Achieving mirror finish with the craftsmanship of "Takumi"! Mold for lens-equipped semiconductor packages.

Custom mold designs compatible with existing molding equipment are also possible! We have a track record of producing opto-modules and more! At Rohm Mecatech, we have extensive experience with mold designs for packages with lenses.
Through EDM processing, we can achieve a mirror finish of 0.5μRZ (0.7μRy) for semiconductor package sections measuring 30mm square. Using new equipment introduced in each process, our skilled workers meticulously and precisely complete the machining.
Additionally, we focus on materials with minimal aging changes and high-quality finishes, providing molds designed for long-term use.
**Features**
- Achievable mirror finish of 0.5μRZ (0.7μRy) for semiconductor package sections measuring 30mm square through EDM processing
- Utilization of new equipment introduced in each process
- Skilled workers ensure meticulous and high-precision machining
- Molds designed for long-term use
*For more details, please refer to the PDF document or feel free to contact us.*

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