Achieving mirror finish processing with the craftsmanship of "Takumi"! Mold for semiconductor packages with lenses.

Custom mold design compatible with existing molding equipment is also possible! We have a track record of producing opto-modules and more! At Rohm Mecatech, we have extensive experience with mold molds for packages with lenses.
Through EDM processing, we can achieve a mirror finish of 0.5μRZ (0.7μRy) for semiconductor package sections measuring 30mm square. Using new equipment introduced in each process, our skilled workers carefully and precisely complete the machining.
Additionally, we focus on materials with minimal aging changes and high-quality finishes, providing molds designed for long-term use.
**Features**
- Achievable mirror finish of 0.5μRZ (0.7μRy) for semiconductor package sections measuring 30mm square through EDM processing
- Use of new equipment introduced in each process
- Skilled workers complete machining with care and high precision
- Molds designed for long-term use
*For more details, please refer to the PDF document or feel free to contact us.*

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