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Detach and release! Can be attached to the existing device's base plate. A diamond grinding pad that enables high-quality processing of glass materials easily, cleanly, and efficiently.

SQUADRO-G2 is the second generation product of the innovative and efficient diamond grinding pad SQUADRO-G. The new manufacturing process allows for more flexible provision of products in various sizes. In terms of performance, SQUADRO-G2 maintains a high grinding rate until the moment of use, resulting in high surface quality. With its long product lifespan and ease of use, SQUADRO-G2 serves as an economical and efficient alternative to other grinding pads and traditional lapping methods. 【Features】 ■ Compatible with various outer diameter sizes ■ Longer lifespan and more economical compared to other grinding pads ■ Cleaner than slurry lapping ■ High flatness and surface quality, precise edges ■ Easily achieves non-free abrasive by adhering to existing equipment's base plates 【Main Applications】 Optical glass, BK7, quartz glass, aluminum nitride, lithium tantalate, etc. *The grinding pad SQUADRO is available in three different bond hardnesses to suit various applications. For more details, please refer to the catalog or feel free to contact us.

• Grindstone

Metal bond grinding pads with high grindability, long lifespan, and compatibility with almost all cooling lubricants (coolants).

This is a polishing pad recommended for grinding workpieces made of ceramics, glass, and various metals. It maintains a high polishing rate due to diamond abrasives fixed with a metal bond. In addition to maintaining high grindability and long lifespan, it is compatible with almost all cooling lubricants (coolants) due to its metal bond specification. 【Features】 ■ High grindability capable of polishing sapphire ■ Always flat and precise edges ■ More economical than grinding paper or slurry ■ Environmentally friendly as it does not require slurry *For more details, please feel free to contact us.

• Grindstone

Softly controlling the hard! A slurry for polishing hard substrates blended with silica and diamond. By using it before CMP, it shortens the process time.

This is a recommended pre-CPM slurry for polishing hard materials such as sapphire, SiC, and silicon nitride. By using it before CMP, you can shorten the CMP process time. 【Recommended for the following situations】 ■ Those who want to shorten the CMP process time ■ Those who want to efficiently remove fine scratches, etc. ■ Those who want to reduce the load of potassium permanganate slurry *For more details, please feel free to contact us.

• Other abrasives

Advanced microporous structure polyurethane block. Recommended for optical material polishing using high-speed CNC and spindle grinding equipment.

The IC OPTIC Puck is a polyurethane block with a fine pore structure recommended for polishing flat and spherical optical materials. It can be used with high-speed CNC polishing machines and spindle polishing machines, replacing traditional metal or glass molding tools with bonded petal-shaped pads. It is provided in a cylindrical block form, allowing you to shape it into your desired form during use. The shaping method can be viewed in related videos. 【Features】 - Improved polishing capability due to the uniform fine pore structure throughout the product. - Stable processing accuracy regardless of the target shape. - Easy shaping through machining, enabling low costs through multiple reuses. - Less frequent dressing processing, allowing for long hours of polishing. - Supports polishing while maintaining surface shape even for sudden R and other difficult shapes. - Low risk of shape distortion, enabling support for improved accuracy of polished parts. *Please feel free to contact us for more details.

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• Other abrasives

The "Mechanical Stitch Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without causing any thermal impact to the base material. Repairs can be carried out in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If a detailed technical explanation is needed, please contact us.

The "Mechanical Stitching Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without causing any thermal impact on the base material. Repairs can be carried out in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If a detailed technical explanation is needed, please contact us.

On November 6th (Thursday) to 7th (Friday), 2025, we held the "Human Body Day 2025" at the NAC Image Technology Akasaka Multi-Purpose Space. We have uploaded videos of the highlights from each company and the presentations that took place on the day to our website. We encourage you to take a look. ---[Report on Human Body Day 2025 is here]------------------- https://info.nacinc.jp/jintaiday2025-report ------------------------------------------------------------------------- On the day of the event, participants were able to experience a wide range of products in a hands-on session format, including motion capture, force plates, eye tracking, and human body analysis software. We received numerous comments from attendees expressing high satisfaction, saying, "It was great to gain various information all at once," which makes us very happy. NAC Image Technology will continue to provide "valuable products to our customers." We hope you will join us for our next event as well.

Features: ● Equipped with Intel Core Ultra 7 255H/7 155H/5 225H/5 125H ● LPDDR5x 16GB/32GB/64GB onboard ● M.2 NVMe 256GB onboard ● USB 2.0 x 8, USB 3.2 (10Gbps) x 4 ● PCIe Gen 4 [x8] x 1, PCIe Gen 3 [x1] x 4, PCIe Gen 3 [x4] x 1 (2 lanes co-lay with SATA; BOM option) ● 2.5GbE x 2 ● COM-HPC Mini standard, size 95mm x 70mm ● Optional items ECB-980A: Development carrier board HPC-ARHm-FAN01: CPU fan HPC-ARHm-HSP01: Heat spreader (Note: heat dissipation is required in the enclosure)

Features: ● Equipped with Jetson AGX Orin 32GB/64GB ● Gigabit LAN ×1, 10Gigabit LAN ×1 ● USB 3.2 Gen 2 (Type-A) ×4 ● DB-9 connector ×1 (for DIO 8 channels) ● DB-9 connector ×2 (supports RS-232/422/485: Rx/Tx/RTS/CTS) ● Jetpack 6.0.0 pre-installed