Announcement of Yamashita Material's participation in the Electronic Equipment Total Solution Exhibition/JPCA Show 2024 from June 12 to June 14, 2024, showcasing the latest flexible substrates all in one place.

"FPC Manufacturing Case Studies" now available! Single-sided FPC production starts from 1 day and double-sided FPC production from 2 days, with production available from 1 piece. We also support pattern design and component assembly.

At Yamashita Material Co., Ltd., we offer a short delivery manufacturing service for flexible printed circuit boards (FPC). We handle not only FPC production but also pattern design, component assembly, and component procurement. We cater to a wide range of needs, from prototype production for research and development purposes to small-lot mass production. 【Features】 We provide short delivery times for small-scale production of single-sided FPC, double-sided FPC, pattern design, and component assembly. 【Delivery Time Estimates】 Single-sided FPC: Shortest delivery time of 1 working day to standard delivery time of 15 working days Double-sided FPC: Shortest delivery time of 2 working days to standard delivery time of 20 working days FPC assembly: Additional 1 working day to the above delivery times. *Weekends, holidays, and designated company holidays are not counted in the delivery time. *Delivery times may vary depending on product specifications and quantities. *There are restrictions on the number of components for assembly. The standard specification is for 30 or fewer components for single-sided assembly and 30 or fewer boards.

• Printed Circuit Board

Suitable for incorporation into curved and narrow spaces. It can form high current circuits with a thin shape and low inductance.

Big Elec is a flexible printed circuit board designed for high current wiring, achieving a flat shape and thin profile as an alternative to busbars and wire harnesses. It boasts three remarkable features. 【Feature 1】 Low Inductance Thanks to its unique structure, it achieves lower inductance compared to conventional wires with the same conductor cross-sectional area. When switching high currents at high frequencies, high inductance can cause significant voltage spikes, potentially damaging high current-compatible electronic components. The low inductance of Big Elec reduces voltage spikes, contributing to the reliability of high current-compatible electronic components. 【Feature 2】 Flat Shape and Flexibility Its unique structure allows for a thin conductor, flat shape, and flexibility. It is flatter than traditional wire harnesses and can handle higher currents than conventional flexible printed circuit boards. 【Feature 3】 High Design Freedom It ensures design freedom and usability similar to printed circuit boards. Pattern wiring and external shapes can be customized according to requirements. It also supports the mounting of electronic components and connectors using paste solder.

• Harness

Can be used with bent shapes and supports high-speed transmission! Ideal for integration in tight spaces. Integration of connections between circuit boards is also possible. *There is a video that explains it in 2 minutes!

The "Card Edge Compatible Multi-Layer Flexible Printed Circuit Board (FPC)" provided by our company is a multi-layer flexible circuit board designed to accommodate card edge connectors with double-sided contacts. By reducing the connection points between printed circuit boards and flexible circuit boards, a stable impedance line is formed, which is expected to improve signal integrity at high frequencies of 10 GHz and above. The substrate uses polyimide film, and soft resist ink is used as the insulating material, allowing for flexibility, making it suitable for installation in tight spaces. 【Features】 ■ A partially bendable structure that has similar functionality to rigid-flex boards, enabling the formation of highly reliable vias. ■ A structure that integrates flexible and rigid parts without connection points or via transitions, allowing for the formation of stable impedance lines. ■ High-density wiring is possible with 100μm pitch wiring and vias with a land diameter of 300μm or less. ■ Integration of connections between boards contributes to a reduction in assembly labor. *For more details, please refer to the PDF materials. Feel free to contact us with any inquiries.

• Board to FPC connector

The thinning of flexible substrates is effective for assembly in narrow spaces! Required in areas where low spring back and high bending flexibility are needed.

Achieving Thinness While Maintaining Transmission Characteristics! 【Features】 ■ This technology resolves the relationship between the thickness of the FPC and conductor loss, which is a challenge of microstrip lines. ■ By incorporating a slit design in the ground (GND) plane, it is expected to achieve a thinner FPC while maintaining transmission characteristics. ■ A 0mm slit processing is applied between patterns, accommodating a bendable 'slit shape'. *For more details, please refer to the PDF document or feel free to contact us.

• High frequency/microwave parts
• Printed Circuit Board
• Wiring materials

Excellent flexibility! An essential item in situations where EMC measures are necessary.

The "L Shielded Type (SFC)" is equipped with a shield film applied to our YFC. An essential item in scenes where EMC measures are required. The shield film uses a thin membrane, ensuring that flexibility is not compromised. 【Features】 ■ YFC cable using shield film ■ Utilizes thin film shielding ■ Excellent flexibility *For more details, please refer to the PDF document or feel free to contact us.

• Wiring materials

It is suitable for high-frequency applications in the tens of GHz range, and because it allows for high-density RF lines compared to PCBs, it is effective for miniaturizing products.

The "high-speed transmission multilayer flexible substrate" reduces reflection points by integrating FPC and rigid substrates. It is suitable for high-frequency applications in the 10-30GHz range and allows for high-density RF lines compared to rigid substrates, making it effective for miniaturization of products. It also supports wire bonding and can have metal or ceramic reinforcement plates attached for heat dissipation measures. 【Features】 ■ Heat dissipation measures can be implemented by attaching reinforcement plates made of metal or ceramics ■ Miniaturization is possible due to high-density RF lines ■ Compatible with wire bonding *For more details, please refer to the PDF document or feel free to contact us.

• Wiring materials

Combining PTFE base and low dielectric coverlay to produce various low-loss FPCs!

Our company manufactures low-loss flexible substrates (GHz band, Microstrip Line). We would like to introduce a flexible substrate that significantly improves transmission loss compared to the combination of polyimide-based and standard coverlay products. Using a PTFE base with a low-dielectric coverlay, we can expect a 60-70% improvement in transmission loss at the 40GHz band compared to standard products. Additionally, while the performance is slightly lower compared to PTFE-based substrates, a combination of LCP base and LCP coverlay can also expect about a 50% improvement in transmission loss and is suitable for long-term heat resistance and low outgassing applications due to the absence of adhesives. *For more details, please refer to the PDF materials or feel free to contact us. *Abbreviation explanations: PTFE ... Fluoropolymer LCP ... Liquid Crystal Polymer

• Wiring materials

Flexible substrate that bends freely and supports high current! Easily connects in tight spaces! Big Elec SMT Connect.

Attention all users of electric wires, wire harnesses, busbars, and bus bars! "Big Elec SMT Connect" (High Current FPC Surface Mount Connector Split Specification) is a compact flexible circuit board that allows for high current wiring even in extremely small spaces, thanks to its flat shape. It can be offered as a solution that significantly enhances design flexibility. The highly flexible circuit board allows for component mounting and can be used in bent configurations, making installation in tight spaces easy. Furthermore, its thinness contributes to space-saving. We propose an excellent high current wiring solution. Please give Big Elec SMT Connect a try!

• power supply
• Other power sources

We would like to extend our heartfelt congratulations on the continued prosperity of your esteemed company. Our company will be exhibiting at the following trade show, where we will introduce a number of products, including our new product, the Pillow Packaging Full Air Tightness Inspection Machine MSQ-2003. We sincerely apologize for the inconvenience during your busy schedule, but we would like to invite you to visit us at this opportunity. 【 Exhibition Name 】 JAPAN PACK 2025 Japan Packaging Industry Exhibition https://www.japanpack.jp/ 【 Dates 】 October 7 (Tuesday) to October 10 (Friday), 2025 *4 days 10:00 AM to 5:00 PM 【 Venue / Booth Number 】 Tokyo Big Sight / East Hall 8, Booth 8-505

When conducting structural analysis of organic compounds, IR, NMR, and MS can be considered the three sacred treasures. If the analysis is performed correctly, it is possible to elucidate the structure of even quite complex compounds. However, actual spectra are often not of a single compound, as seen in textbooks, which can lead to significant challenges in interpreting results for beginners in analysis. Additionally, while database searches are a useful tool in structural analysis, the ability to read spectra is necessary to select the correct structure from among the candidates, not just pattern matching. In this course, we will lecture on the basic ways to interpret IR, NMR, and MS spectra, including simple explanations of principles, points to be aware of during analysis, and how to proceed with actual analysis, incorporating some exercises as well.

◆Mechatrotech Japan 2025 —◆ Troax Safety Systems Co., Ltd. will be exhibiting at "Mechatrotech Japan 2025." ■ When it comes to steel safety fences, think "TROAX" - We will showcase steel safety fences used around robots, equipment, and conveyor lines. ■ The safety guard "FlexGuard" absorbs impact with flexible materials and boasts excellent durability - This safety guard ensures the safety of workers in environments where people and "machines/vehicles" interact, such as manufacturing sites, truck areas, and packing areas. At our booth, our staff will be available to answer various questions and address challenges related to products and safety measures on-site. We sincerely look forward to your visit.

Luminex Japan Co., Ltd. will exhibit at the 33rd Annual Meeting of the Japanese Society for Organ Transplantation, held at Nagasaki University from October 3 (Friday) to October 5 (Sunday). Please feel free to consult us at our booth regarding any questions about Luminex systems. We would also love to hear your feedback and requests!

[Speaker] Yuri Ishii, Deputy Director, Environmental Economics Division, Minister's Secretariat, Ministry of the Environment [Key Lecture Content] This guide has been created with the intention of assisting companies in responding to the increasing demands for disclosure in various environmental fields, such as climate change and natural capital, and was published in June of the 7th year of Reiwa. The "integrated approach" introduced in this guide suggests that companies should not respond individually to the disclosure requirements in each environmental field, but rather engage with an awareness of their interconnections. Through this initiative, we aim to improve business processes under management involvement, effectively and efficiently address various environmental issues, and facilitate disclosure. The key points of the guide will be explained. [Lecture Items] 1. Expansion of environmental issues to be addressed 2. Significance of integrated initiatives and disclosure 3. Trends in sustainability-related information disclosure 4. Methods and benefits of integrated initiatives and disclosure; case studies of companies 5. Utilization of environmental due diligence for information disclosure 6. Q&A / Business card exchange