【Case Study of Partnered Bag Production】Successfully solved customer issues with 【Seal Reinforcement】! - Addressed the weaknesses of laminated processing by enhancing the sides with seal reinforcement -

We addressed the weaknesses of the laminate processing by reinforcing the sides with seal support.

The lamination process involves bonding OPP film and CPP film together. It is common to use OPP film on the outside for good ink adhesion and high moisture resistance, and CPP film on the inside for excellent heat sealability and abrasion resistance. The customer this time also requested OPCP laminated bags. However, we heard that when they previously had bags made, the seal strength was weak, and the sides of the bag's opening were very prone to tearing. The reason for this is that during the lamination process, slight differences in the tension applied by the machine when bonding the films and the way the adhesive adheres can create minor variations in adhesion. This can lead to the edges opening when the film is placed on the bag-making machine, resulting in issues with proper fusion of the sides. To address this problem, we utilized a "reinforcement seal." When applying the reinforcement seal, we took care to ensure that: - The temperature was not too high to prevent deformation of the bag. - The marks left by the reinforcement on the bag were minimized. To consider these two points, we made sure to manage the temperature during the process. The issue was successfully resolved, and the customer was satisfied!

• Packaging Bags

Realizing Precision Control in Energy Innovation Hydrogen, fuel cells, CCUS, biofuels, CNT manufacturing. There are technologies on-site that monitor precise flows to support the energy of the future. Brooks Instrument's flow meters support the energy transition.

The "Mechanical Stitching Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without causing any thermal impact on the base material. Repairs can be carried out in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If a detailed technical explanation is needed, please contact us.

We are pleased to announce that our company will be exhibiting at the "Monozukuri Fair 2025" held in Fukuoka. ECAD is a dedicated CAD solution for electrical design, equipped with a wealth of features for control design and power distribution panel design, developed for domestic electrical designers over the past 40 years. It addresses challenges such as improving design quality, enhancing operational efficiency, and reducing labor. At the venue, we will introduce the "Panel Manufacturing Skill-less Solution," which utilizes the panel manufacturing support system "WIRE CAM DX" to create pre-manufacturing information as a solution to the labor shortage issues in panel manufacturing that have traditionally required skilled workers. This enables less experienced operators to achieve high-quality manufacturing in processes such as wire processing, component assembly, and wiring work. We invite you to visit our exhibition booth. ■ Exhibition Name: Monozukuri Fair 2025 ■ Location: Marine Messe Fukuoka Hall A & B ■ Booth Number: Hall B BN-9 ■ Dates: October 15 (Thursday) to October 17 (Saturday), 2025 (3 days) ■ Hours: 10:00 AM to 5:00 PM (last day until 4:00 PM) *For more information about the exhibited products, please download the materials. Feel free to contact us with any inquiries.

Features ● PICO-ITX standard ● Equipped with Intel Core Ultra 7 255U / Ultra 5 225U ● 16/32GB onboard memory ● 2.5GbE + 1GbE ● HDMI 1.4 + eDP 1.4 ● M.2 2280 M-Key x 1 (PCIe 4.0 [x4]/SATA) ● M.2 2230 E-Key x 1 (PCIe 4.0 [x1] + USB 2.0) ● USB 3.2 Gen 2 x 2 + USB 2.0 x 2 ● RS-232/422/485 x 2 ● TPM, GPIO 4-bit, SATA 6Gb/s x 1 ● SMBus/I2C (Default: SMBus) ● Intel AMT Support * This model does not include storage or OS.

Features: ● PICO-ITX standard ● Equipped with Intel Atom x7433RE/x7835RE ● DDR5 4800MHz×1 (up to 16GB) (sold separately) ● HDMI 1.4×1, eDP 1.4b/LVDS×1 ● 2.5GbE×1, GbE×1 ● Full-Size mSATA, M.2 2230 E-key x1 ● USB 3.2 Gen2[x1]×2, USB 2.0×4 ● RS-232/422/485×2, RS-232×2 ● TPM 2.0, SATA 6.0Gbps×1, GPIO 4-bit, SMBUS/I2C×1 * This is a model without an operating system.