Chemical

奥野製薬工業 大阪・放出、東京、名古屋など

EstablishmentOctober 6, 1944
capital7000Ten thousand
number of employees441
addressOsaka/Tsurumi-ku, Osaka-shi/Hōshutsu Tō 1-10-25
phone06-6968-6931
last updated：
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Alternative technology for fluorine coating for food utensils: "Top Ceramics Release FG-1"

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High-reliability granular copper plating additive "Top Cluster AR"

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Glass materials that are optimal for the formation of electrode protective films, sintering aids for ceramics and powdered metals, and the sealing and encapsulation of electronic components.

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100% food-grade antibacterial and virus removal coating agent "TOP NOBAC LB"

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"Protector PW-S," a high insulation and high corrosion-resistant coating agent ideal for magnetic powders.

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Aluminum Hard Anodizing Additive "Top Hardener AL"

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TAC dye for aluminum anodizing film

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Chromium, cobalt-free black pigment "CFP-6010BK2"

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Non-stick and anti-soiling coating agent "Topcera Release IG-1"

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Silica-based high heat-resistant coating agent "Protector HB-HR1"

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High corrosion resistance and high light resistance color coating Pigment dispersant for Protector, Protector BK series

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Silica-based high corrosion-resistant coating agent "Protector" series

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Low-reflective process for aluminum "Top Alcloy Process"

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Electroless plating equipment for UBM formation for wafers

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Aluminum electrode UBM formation on wafer - plating process

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Long-life, high-speed electroless nickel plating solution 'Top Nikoron LLM-LFS'

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White decorative trivalent chromium plating solution "Top Fine Chrome BLW"

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Hexavalent chromium-free pretreatment process "Top Zechrom PLUS process"

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Low-frequency electromagnetic wave shielding compatible nickel-iron alloy plating.

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Electroless plating process for insulation circuit boards for power semiconductors.

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Notice of Participation in Chemical Material Japan 2024

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Fluorine compound-free food utensil coating agent

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Non-stick and dirt-repellent coating agent free of fluorine compounds.

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OPC FLET Process: A High-Connection Reliability Electroless Copper Plating Process to Solve Weak Micro Vias

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Aluminum electrode on wafer UBM formation, electroless plating equipment for UBM formation for wafers.

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Copper sulfate plating additive for wafers - TORYZA LCN series

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High-reliability granular copper plating additive Top Cluster AR that achieves high adhesion with sealing resin.

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Electroless plating process for insulated circuit boards for power modules.

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Fine pattern compatible high joint reliability - electroless nickel/gold plating process.

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Electroless nickel-boron plating process on metal ink circuits on sintered substrates - Top FCP process

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High current fine pattern via filling copper sulfate plating additive; large diameter via compatible copper sulfate plating additive.

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High connection reliability electroless copper plating process for solving weak micro vias - OPC FLET process.

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Electroless plating equipment for UBM formation for wafers - TORYZA EL SYSTEM

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Aluminum electrode on wafer UBM formation - TORYZA EL PROCESS

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Copper sulfate plating additive for wafers - TORYZA LCN series

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Okuno Pharmaceutical Industry's latest technology for antibacterial and antiviral plating/coating.

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Introduction of a new environmentally friendly non-electrolytic nickel plating solution.

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Copper sulfate plating additive for semiconductor wafers - TORYZA LCN SV

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TORYZA LCN SP, a plating additive suitable for forming copper pillars on semiconductor wafers and package substrates.

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Launch of new environmentally friendly products (Efforts towards carbon neutrality)

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Launch of new environmentally friendly products (for plastic plating)

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Launch of environmentally friendly new products (Electroless nickel plating solution)

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Significant reduction in the amount of plating solution used. Electric nickel plating solution for SED.

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Void-free final surface treatment using reduced cobalt catalyst solution, ICP-COA process.

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Copper sulfate plating additive for high aspect ratio boards for package substrates "Topluchina HLS"

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