We will be exhibiting at the 24th Semiconductor and Sensor Packaging Exhibition / Specialized Exhibition for Semiconductor Backend Processes (ISP).
Okuno Pharmaceutical Industry Co., Ltd. will exhibit at the 24th Semiconductor and Sensor Packaging Exhibition / Semiconductor Backend Process Specialized Exhibition (ISP), which will be held at Tokyo Big Sight from January 25 (Wednesday) to January 27 (Friday), 2023.
We will showcase products from OKUNO that contribute to the development of printed circuit boards and semiconductor package substrates, including plating chemicals and processes for glass interposers, semiconductor wafers, and package substrates, RDL (redistribution layer) and 3D wiring formation technologies, and the latest surface treatments for power devices. Our booth location is [24-8] in East Hall 3. All of our staff sincerely look forward to welcoming you.
Advance registration is required for attendance. By registering in advance, admission will be free. For more details, please visit the websites below.
Our website:
https://www.okuno.co.jp/news/invitation_isp2023.html
Official website:
https://www.nepconjapan.jp/tokyo/ja-jp/about/isp.html

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