A comprehensive unveiling of new plating chemicals related to semiconductors and environmental compliance!

Okuno Pharmaceutical Industry has established a final surface treatment process that forms a void-free and uniform plating film on the circuit surface.

Okuno Pharmaceutical Industry has established a final surface treatment process that forms a void-free and uniform plating film on circuit surfaces. The "ICP-COA process" is a low film thickness Ni-P/Au plating process that utilizes a reducing cobalt catalyst. This process consists of a reducing cobalt catalyst solution "ICP Accel COA" and an electroless Ni-P plating for cobalt catalysts "ICP Nicoron COA-GM." In conventional processes using palladium, the copper material corrodes during the catalyst application step, leading to the formation of voids between the copper material and the plating film, which has been a challenge. In this process, a uniform catalyst film can be formed through reduction deposition, enabling the reduction of the film thickness of electroless nickel plating (electroless nickel plating thickness: conventional process: 3.0µm, ICP-COA process: 0.5µm). Furthermore, since a void-free and well-covered film can be obtained, it is possible to reduce the film thickness of electroless Ni plating without compromising solder joint reliability.

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Copper sulfate plating additive for high aspect ratio substrates for package substrates "Topluchina HLS"

This is the latest plating technology for semiconductor package substrates (IC substrates). Currently, electronic devices such as smartphones, computers, and servers are becoming more high-performance, leading to a reduction in the diameter of through-holes that electrically connect the layers of printed circuit boards, as well as a decrease in pitch. As a result, there is an advancement in the high aspect ratio and high density of through-holes. We have newly developed a copper sulfate plating additive for high aspect ratio substrates that can accommodate both soluble and insoluble anodes, aimed at improving the productivity and quality stability of printed circuit board production. This product excels in depositability within through-holes and vias, achieving high throwing power across a wide range of current densities.

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There is a track record of maintaining a precipitation rate of approximately 20 μm/h for more than 10 turns since the construction of the bath. It is possible to reduce the amount of waste liquid and achieve cost reduction.

Electroless nickel-phosphorus plating tends to have a decreased deposition rate as the number of turns progresses, and it is common to refresh the bath after 5 to 6 turns. Since updating the bath requires significant effort and time, there is a strong demand for longer-lasting electroless nickel solutions. In response, our company has optimized the balance of chelating agent combinations and concentrations to develop an electroless nickel plating solution that experiences minimal reduction in deposition rate for over 10 turns from the start of the bath. The development of this product can enhance productivity, reduce waste liquid volume and energy costs, and contribute to lowering environmental impact. 【Top Nicoron LLM-LF】 - There is little change in deposition rate and phosphorus content due to bath aging. - Usable for up to 20 turns. - Low film stress with minimal changes in stress due to continuous use. Please feel free to contact us for anything other than the above. Inquiries can be made through the contact information below.

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The low-voltage fuse "BFSL" is a compact safety component used to protect automotive electrical circuits. It prevents equipment and wiring failures by blowing the fuse when the current increases abnormally. This low-voltage fuse is recommended for those facing challenges related to circuit protection in the automotive and construction machinery industries, as well as for low-voltage fuses (below DC 70V). It is used for circuit protection of comfort features such as car navigation systems, audio systems, ETC, air conditioning, and seat heaters.

We would like to express our sincere gratitude for your continued patronage. We regret to inform you about our year-end and New Year holiday schedule as follows. We appreciate your understanding. 【Year-end and New Year Holiday Period】 From Saturday, December 27, 2025, to Sunday, January 4, 2026. *Normal business operations will resume on Monday, January 5, 2026. Inquiries received during the holiday period will be addressed sequentially after Monday, January 5, 2026. *Please note that our partner manufacturers and cooperating companies will also be on holiday. We kindly ask that you contact us as soon as possible for urgent orders or inquiries. Nippon Polystar Co., Ltd. 3-4-13 Ishibeguchi, Koka City, Shiga Prefecture Phone: 0748-77-6262 Fax: 0748-77-6662 support@nippon-polystar.co.jp Sales Headquarters

The low-voltage fuse "BFLP" is a small safety component used to protect the electrical circuits of automobiles. When the current increases abnormally, the fuse blows, preventing damage to equipment and wiring. It is recommended for those facing challenges related to circuit protection with low-voltage fuses (DC 70V or less) in the automotive and construction machinery industries. It is used for circuit protection of electrical components such as headlights, taillights, turn signals, power windows, door locks, and mirror adjustments.

The SLA5800 series thermal mass flow controllers/meters are widely adopted as standard equipment due to their excellent accuracy, stability, and reliability. This series features a wide range of flow measurement capabilities and is suitable for various temperature and pressure conditions, making it ideal for a broad range of applications including research in the chemical and petrochemical fields, analytical instruments, fuel cells, and life sciences. Contents ■Features and Benefits ■Standard Specifications ■Product Dimensions ■Model Codes ■Approvals, Certifications, and Services ■Service and Support, etc.

The pinhole inspection for packaging engineering is fully automated, eliminating packaging defects based on certain quality standards. The judgment results and operational status can be managed via a monitor screen. - Quantitative management of quality standards for the pinhole inspection process - Ensuring the quality of the product's shelf life - Establishing evaluation criteria for the manufacturing process, achieving quantitative quality assurance - Slim and space-saving design that can be connected to existing production lines - Quick changeover for product variety switching can be handled in a short time by exchanging chambers - Fully domestically produced, allowing for rapid maintenance and troubleshooting - Example target works: pillow packaging, packaged rice (packaged cooked rice), etc. *Please consult us regarding the use of this product for pharmaceuticals.