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  6. Copper sulfate plating additive for wafers - TORYZA LCN series

Copper sulfate plating additive for wafers - TORYZA LCN series

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last updated:Jul 25, 2024

奥野製薬工業 大阪・放出、東京、名古屋など
奥野製薬工業 大阪・放出、東京、名古屋など
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Newly developed copper sulfate plating chemicals for wiring of semiconductor wafers.

As the functionality, performance, and miniaturization of semiconductors continue to evolve, new technologies related to three-dimensional integration of semiconductors are being developed one after another. Consequently, addressing the miniaturization of wiring (narrow pitch) and heat dissipation measures has become increasingly important. To meet various demands, our company has newly developed sulfuric acid copper plating chemicals, the TORYZA LCN series, for semiconductor wafer wiring.

    Chemicals
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Copper sulfate plating additive for wafers - TORYZA LCN series

20240723_1.png
20240723_1.png
  • Related Link - https://www.okuno.co.jp/product/feature/toryza_lcn…

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basic information

We are developing various plating and surface treatment chemicals and high-performance products for automobiles, electric vehicles, home appliances, and various electronics, so please feel free to contact us.

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Semiconductor wafer

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Copper sulfate plating additive for wafers - TORYZA LCN series

Copper sulfate plating additive for wafers - TORYZA LCN series

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We will exhibit at the 1st [Kyushu] Semiconductor Industry Exhibition.

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Our company will be exhibiting at the 1st [Kyushu] Semiconductor Industry Exhibition, which will be held at Marine Messe Fukuoka Hall B from September 25 (Wednesday) to 26 (Thursday), 2024. At our booth, we will showcase the latest surface treatment chemicals and process technologies for wafers and package substrates, so please stop by. For more details, please check the related link [We will be exhibiting at the 1st [Kyushu] Semiconductor Industry Exhibition].

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奥野製薬工業

奥野製薬工業 大阪・放出、東京、名古屋など

Chemical

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Our company is a research and development-oriented enterprise that supports global manufacturing through science in the fields of surface treatment, inorganic materials, and food. 【Surface Treatment Division】 - We launched a new brand of surface treatment chemicals for semiconductor back-end processes called "TORYZA," offering various plating chemicals and equipment such as copper plating additives for ultra-fine wiring and electroless plating processes for UBM formation. - We propose surface treatment chemicals for plastic plating that provide high added value, such as beautiful metallic appearance, luxury feel, and antibacterial and antiviral properties. - We offer process chemicals for anodizing and dyeing aluminum alloys that beautifully enhance the appearance of casings for smartphones and other devices. We also have environmentally friendly processes and surface treatment chemicals for antibacterial and antiviral applications in our lineup. - We provide electroless nickel plating chemicals and various environmentally friendly products, including low-temperature and long-life types, that impart new functions to materials, such as corrosion resistance, wear resistance, and lubricity. 【Inorganic Materials Division】 Total production from design, processing, to mass production of glass. Contributing to the enhancement of design and functionality with high-quality glass materials. 【Food Division】 Bringing "deliciousness" and "safety" to the dining table. Challenging the development of high-function products composed of food ingredients.

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