CUI Devices expands its lineup of BGA heat sink products.

A new lineup of 15 models has been added to the BGA heat sink collection. The size range has expanded from 8.5 x 8.5mm to 69.7 x 69.7mm, with thicknesses from 5mm to 25mm, covering power consumption (75℃ΔT, natural air cooling) from 1.92W to 21.74W. Each thermal resistance under various conditions is specified, making it easier to evaluate the heat sinks.
Thermal Resistance:
@75ΔT, natural air cooling: 3.45–39.1 ℃/W
@1W, natural air cooling: 4.2–43.3 ℃/W
@1W, 200LFM: 1.2–16.5 ℃/W
@1W, 400LFM: 0.8–12.3 ℃/W
Power Consumption (@75ΔT, natural air cooling): 1.92W–21.74W
Mounting Type: Push pin / Adhesive
Material & Finish: AL6063-T5 / Copper - Black anodized / Cleaned
Heat Sink Introduction Page >>
https://jp.cuidevices.com/catalog/thermal-management/heat-sinks/bga-heat-sinks


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This is the introduction of new products by CUI Japan for April 2024.