Consistent support from flexible printed circuit boards (FPC) to implementation.
Yamashita Material offers a comprehensive service from FPC manufacturing to component mounting, inspection, and final packaging. We perform fine mounting in-house from 0402 chips to 0603 chips, and we also accommodate high-density mounting such as BGA and wire bonding. We provide flexible support from prototyping to mass production, achieving high-quality and efficient manufacturing with a rapid response time of as short as one day.
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basic information
- Supported component sizes: 0402 chip to 0603 chip (in-house mounting compatible), BGA compatible, various irregular components supported - Solder types: Lead-free solder, eutectic solder, low melting point solder supported - Component insertion: Manual insertion of components not compatible with the mounter is possible, various forming supported, automatic insertion by inserter is also supported
Price information
Please consult us as it varies depending on the specifications.
Delivery Time
Applications/Examples of results
- Prototyping and mass production of electronic devices using FPC substrates - Fine mounting of 0402/0603 chips in compact devices - High-density substrates requiring BGA mounting and wire bonding - Electronic modules for automotive equipment, industrial equipment, communication equipment, and medical devices - Comprehensive support from prototyping evaluation in the development stage to mass production launch
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Company information
We are committed to contributing to daily life, society, and industry through value creation driven by materials, technology, and speed (short delivery times) as our motto. FPC can be extremely thin and flexible, allowing it to be used in even the smallest spaces. Therefore, it is utilized in various fields such as smartphones, communication devices, medical equipment, eco-cars like EVs/HVs/FCVs, autonomous driving systems, and VR/AR devices. One of our features is our ability to respond to short delivery times, with the shortest possible delivery being available from the "one-and-a-half-day course." Recently, we developed the "BigElec" FPC, which supports high current. It can be used as a substitute for busbars and harnesses, and we have also obtained a patent for it. We are dedicated to listening sincerely to the needs of our customers and society to develop and create new products, while prioritizing safety and consistently delivering high-quality products. This integrated approach strengthens our foundation for growth and maximizes corporate value. We are building a solid foothold in the ever-changing global market and are striving for continuous growth and development. Please feel free to consult with us.