Furcarbon Technology Webinar / CFRP Plate Furcarbon Technical Explanation "Regarding Reliability Test Results and Precautions During Processing"

Standard grade of Felcarbo. It is a plate with minimal strength variation on the surface.

**Features** - Solves the machining difficulties associated with CFRP, enabling high-precision processing using carbide cutting tools typically used for metal machining. - Achieves thick plate formation of up to 45mm by using thick felt-like carbon fibers, allowing for greater freedom in processing shapes while being offered at a lower price than conventional CFRP. - Even when compared to lightweight aluminum alloys (A5052), its specific gravity is only about half. At a size of Φ450×10, it weighs approximately 2.1kg, making it very lightweight, with a tensile strength about 1.3 times that of aluminum alloys. - The coefficient of thermal expansion is approximately 7.5×10^(-6)/℃, which is about 30% of that of aluminum alloys and about 60% of carbon steel. Compared to common metals, it exhibits high dimensional stability against temperature changes. - Other features include: - Thermal insulation - Non-magnetic - Corrosion resistance (no rust or corrosion occurs)

• fiber
• Composite Materials
• Other polymer materials

[Tokyo] The "Practical Solution Fair 2026," hosted by Otsuka Corporation, will be held from February 4 (Wednesday) to February 6 (Friday), 2026, in Tokyo, and from February 18 to February 19 (Thursday) in Osaka. We would like to inform you that paperlogic's electronic contract and paperlogic's construction document DX pocket will each have a booth at the event. The Practical Solution Fair is Otsuka Corporation's largest IT comprehensive exhibition held once a year. The theme is "Expanding with AI! Complete DX." Paperlogic will also promote the DX of your business document management using AI technology. [Event Information - Tokyo Venue] Date: February 4 (Wednesday) to February 6 (Friday), 2026 (Registration starts at 9:30 / Registration ends at 17:00 *Entry on the first day starts at 10:00) Venue: The Prince Park Tower Tokyo Address: 4-8-1 Shiba Koen, Minato-ku, Tokyo Participation Fee: Free (Pre-registration required) Deadline: Until 17:00 on the day of the event [How to Participate in the Tokyo Venue] To participate in the Practical Solution Fair, please proceed to the registration link from the related links. *An Otsuka ID is required for registration.

We will hold an online customer factory tour at Fukazawa Manufacturing Co., Ltd. in Ashigarakami-gun, Kanagawa Prefecture, which has recently introduced the servo bending machine "EGB-1303ATCe" equipped with an automatic mold exchange device that considers both people and the environment. On the day of the event, we will conduct interviews with representatives and staff, where they will share the secrets behind achieving quality and delivery times comparable to those of veteran employees by young workers. Attendees will also be able to see the processing of high-difficulty bending products that fully utilize the machine's functions and performance. Additionally, we will answer questions from viewers in a live format.

Our company will be exhibiting at "BATTERY JAPAN 2026," which will be held at Tokyo Big Sight for three days from March 17 (Tuesday) to March 19 (Thursday), 2026. <BATTERY JAPAN 2026> Dates: March 17 (Tuesday) to March 19 (Thursday), 2026, 10:00 AM to 5:00 PM Venue: Tokyo Big Sight, South Hall 4 Booth Number: S24-13 At this exhibition, we will showcase the following products from our company: - EDLC Modules (Standard type, Heat dissipation type, Type with fan) - EDLC Application Products (Jump starters, Hybrid [EDLC + Lithium-ion battery integrated]) - Battery Products (AGM, Lithium-ion) Additionally, we will display a demonstration unit that combines a small press machine with EDLC, allowing you to understand the effectiveness of EDLC usage. We sincerely apologize for the inconvenience during your busy schedule, but we humbly invite you to visit us at this opportunity.

Are there any tasks such as on-site reports, inspections, or daily reports that you think would be convenient if they could be done with an app, but have not been realized yet? In this seminar, we will introduce how easily business apps can be created using the no-code tool "Platio," and how they are used on-site, focusing on actual screen demonstrations. By observing the flow of app creation and the user experience, you will be able to determine if Platio fits your company's operations and visualize how it can be utilized. This seminar is recommended for those who have heard of Platio but want to know specifically what it can do and how it can be used.

[Speaker] Kuniaki Suzuki, General Manager, Cloud & AI Services Division 1, AI Platform Development Headquarters, SoftBank Corp. [Key Lecture Content] AI technology is advancing at an accelerating pace, and the likelihood of achieving AGI within the next few years is increasing. Under the philosophy of promoting the social implementation of AI to realize a true digital society, SoftBank is making large-scale investments and developments in various technologies and infrastructures as part of its next-generation social infrastructure initiative. This lecture will introduce the overall picture of the next-generation social infrastructure initiative and its efforts, discussing the market conditions and challenges in Japan that form the background, as well as SoftBank's approaches and specific initiatives to address these challenges. [Lecture Items] 1. Current digital environment and future trends 2. Challenges in Japan 3. About the next-generation social infrastructure initiative 4. Initiatives (data centers/cloud computing infrastructure/AI) 5. Q&A / Business card exchange