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  1. Home
  2. Chemical
  3. 奥野製薬工業 大阪・放出、東京、名古屋など
  4. A comprehensive unveiling of new plating chemicals related to semiconductors and environmental compliance!
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  • Mar 02, 2023
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Mar 02, 2023

A comprehensive unveiling of new plating chemicals related to semiconductors and environmental compliance!

奥野製薬工業 奥野製薬工業 大阪・放出、東京、名古屋など
This is Yamanaka from the Marketing Strategy Department of Okuno Pharmaceutical Industry. We have just released new product information for printed circuit boards/semiconductor package substrates, environmentally friendly electroless nickel plating chemicals, and various surface treatment chemicals all at once. 【New Product Information】 Void-free final surface treatment using a reducing cobalt catalyst solution, ICP-COA process https://www.ipros.jp/catalog/detail/694141?hub=60+794925 Plating technology for package substrates: Copper sulfate plating additive "Toprutina HLS" for high aspect ratio substrates https://www.ipros.jp/catalog/detail/694132?hub=60+794925 Contributes to productivity improvement. Electroless nickel plating solution usable for up to 20 turns https://www.ipros.jp/catalog/detail/694071?hub=60+794925 Okuno Pharmaceutical Industry will continue to contribute to future manufacturing through science to solve the challenges facing our planet. Please feel free to consult us about any issues related to surface treatment and plating.
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Void-free final surface treatment, ICP-COA process

Okuno Pharmaceutical Industry has established a final surface treatment process that forms a void-free and uniform plating film on the circuit surface.

Okuno Pharmaceutical Industry has established a final surface treatment process that forms a void-free and uniform plating film on circuit surfaces. The "ICP-COA process" is a low film thickness Ni-P/Au plating process that utilizes a reducing cobalt catalyst. This process consists of a reducing cobalt catalyst solution "ICP Accel COA" and an electroless Ni-P plating for cobalt catalysts "ICP Nicoron COA-GM." In conventional processes using palladium, the copper material corrodes during the catalyst application step, leading to the formation of voids between the copper material and the plating film, which has been a challenge. In this process, a uniform catalyst film can be formed through reduction deposition, enabling the reduction of the film thickness of electroless nickel plating (electroless nickel plating thickness: conventional process: 3.0µm, ICP-COA process: 0.5µm). Furthermore, since a void-free and well-covered film can be obtained, it is possible to reduce the film thickness of electroless Ni plating without compromising solder joint reliability.

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Copper plating additive for high aspect ratio substrates "Topluchina HLS"

Copper sulfate plating additive for high aspect ratio substrates for package substrates "Topluchina HLS"

This is the latest plating technology for semiconductor package substrates (IC substrates). Currently, electronic devices such as smartphones, computers, and servers are becoming more high-performance, leading to a reduction in the diameter of through-holes that electrically connect the layers of printed circuit boards, as well as a decrease in pitch. As a result, there is an advancement in the high aspect ratio and high density of through-holes. We have newly developed a copper sulfate plating additive for high aspect ratio substrates that can accommodate both soluble and insoluble anodes, aimed at improving the productivity and quality stability of printed circuit board production. This product excels in depositability within through-holes and vias, achieving high throwing power across a wide range of current densities.

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Contributes to increased productivity. Electroless nickel plating solution usable for up to 20 turns.

There is a track record of maintaining a precipitation rate of approximately 20 μm/h for more than 10 turns since the construction of the bath. It is possible to reduce the amount of waste liquid and achieve cost reduction.

Electroless nickel-phosphorus plating tends to have a decreased deposition rate as the number of turns progresses, and it is common to refresh the bath after 5 to 6 turns. Since updating the bath requires significant effort and time, there is a strong demand for longer-lasting electroless nickel solutions. In response, our company has optimized the balance of chelating agent combinations and concentrations to develop an electroless nickel plating solution that experiences minimal reduction in deposition rate for over 10 turns from the start of the bath. The development of this product can enhance productivity, reduce waste liquid volume and energy costs, and contribute to lowering environmental impact. 【Top Nicoron LLM-LF】 - There is little change in deposition rate and phosphorus content due to bath aging. - Usable for up to 20 turns. - Low film stress with minimal changes in stress due to continuous use. Please feel free to contact us for anything other than the above. Inquiries can be made through the contact information below.

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奥野製薬工業 大阪・放出、東京、名古屋など
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Human Body Day 2025 Event Report - Nack Image Technology

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On November 6th (Thursday) to 7th (Friday), 2025, we held the "Human Body Day 2025" at the NAC Image Technology Akasaka Multi-Purpose Space. We have uploaded videos of the highlights from each company and the presentations that took place on the day to our website. We encourage you to take a look. ---[Report on Human Body Day 2025 is here]------------------- https://info.nacinc.jp/jintaiday2025-report ------------------------------------------------------------------------- On the day of the event, participants were able to experience a wide range of products in a hands-on session format, including motion capture, force plates, eye tracking, and human body analysis software. We received numerous comments from attendees expressing high satisfaction, saying, "It was great to gain various information all at once," which makes us very happy. NAC Image Technology will continue to provide "valuable products to our customers." We hope you will join us for our next event as well.

Mar 20, 2026

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【Metal Crack Repair】We repair cracks in metal products without applying heat.

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The "Mechanical Stitch Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without causing any thermal impact to the base material. Repairs can be carried out in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If a detailed technical explanation is needed, please contact us.

Mar 20, 2026

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Aluminum casting repair: Metal crack repair without applying heat.

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The "Mechanical Stitching Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without causing any thermal impact on the base material. Repairs can be carried out in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If a detailed technical explanation is needed, please contact us.

Mar 20, 2026

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[Cast Iron Crack] We will repair cracks in metal products without applying heat.

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The "Mechanical Stitching Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without causing any thermal impact on the base material. Repairs can be carried out even in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is kept to a minimum. ◎ For more details, please contact us. ◎ If a detailed technical explanation is needed, please contact us.

Mar 19, 2026

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[Cast Iron Crack] We will repair cracks in metal products without applying heat.

  • NEW
  • CATALOG

The "Mechanical Stitching Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without causing any thermal impact to the base material. Repairs can be carried out in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If a detailed technical explanation is needed, please contact us.

Mar 19, 2026

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