Equipped with trim forming: Supports tray alignment and transfer! Introducing the lead frame processing device (TF device) Fusion MTF1 after molding.

We also propose the processing of leads after molding, from the device to the mold! This is a trim forming device that automatically processes the cutting and bending of lead terminals for semiconductor electronic components, aligns and transfers them onto a transport tray after cutting them into individual pieces. It is equipped with a 3t servo press with 2 heads. We design the device to meet our customers' needs. Additionally, we handle everything from design to manufacturing for various types of tie bar cutting molds, lead cutting molds, forming molds, and more, tailored to the device.

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