Mechatronics Tech Japan 2011 (abbreviated as MECT2011) Exhibition Information

~We will assist with Japanese manufacturing!~
We are pleased to announce that Eiseiki Co., Ltd. will be exhibiting at "Mechatrotech Japan 2011 (abbreviated: MECT2011)."
Our new wire-cut bridge allows for horizontal leveling of large workpieces and can reduce setup time.
The precision grinding cylindrical device can process round pins and perform pin machining while rotating on a profile grinding machine.
■ Dates: September 29 (Thursday) to October 2 (Sunday) - 4 days
■ Venue: Port Messe Nagoya (Nagoya International Exhibition Center) Halls 1, 2, and 3
■ Booth Number: 1D19
【Main Exhibited Products】
- Wire-cut Bridge (NEW)
- Wire-cut Vise
- Punch Index (with two-axis adjustment function) (NEW)
- Precision Grinding Cylindrical Device (NEW)
- Precision Vise
We look forward to your visit.
*For more details, please contact us directly.


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