Thermal Design and Thermal Countermeasure Consulting Case Study 3

We conducted a benchmark of existing products to consider the application of new thermal management components for the development of new thermal management parts. In the benchmark, we disassembled the actual device and measured the temperatures of the installed electrical components to understand the thermal design of the actual device. We created a model for three-dimensional thermal fluid analysis using 3D thermal fluid analysis software, allowing for various investigations, and aligned it with the actual device temperatures. As a result of this initiative, we can now examine new thermal management components using 3D thermal fluid analysis without having to manufacture the actual device.

Inquiry about this news
Contact Us Online