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  1. Home
  2. Testing, Analysis and Measurement
  3. 一般財団法人材料科学技術振興財団 MST
  4. Notice of the Electron Microscope and FIB Seminar hosted by Hitachi High-Technologies Corporation
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  • Jan 19, 2012
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Jan 19, 2012

Notice of the Electron Microscope and FIB Seminar hosted by Hitachi High-Technologies Corporation

一般財団法人材料科学技術振興財団 MST 一般財団法人材料科学技術振興財団 MST
The seminar "Hitachi Materials Analysis Seminar 2012 (Nagoya)" hosted by Hitachi High-Technologies Corporation will feature a lecturer from the MST (Foundation for the Promotion of Material Science and Technology). The analysis of lithium-ion secondary batteries will be reviewed based on analytical data. We look forward to your participation. ● Date and Venue February 3, 2012 (Friday) 13:00 - 17:40 17th Floor, Takisada Building, Nagoya City, Aichi Prefecture ● Participation Fee and Registration For more details, please visit the Hitachi High-Technologies website. ● Overview of the MST Lecturer's Course - Title Cryo FIB-TEM Method under Controlled Atmosphere - Application to Lithium-Ion Secondary Batteries - Lecturer TMG Eguchi, Analysis and Evaluation Department, Foundation for the Promotion of Material Science and Technology
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Hitachi High-Technologies: Information on Electron Microscope and FIB Seminar
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MST supports your research and development with contract analysis services! Please feel free to contact us first.

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[FIB] Focused Ion Beam Processing

FIB refers to a focused ion beam with a diameter ranging from a few nanometers to several hundred nanometers, which can be used to scan the sample surface to etch or deposit material in specific areas.

FIB refers to a focused ion beam with diameters ranging from several nanometers to several hundred nanometers, which can be used to etch specific areas (sputtering) or deposit materials such as carbon (C), tungsten (W), and platinum (Pt) onto specific regions by scanning the sample surface. Additionally, the shape of the processed sample can be recognized through SIM images, which detect secondary electrons generated by irradiating the sample with the ion beam. - Arbitrary shape processing through etching in micro-regions (several nanometers to several tens of micrometers) is possible (typical processing size: around 20 μm) - Sample preparation for SEM, SEM-STEM, and TEM imaging (cross-sections of specific areas can be produced) - Fine pattern deposition and thin film formation (C, W, Pt deposition) are possible in the range of several micrometers to several tens of micrometers - High-resolution SIM (Scanning Ion Microscope) imaging is possible (acceleration voltage 30 kV: 4 nm) - Observation of metal crystal grains (Al, Cu, etc.) is possible with SIM images.

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(S)TEM (Scanning Transmission Electron Microscopy)

Elemental analysis, state evaluation, particle size analysis, and acquisition of three-dimensional structural images at the nanoscale.

TEM (Transmission Electron Microscopy) is a method that involves irradiating a thin sample with an electron beam, imaging the electrons that have passed through or scattered from the sample, and observing it at high magnification. ■ Advantages - Enlarged images can be obtained with sub-nanometer spatial resolution, allowing for the observation and analysis of the sample's fine structure and lattice defects. - It is possible to evaluate the crystallinity of the sample and identify materials. - By fabricating samples using FIB (Focused Ion Beam), it is possible to observe specific locations within a device with pinpoint accuracy. - By combining optional features, it is also possible to analyze the composition and state of localized areas. ■ Disadvantages - It is necessary to thin the sample (in some cases, thinning may be difficult for certain samples). - It does not observe individual atoms but rather displays average information in the thickness direction of the sample (typically about 0.1 μm thick). - Sample processing and observation may lead to alteration or deformation of the sample.

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【Metal Crack Repair】We repair cracks in metal products without applying heat.

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The "Mechanical Stitching Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without causing any thermal impact on the base material. Repairs can be carried out even in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If a detailed technical explanation is needed, please contact us.

May 15, 2026

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Casting prototype and casting repair.

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The "Mechanical Stitching Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without affecting the base material with heat. Repairs can be carried out in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If a detailed technical explanation is needed, please contact us.

May 15, 2026

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Casting sand mold 3D printer prototype production

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● The production time for cast prototypes can be shortened! Since model making is not required, the production time for prototypes, which previously took about a month, can be significantly reduced. ● Model costs can be reduced! By directly producing sand molds from 3D data, there is no need for model production costs. If changes to the model are necessary, they can be addressed by modifying the 3D data. ● Similar products with different shapes and dimensions can be prototyped simultaneously! Different products, such as similar shapes or varying dimensions, can be molded at the same time in one molding process. This allows for the verification of multiple types in a short period.

May 15, 2026

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The situation on the day.

The Spring Safety Conference for the 8th year of Reiwa was held.

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Last month, we held a spring safety conference hosted by our company. We have compiled the details and atmosphere of the day into a PDF. We would appreciate it if you could take a moment to read it.

May 15, 2026

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[Recommended On-Demand Streaming] A Review of 21 CFR Part 11 and DI Compliance | Explaining the Basic Concepts of Electronic Records and Electronic Signatures Compliance

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In recent years, as the importance of data integrity (DI) compliance in GMP environments has increased, there has been a growing call to deepen understanding of 21 CFR Part 11. This content introduces an on-demand presentation that organizes the background of Part 11, its relationship with DI, and its positioning in CSA guidance, while explaining the basic concepts of electronic records and electronic signatures. ■Content - Background and basic concepts of Part 11 - Relationship with data integrity (DI) - Positioning in CSA guidance - Basic requirements for electronic records/electronic signatures *This content is based on information as of March 17, 2026. *The information provided is intended for general informational purposes and does not guarantee specific compliance or suitability.

May 15, 2026

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