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  1. Home
  2. Chemical
  3. 奥野製薬工業 大阪・放出、東京、名古屋など
  4. A comprehensive unveiling of new plating chemicals related to semiconductors and environmental compliance!
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  • Mar 02, 2023
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Mar 02, 2023

A comprehensive unveiling of new plating chemicals related to semiconductors and environmental compliance!

奥野製薬工業 奥野製薬工業 大阪・放出、東京、名古屋など
This is Yamanaka from the Marketing Strategy Department of Okuno Pharmaceutical Industry. We have just released new product information for printed circuit boards/semiconductor package substrates, environmentally friendly electroless nickel plating chemicals, and various surface treatment chemicals all at once. 【New Product Information】 Void-free final surface treatment using a reducing cobalt catalyst solution, ICP-COA process https://www.ipros.jp/catalog/detail/694141?hub=60+794925 Plating technology for package substrates: Copper sulfate plating additive "Toprutina HLS" for high aspect ratio substrates https://www.ipros.jp/catalog/detail/694132?hub=60+794925 Contributes to productivity improvement. Electroless nickel plating solution usable for up to 20 turns https://www.ipros.jp/catalog/detail/694071?hub=60+794925 Okuno Pharmaceutical Industry will continue to contribute to future manufacturing through science to solve the challenges facing our planet. Please feel free to consult us about any issues related to surface treatment and plating.
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Void-free final surface treatment, ICP-COA process

Okuno Pharmaceutical Industry has established a final surface treatment process that forms a void-free and uniform plating film on the circuit surface.

Okuno Pharmaceutical Industry has established a final surface treatment process that forms a void-free and uniform plating film on circuit surfaces. The "ICP-COA process" is a low film thickness Ni-P/Au plating process that utilizes a reducing cobalt catalyst. This process consists of a reducing cobalt catalyst solution "ICP Accel COA" and an electroless Ni-P plating for cobalt catalysts "ICP Nicoron COA-GM." In conventional processes using palladium, the copper material corrodes during the catalyst application step, leading to the formation of voids between the copper material and the plating film, which has been a challenge. In this process, a uniform catalyst film can be formed through reduction deposition, enabling the reduction of the film thickness of electroless nickel plating (electroless nickel plating thickness: conventional process: 3.0µm, ICP-COA process: 0.5µm). Furthermore, since a void-free and well-covered film can be obtained, it is possible to reduce the film thickness of electroless Ni plating without compromising solder joint reliability.

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Copper plating additive for high aspect ratio substrates "Topluchina HLS"

Copper sulfate plating additive for high aspect ratio substrates for package substrates "Topluchina HLS"

This is the latest plating technology for semiconductor package substrates (IC substrates). Currently, electronic devices such as smartphones, computers, and servers are becoming more high-performance, leading to a reduction in the diameter of through-holes that electrically connect the layers of printed circuit boards, as well as a decrease in pitch. As a result, there is an advancement in the high aspect ratio and high density of through-holes. We have newly developed a copper sulfate plating additive for high aspect ratio substrates that can accommodate both soluble and insoluble anodes, aimed at improving the productivity and quality stability of printed circuit board production. This product excels in depositability within through-holes and vias, achieving high throwing power across a wide range of current densities.

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Contributes to increased productivity. Electroless nickel plating solution usable for up to 20 turns.

There is a track record of maintaining a precipitation rate of approximately 20 μm/h for more than 10 turns since the construction of the bath. It is possible to reduce the amount of waste liquid and achieve cost reduction.

Electroless nickel-phosphorus plating tends to have a decreased deposition rate as the number of turns progresses, and it is common to refresh the bath after 5 to 6 turns. Since updating the bath requires significant effort and time, there is a strong demand for longer-lasting electroless nickel solutions. In response, our company has optimized the balance of chelating agent combinations and concentrations to develop an electroless nickel plating solution that experiences minimal reduction in deposition rate for over 10 turns from the start of the bath. The development of this product can enhance productivity, reduce waste liquid volume and energy costs, and contribute to lowering environmental impact. 【Top Nicoron LLM-LF】 - There is little change in deposition rate and phosphorus content due to bath aging. - Usable for up to 20 turns. - Low film stress with minimal changes in stress due to continuous use. Please feel free to contact us for anything other than the above. Inquiries can be made through the contact information below.

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[Expert Column] How Long Should You Keep Estimates? The Boundaries of "Obligation to Preserve Estimates"

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Regarding the "quotation" used at the forefront of sales activities: "Do we really need to save everything when we revise it to Ver.1, Ver.2, etc., every time the amount or specifications change?" "Should we also keep the data from other companies that were not selected in competitive quotations?" Have you ever wondered about these questions? The Electronic Bookkeeping Act strictly demands the "authenticity" of data, but saving every process is a significant burden for the field. This time, we will clearly explain the boundaries of the preservation obligation in a case study format, incorporating the latest interpretations from the National Tax Agency's Q&A. *You can read the full text from the note in the "Related Links." [Contents of this article] 1. The boundary of the preservation obligation lies in "sending to external parties." - Items sent externally are "generally required to be preserved." - Items not sent externally have "no preservation obligation." 2. The sender's judgment: "Is it linked to a transaction?" 3. The recipient's judgment: "The perspective of the 'Corporate Tax Act' is important." ■ Note! "Version revisions" and "corrections/deletions" are different things. ■ A smart way to achieve reliable "version management." ■ Summary

Jan 20, 2026

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PFAS Regulation Countermeasures! ■■ Leak Test Equipment for Small Electronic Components|MSA-0101 series ■■ Does not use fluorinated inert fluids. PFAS-free. Offers accuracy equal to or better than liquid immersion testing.

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● This is a leak testing device for small electronic components that does not use fluorinated inert liquids (PFAS-free). ● There is no longer a need for unstable visual confirmation through liquid immersion testing. It adopts a quantitative testing method that allows for stable pressure leak testing. ● It is a tabletop leak testing device specifically for gross leaks, with accuracy equal to or greater than that of liquid immersion testing. ● The detectable range is approximately 1×10⁻² Pa·m³/s to 1×10⁻⁶ Pa·m³/s (varies depending on the target product). ● It is suitable for sealed structures ranging from a few millimeters to a maximum of 80 × 70 mm. Please feel free to contact us for more information!

Jan 20, 2026

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■■ Air Leak Tester | FLA-0200 / FLA-0201 series ■■ Fukuda's new flagship model. Equipped with mastering correction function, it enables high-precision measurements in a short time.

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Fukuda's new flagship model. - Masterless type (FLA-0200 series) - General type (FLA-0201 series) Two models of air leak testers. With the mastering correction function, high-precision measurements can be achieved in a short time. Please take a look at the catalog.

Jan 19, 2026

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Please take a look at Fukuda's sealed product air leak testing device!

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What is a sealed product air leak test device? It is an air leak test device that inspects the airtightness, sealing performance, and waterproofness of electrical equipment and packaging containers (cosmetics, food). It tests for leaks in products such as smartphones, tablet devices, keyless switches, wristwatches, bottle containers, and cosmetic containers (eyeliner, mascara).

Jan 19, 2026

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Attention! Fukuda's leak test = special specification product =

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【Leak testers and leak test-related products provided by Fukuda】 Please take a look at our catalog! ★ Millimeter-wave radar & LiDAR leak tester: The air leak tester "FL-610" for controlling the separate type leak tester air pressure unit "LPU-300." ★ Leak tester for simultaneous measurement of workpieces: Measures two workpieces with one unit. By comparing two at the same time, you can increase the number of operations. ★ Electric air regulator for blood pressure monitor pressure confirmation: Excellent in repeatability of pressure control and pressure adjustment. ★ Leak tester for automotive lighting: Can be tested at low pressure without affecting the workpiece (item under inspection). ★ Air leak tester conversion box/cable: Peripheral equipment for air leak testers. Used when replacing old models with current products or when changing the model of current products. ★ Waterproof inspection testing device: A device for testing the waterproofness (equivalent to IPX7,8) and sealing of sealed products. It can be used for various products such as electronic devices and packaging containers.

Jan 19, 2026

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