[Introduction of Case Studies on Problem Solving] Current Fit → Clearance Setting Improvement of Maintenance for Automotive Component Cutting Molds

We will introduce a case that solved the customer's issue of poor maintenance of molds used for current matching production!

Our company utilizes the precision mold processing technology cultivated in the manufacturing of precision molds for semiconductors to design and manufacture molds that can maintain a certain level of accuracy even when punches and dies are replaced as consumables. For molds in fields other than semiconductors, we can also provide proposals based on the know-how gained in the semiconductor industry, so if you have any issues with molds, please feel free to contact us. This time, we would like to introduce a case where we solved a customer's problem regarding a mold with poor maintainability due to its current matching production. 【Problem】 Poor maintainability of molds produced with current matching - In molds produced with current matching for punches and dies, even if one wants to replace either the punch or the die, they must purchase both the punch and die as a set. - It sometimes requires sending the entire mold set back to the mold manufacturer for punch and die replacement, making maintenance at the customer's site difficult. 【Solution】 Improved maintainability through appropriate clearance design + precision processing technology - By providing clearance for the punch and die and finishing them with micron-level precision, it became possible to replace them at the customer's site without current matching when either the punch or die wears out.

• Mold Design
• Processing Contract

Leave the processing of micron-level work to us!

We would like to outsource because it is difficult to achieve the required precision in-house. We do not have enough manufacturing capacity for parts processing. Do you have such concerns? With our core technology in precision mold processing, we can handle the machining of precision parts specified by your company.

• Plastic Mould

The "Mechanical Stitch Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without causing any thermal impact to the base material. Repairs can be carried out in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If a detailed technical explanation is needed, please contact us.

The "Mechanical Stitching Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without causing any thermal impact on the base material. Repairs can be carried out in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If a detailed technical explanation is needed, please contact us.

Features: ● Equipped with Intel Core Ultra 7 255H/7 155H/5 225H/5 125H ● LPDDR5x 16GB/32GB/64GB onboard ● M.2 NVMe 256GB onboard ● USB 2.0 x 8, USB 3.2 (10Gbps) x 4 ● PCIe Gen 4 [x8] x 1, PCIe Gen 3 [x1] x 4, PCIe Gen 3 [x4] x 1 (2 lanes co-lay with SATA; BOM option) ● 2.5GbE x 2 ● COM-HPC Mini standard, size 95mm x 70mm ● Optional items ECB-980A: Development carrier board HPC-ARHm-FAN01: CPU fan HPC-ARHm-HSP01: Heat spreader (Note: heat dissipation is required in the enclosure)

Features: ● Equipped with Jetson AGX Orin 32GB/64GB ● Gigabit LAN ×1, 10Gigabit LAN ×1 ● USB 3.2 Gen 2 (Type-A) ×4 ● DB-9 connector ×1 (for DIO 8 channels) ● DB-9 connector ×2 (supports RS-232/422/485: Rx/Tx/RTS/CTS) ● Jetpack 6.0.0 pre-installed

Features: ● Equipped with Intel Atom x7835RE/x7433RE ● LPDDR5x 8GB/16GB onboard ● eMMC 32GB/64GB onboard ● LVDS x 1, DDI x 1 ● USB 2.0 x 8, USB 3.2 Gen 2 x 2 ● PCIe x1 x 4 ● COMe Type 10 standard, 84mm x 55mm size ● Operating temperature -40 to 85℃ ● Optional items ECB-920A-0001: Development carrier board NANOCOM-ADN-FAN01: CPU fan NANOCOM-ADN-HSP01: Heat spreader (※ Heat dissipation is required in the enclosure)