Expansion of CUI's BGA heat sink lineup, covering sizes from 8.5mm to 69.7mm and power consumption from 1.92W to 21.74W.
A total of 15 new models have been added to the BGA heat sink lineup. The size range has expanded from 8.5 x 8.5mm to 69.7 x 69.7mm, with thicknesses from 5mm to 25mm, covering power consumption (75℃ΔT, natural air cooling) from 1.92W to 21.74W. The thermal resistance under various conditions has been specified, making it easy to evaluate the heat sinks.
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basic information
Thermal Resistance: @75ΔT, natural air cooling: 3.45～39.1 ℃/W @1W, natural air cooling: 4.2～43.3 ℃/W @1W, 200LFM: 1.2～16.5 ℃/W @1W, 400LFM: 0.8～12.3 ℃/W Power Consumption (@75ΔT, natural air cooling): 1.92W～21.74W Mounting Type: Push pin / Adhesive Material & Finish: AL6063-T5 / Copper - Black anodized / Cleaned Heat Sink Introduction Page >> https://jp.cuidevices.com/catalog/thermal-management/heat-sinks/bga-heat-sinks
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Applications/Examples of results
Industrial substrate, Peltier heat dissipation
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Company information
Same Sky Japan (formerly CUI Japan) is a group company of the American electronic components manufacturer Same Sky (formerly CUI DEVICES) and serves as a sales base for the Japanese market. Our mission is to provide customers with a collaborative design experience, supporting them in achieving their design goals on schedule and within budget. Same Sky Japan offers a wide range of products, including connectors, audio, temperature management, motion control, sensors, and switches. We also handle power products from partner companies such as CUI Inc. Both Same Sky and Same Sky Japan strive to be a trusted and approachable source of electronic components that continuously evolves. We are committed to providing the best support to our customers through our extensive online resources and experienced staff, ensuring that we address various changes and issues that arise during the design phase and contribute to the success of their projects.