[MST Homepage] Analysis Case "Investigation of Curing Temperature and Glass Transition Temperature of Epoxy Resin" has been published.

We have published analysis cases on the MST homepage.
◆Title
Investigation of Curing Temperature and Glass Transition Temperature of Epoxy Resin
~Thermal Property Evaluation by DSC (Differential Scanning Calorimetry) Measurement~
◆Measurement Method / Processing Method
DSC
◆Product Field
Electronic Components / Daily Necessities
◆Analysis Purpose
Product Investigation / Thermal Property Evaluation
◆Overview
Using DSC (Differential Scanning Calorimetry), we investigated the curing temperature and the glass transition temperature (Tg), which is an indicator of heat resistance, for a two-component epoxy resin. The DSC measurement of the uncured resin confirmed that a rapid exothermic reaction began around 103°C (Figure 1). This was due to the polymerization (curing) of the resin caused by the temperature increase. Furthermore, after air cooling the cured resin to room temperature, a second DSC measurement showed a shift of the baseline towards the endothermic side due to the glass transition of the resin, with Tg being approximately 116°C (Figure 2).
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Evaluation of thermal properties by DSC (Differential Scanning Calorimetry) measurement
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