We will be exhibiting at the 53rd International Electronic Circuit Industry Exhibition, JPCA Show 2024.

TORYZA LCN SP, the optimal electroplating solution for forming copper pillars on semiconductor wafers and package substrates.

Solder balls have been widely used in semiconductor packaging. However, due to the increase in pin count (the number of terminals on the substrate), the increase in the number of chips being packaged, and the reduction in bonding area, solder bumps with a diameter of about 100µm are becoming insufficient for high-density packaging. As an alternative, attention is being drawn to a method that involves forming a redistribution layer (RDL) on the semiconductor and using copper pillars for bonding. Our company has developed the optimal additive for copper pillars, TORYZA LCN SP. TORYZA LCN SP can also be used to form ultra-fine electrodes on the build-up layer of the package substrate.

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Supports high aspect ratio filling, copper sulfate plating additive for silicon interposers - TORYZA LCN SV.

With the advancement of semiconductor performance and functionality, packaging technologies related to chiplets that implement multiple chips with different functions on a single substrate and three-dimensional integration are gaining attention. Among these, silicon interposers with wiring formed on silicon are attracting interest because they can miniaturize the length and width of the wiring, thereby enhancing the transmission capability of high-frequency signals. Our company has developed TORYZA LCN SV as an additive for silicon interposers that supports high aspect ratio filling. TORYZA LCN SV excels in embedability into TSVs, achieving void-free and low film thickness high aspect ratio filling.

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Copper sulfate plating additive for semiconductor wafers, high heat dissipation and high current applications - TORYZA LCN SD.

Smartphones are widely used not only for calls but also for content viewing such as music and videos, online shopping, and in industries like automobiles, smart home appliances, and robotics. Mobile communication devices like cell phones and tablets have undergone significant evolution approximately every 10 years, with their maximum communication speeds increasing by about 1,000,000 times over the past 30 years. Additionally, semiconductors used in servers and high-performance computers are required to achieve even higher performance and multifunctionality. Our company has recently developed a new copper sulfate plating additive, TORYZA LCN SD, which is optimal for low aspect ratio via filling. TORYZA LCN SD can be widely applied to microbumps that join semiconductor chips and build-up wiring boards, as well as thermal vias used for heat dissipation in trench wiring on wafers and power semiconductors.

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FOWLP, FOPLP, and next-generation semiconductor package substrates, as well as ultra-fine wiring copper sulfate plating additives - TORYZA LCN FRV.

In recent years, semiconductor packaging technology has gained attention with FOWLP and FOPLP, which allow for an increase in the number of terminals relative to chip area by forming a redistribution layer on the wafer and expanding the terminals to the outside of the chip (Fan Out), in contrast to the conventional FC-BGA that is disadvantageous for thinness and cost reduction. Our company has developed a new copper sulfate plating additive for the formation of the redistribution layer in FOWLP and FOPLP. This product excels in film thickness uniformity and rectangularity of pattern shape, and it also accommodates filling of small-diameter vias. Additionally, to support the increase in the number of terminals on the chip side, the formation of ultra-fine wiring layers on the build-up layer of conventional FC-BGA is also being considered. This product is optimal for the formation of ultra-fine wiring in next-generation semiconductor package substrates.

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It is the process of forming UBM. It can improve the connection reliability between the aluminum electrode and the package terminal.

UBM stands for Under Bump Metal or Under Barrier Metal, and it is a film formed to join aluminum electrode pads on semiconductor chips with package terminals through wire bonding, soldering, or silver sintering. This film is composed of materials such as electroless nickel/gold plating or electroless nickel/palladium/gold plating. We offer a wide range of products that support the evolution of semiconductors and electronics, so please feel free to consult with us.

• Chemicals

Dear Sir/Madam, I hope this message finds you well and thriving. I would like to express my sincere gratitude for your continued support. We would like to inform you that our company will be closed for summer vacation during the following period: ■ Summer Vacation Period From Saturday, August 8, 2026, to Sunday, August 16, 2026. We will resume normal operations on Monday, August 17, 2026. Inquiries received during the vacation period will be addressed sequentially after the start of business. We apologize for any inconvenience this may cause and appreciate your understanding.

Fukuda Co., Ltd. has been pursuing leak detection for 60 years and is committed to advancing the future of leak testing. 【 Supporting Various Leak Tests: Air Leak Test / Gas Leak Test (Hydrogen Gas, Helium Gas) 】 We develop, manufacture, and sell leak testing equipment to inspect airtightness and sealing properties. We will propose the appropriate testers and devices for each inspection target. 【 Target Industries and Examples of Inspection Targets 】 - Automotive Industry: Engines, FC components, valves and piping, various parts - Electronic Components Industry: Smartphones, keyless switches, various small sensors - Pharmaceuticals / Food / Cosmetics Industry: Bottle containers, syringes, vials, eye drop containers, pillow packaging, PTP packaging We will propose the most suitable leak testers for each industry. 【 ISO Certification 】JIS Q 9001:2015 (ISO 9001:2015)

In civil engineering sites, the use of sheet piling methods is essential for safely utilizing the site, including temporary roads, access roads, heavy machinery work yards, material storage areas, and worker pathways. Traditionally, steel plates have been widely used, but due to their weight, they can be cumbersome to transport, install, and remove. Hyper CLT sheet piles are civil engineering materials made from wooden CLT for civil use. The 5×10 panel weighs approximately 230 kg, and the 5×20 panel weighs about 460 kg, making them lightweight and easy to handle with small machinery, contributing to reduced burdens during installation and improved work efficiency. They can be utilized in a wide range of civil engineering sites for measures against muddy conditions, ground protection, heavy machinery scaffolding, and ensuring pedestrian pathways. As a registered technology under the Ministry of Land, Infrastructure, Transport and Tourism NETIS "TH-250021-A," it is also recommended as a material for innovative ideas, safety measures, and environmental considerations in public works.

Fukuda's new flagship model. - Masterless type (FLA-0200 series) - General type (FLA-0201 series) Two models of air leak testers. With the mastering correction function, high-precision measurements can be achieved in a short time. Please take a look at the catalog.

Fukuda Co., Ltd., which develops, manufactures, and sells leak testing equipment to inspect airtightness and sealing performance, provides a technical document that clearly explains the methods and theories of airtight testing, titled "Technical Manual." We are offering it as a PDF file. Please take this opportunity to download and view it!