A comprehensive unveiling of new plating chemicals related to semiconductors and environmental compliance!

This is Yamanaka from the Marketing Strategy Department of Okuno Pharmaceutical Industry.
We have just released new product information for printed circuit boards/semiconductor package substrates, environmentally friendly electroless nickel plating chemicals, and various surface treatment chemicals all at once.
【New Product Information】
Void-free final surface treatment using a reducing cobalt catalyst solution, ICP-COA process
https://www.ipros.jp/catalog/detail/694141?hub=60+794925
Plating technology for package substrates: Copper sulfate plating additive "Toprutina HLS" for high aspect ratio substrates
https://www.ipros.jp/catalog/detail/694132?hub=60+794925
Contributes to productivity improvement. Electroless nickel plating solution usable for up to 20 turns
https://www.ipros.jp/catalog/detail/694071?hub=60+794925
Okuno Pharmaceutical Industry will continue to contribute to future manufacturing through science to solve the challenges facing our planet. Please feel free to consult us about any issues related to surface treatment and plating.

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