Formation of fine circuits using the MSAP method.
Yamashita Material's MSAP (Modified Semi-Additive Process) is a high-precision method for forming fine copper wiring on polyimide substrates. Compared to traditional subtractive methods, it has less distortion in pattern shapes due to etching, allowing for the formation of higher-density circuits. It is suitable for FPC applications that require miniaturization, high density, and fine wiring.
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basic information
【Specifications】 Conductor thickness: 5 to 20 μm L/S: Minimum 30 μm Accuracy: ±5 μm Substrate: PI
Price information
Due to specifications
Delivery Time
Applications/Examples of results
Applications that require high-density circuit formation.
Company information
We are committed to contributing to daily life, society, and industry through value creation driven by materials, technology, and speed (short delivery times) as our motto. FPC can be extremely thin and flexible, allowing it to be used in even the smallest spaces. Therefore, it is utilized in various fields such as smartphones, communication devices, medical equipment, eco-cars like EVs/HVs/FCVs, autonomous driving systems, and VR/AR devices. One of our features is our ability to respond to short delivery times, with the shortest possible delivery being available from the "one-and-a-half-day course." Recently, we developed the "BigElec" FPC, which supports high current. It can be used as a substitute for busbars and harnesses, and we have also obtained a patent for it. We are dedicated to listening sincerely to the needs of our customers and society to develop and create new products, while prioritizing safety and consistently delivering high-quality products. This integrated approach strengthens our foundation for growth and maximizes corporate value. We are building a solid foothold in the ever-changing global market and are striving for continuous growth and development. Please feel free to consult with us.
