Understand it all in just 3 minutes! Free catalog available! 'Semiconductor PKG Trim and Forming Mold Textbook <Preserved Edition>'

【All 8 pages! A clear illustration of the 5 main processes of trim and forming molds!】
"Trim and forming molds" refer to the molds used for cutting and bending the lead parts and unnecessary resin after semiconductor package molding.
Trim and forming molds (T/F molds) have various roles tailored to different processes.
This document provides a clear explanation of each process with illustrations.
We are currently offering this catalog for free.
Feel free to download it.
【Contents】
■ What are trim and forming molds?
■ Pre-cutting
- Gate cut
- Tie bar cut
- Support cut
■ Post-cutting
- Lead cut
- Lead forming
■ Summary
■ Introduction of related products and services
■ Company overview

Inquiry about this news
Contact Us Online