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  1. Home
  2. Electronic Components and Semiconductors
  3. 山下マテリアル
Electronic Components and Semiconductors
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山下マテリアル

EstablishmentJune 15, 1965
capital25000Ten thousand
number of employees127
addressKanagawa/Zama-shi/1-44-12 Komatsubara
phone046-251-3722
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last updated:Oct 30, 2025
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  • Company information
  • Products/Services(42)
  • catalog(39)
  • news(2)

山下マテリアル Company Overview

Yamashita Material is an electronic circuit board manufacturer engaged in the development, production, and sales of FPC (Flexible Printed Circuit Boards).

We are committed to contributing to daily life, society, and industry through value creation driven by materials, technology, and speed (short delivery times) as our motto. FPC can be extremely thin and flexible, allowing it to be used in even the smallest spaces. Therefore, it is utilized in various fields such as smartphones, communication devices, medical equipment, eco-cars like EVs/HVs/FCVs, autonomous driving systems, and VR/AR devices. One of our features is our ability to respond to short delivery times, with the shortest possible delivery being available from the "one-and-a-half-day course." Recently, we developed the "BigElec" FPC, which supports high current. It can be used as a substitute for busbars and harnesses, and we have also obtained a patent for it. We are dedicated to listening sincerely to the needs of our customers and society to develop and create new products, while prioritizing safety and consistently delivering high-quality products. This integrated approach strengthens our foundation for growth and maximizes corporate value. We are building a solid foothold in the ever-changing global market and are striving for continuous growth and development. Please feel free to consult with us.

Business Activities

Development, design, manufacturing, and sales of flexible printed circuit boards Design and sales of printed circuit boards Mounting of electronic components

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Products/Services (42)

MSAP FPC (Ultra-fine Circuit High-Frequency Flexible Substrate) product image
MSAP FPC (Ultra-fine Circuit High-Frequency Flexible Substrate)
Flexible Printed Circuit Board (FPC) Assembly Service product image
Flexible Printed Circuit Board (FPC) Assembly Service
Heat-resistant solder resist ink "HRS-1-7W" product image
Heat-resistant solder resist ink "HRS-1-7W"
FPC forming (bending) delivery product image
FPC forming (bending) delivery

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catalog(39)

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Flexible Printed Circuit Board (FPC) Assembly Service

Flexible Printed Circuit Board (FPC) Assembly Service

CATALOG
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FPC forming (bending) delivery

FPC forming (bending) delivery

PRODUCT
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BigElec Flexible Circuit Board - New Product

BigElec Flexible Circuit Board - New Product

PRODUCT
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[Sensor-oriented FPC] Ultra-small / Slit / All LCP

[Sensor-oriented FPC] Ultra-small / Slit / All LCP

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news(2)

スクリーンショット 2025-11-18 155654.png

Notice of Yamashita Material's participation in NEPCON Japan 2026 (Booth Number: E26-13) from January 21 to January 23, 2026.

  • COMPANY

Thank you very much for your continued support. This is the Sales Department of Yamashita Material Co., Ltd., Circuit Tech Division. We will be exhibiting at NEPCON Japan 2026 from Wednesday, January 21 to Friday, January 23, 2026. You will be able to see examples and samples of solutions using flexible printed circuits. We would be grateful if you could stop by the Yamashita Material booth during your visit. *Exhibition Overview* NEPCON Japan 2026 - Dates: January 21 (Wednesday) to January 23 (Friday), 2026 - Venue: Tokyo Big Sight - Booth Number: E26-13 *An admission badge is required for entry to the exhibition. Please register in advance on the website linked below and print out your admission badge before your visit.* https://www.nepconjapan.jp/tokyo/ja-jp.html#/ *Main Exhibits* - Long-term high-temperature durable FPC - Low-loss FPC - Big Elec (high current FPC) We sincerely look forward to your visit, despite your busy schedule.

Nov 19, 2025

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スクリーンショット 2025-11-18 155654.png

Notice of Yamashita Material's participation in NEPCON Japan 2026 (Booth Number: E26-13) from January 21 to January 23, 2026.

  • SEMINAR_EVENT

Thank you very much for your continued support. This is the Sales Department of Yamashita Material Co., Ltd., Circuit Tech Division. We will be exhibiting at NEPCON Japan 2026 from January 21 (Wednesday) to January 23 (Friday), 2026. You will be able to see examples and samples of solutions using flexible printed circuits. We would be grateful if you could stop by the Yamashita Material booth during your visit. *Exhibition Overview* NEPCON Japan 2026 - Dates: January 21 (Wednesday) to January 23 (Friday), 2026 - Venue: Tokyo Big Sight - Booth Number: E26-13 *An admission badge is required for entry to the exhibition. Please register in advance on the website linked below and print out your admission badge before your visit.* https://www.nepconjapan.jp/tokyo/ja-jp.html#/ *Main Exhibits* - Long-term high-temperature durable FPC - Low-loss FPC - Big Elec (high current FPC) We understand that you are busy, but we sincerely look forward to your visit.

Nov 18, 2025

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Detailed information

Company name 山下マテリアル
number of employees127
Contact addresspostalcode 252-0002 Kanagawa/ Zama-shi/ 1-44-12 KomatsubaraView on map TEL:046-251-3722 FAX:046-251-3725
Business LocationsClick here for the list
Industry Electronic Components and Semiconductors
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