LCN FRV.

In recent years, semiconductor packaging technology has gained attention with FOWLP and FOPLP, which allow for an increase in the number of terminals relative to chip area by forming a redistribution layer on the wafer and expanding the terminals to the outside of the chip (Fan Out), in contrast to the conventional FC-BGA that is disadvantageous for thinness and cost reduction. Our company has developed a new copper sulfate plating additive for the formation of the redistribution layer in FOWLP and FOPLP. This product excels in film thickness uniformity and rectangularity of pattern shape, and it also accommodates filling of small-diameter vias. Additionally, to support the increase in the number of terminals on the chip side, the formation of ultra-fine wiring layers on the build-up layer of conventional FC-BGA is also being considered. This product is optimal for the formation of ultra-fine wiring in next-generation semiconductor package substrates.

• Chemicals

Achieving thin film deposition of non-electrolytic copper plating! It greatly contributes to the formation of fine circuits on semiconductor package substrates and the improvement of via connection reliability!

In recent years, with the miniaturization and high performance of electronic devices, semiconductor devices have also become more refined and functional. There is a growing demand for further miniaturization of wiring and reduction of via diameters in semiconductor package substrates that connect semiconductor devices to the main substrate. Okuno Pharmaceutical Industry has newly developed products to meet the demands for fine wiring. Highest via connection reliability: Electroless copper plating solution: OPC FLET Copper - Achieves crystal continuity at the bottom of the via - Conventional baths see a significant increase in resistance due to a decrease in the thickness of the electroless copper plating film OPC FLET Copper shows good conductivity even at low film thickness - Controls the plating deposition rate - The deposition rate becomes gradual over time, suppressing deposition on copper - Conventional baths tend to have excessive surface film thickness OPC FLET Copper achieves sufficient coverage at low film thickness - Excellent connection reliability for small-diameter vias

• Chemicals

In public construction civil engineering sites, there are many instances where sheets are used as common temporary facilities, such as construction roads, access roads, heavy machinery work yards, material storage areas, and worker pathways. Traditionally, steel plates were common, but due to their weight, transportation and installation can be cumbersome. Hyper CLT sheets are civil engineering materials made from wooden CLT for civil engineering use. The 5×10 sheet weighs about 230 kg, and the 5×20 sheet weighs about 460 kg, making them lightweight and easy to transport, install, and remove, even with small machinery. They can be widely utilized for temporary roads, heavy machinery scaffolding, pathways within the site, and protection of material storage in public works. Since they are made of wood, they also contribute to environmental aspects such as reducing summer heat reflection, lowering noise, and fixing CO2. They can simultaneously address construction efficiency, safety measures, and environmental considerations, making them effective for innovative proposals in public works. Furthermore, they improve transportation efficiency and reduce labor in site operations as an alternative to steel plates. Hyper CLT sheets are registered technology with the Ministry of Land, Infrastructure, Transport and Tourism under NETIS "TH-250021-A." They are recommended for companies considering civil engineering, civil engineering use, and civil engineering CLT. Feel free to request materials or consult about implementation. They are temporary materials that also help improve site evaluations in public works. Please consider them.

We have released a new video on our company’s YouTube channel. The theme of this video is "The World of Amino Acid-Based Shampoos." Amino acid-based shampoos have become popular in recent years, but the lather, feel, and finish can vary greatly depending on the cleansing ingredients used. In this video, we clearly explain the changes in user experience based on the differences in cleansing ingredients by comparing two types of amino acid-based shampoos. We hope you can use this as a hint for developing original shampoos and differentiation.

New York and Tokyo, June 26, 2026 - (JCN Newswire) - This year's successful listing of PayPay Corporation (hereinafter "PayPay") on NASDAQ has provided a significant boost. The question now facing Japan's leading innovation companies is no longer "Is a U.S. listing feasible?" but rather "How can we attract global capital and build companies that align with global growth strategies?" The 2nd Japan Go IPO Summit will be held on September 16, 2026, at the Grand Hyatt Tokyo to address this question. This summit is hosted by MarcumAsia and organized by AUM Advisors. To register for this invitation-only event, please apply here: Japan GO IPO Summit Attendee Information https://events.marcumasia.com/view.php?id=32

Our company representative, Shibata, will be speaking as a lecturer at the "Mikata Project" AI Utilization Seminar for the automotive industry, hosted by the Chubu Bureau of Economy, Trade and Industry. ■ Title: AI Implementation Course Leading to Results - Learning Success Patterns and Practical Processes from Real Examples in Manufacturing Sites "We implemented AI, but it is not being used on-site and is left unattended" and "The implementation has become the goal without yielding results" - we have seen many such stumbling blocks in manufacturing sites. In the seminar, based on real examples, we will discuss common patterns for successful implementation that lead to results, pitfalls to avoid, and practical processes to ensure AI is continuously used. We will also propose specific measures for sites struggling with technology transfer and dependency on individuals. ■ Event Overview Date: July 3, 2026 (Friday) 13:30 - 16:00 Venue: TKP Meitetsu Nagoya Station Conference Center + Online Participation Fee: Free / Application Deadline: June 30 (Tuesday) Organizer: Chubu Bureau of Economy, Trade and Industry (Automotive Industry "Mikata Project") Co-presenter: Satoru Hayami, Waseda University For details and registration, please visit the official page of the Chubu Bureau of Economy, Trade and Industry. If you are struggling with AI implementation in manufacturing sites, please feel free to consult us, regardless of region or industry.

July 16 (Thursday) 10:00 AM - 6:00 PM Venue: Convex Okayama Small Exhibition Hall