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  1. Home
  2. Electronic Components and Semiconductors
  3. 太洋テクノレックス 本社 和歌山
  4. 【TTL】High-Precision Flexible Printed Circuit Board【For Miniaturization and High Density of Electronic Devices!】Formation of ultra-fine circuits through the fusion of MSAP technology and via filling technology!
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  • May 23, 2024
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May 23, 2024

【TTL】High-Precision Flexible Printed Circuit Board【For Miniaturization and High Density of Electronic Devices!】Formation of ultra-fine circuits through the fusion of MSAP technology and via filling technology!

太洋テクノレックス 太洋テクノレックス 本社 和歌山
Ultra-fine lines, high density, and high-resolution flexible printed circuit boards have made it possible to form ultra-fine circuits through the fusion of MSAP technology and via filling technology! For modularization in medical devices and next-generation communication systems! The miniaturization and enhancement of electronic devices are progressing, leading to a demand for finer circuit formation. 【Features of MSAP Technology】 ■ Circuit formation through electroplating enables high-precision fine wiring ■ Excellent rectangularity of wiring cross-section contributes to reduced transmission loss ■ Superior for high-frequency substrates and IC mounting The fusion of these two processing technologies has realized "ultra-fine line high-density FPC." #UltraFineLines #HighDensity #FPC #FlexibleSubstrate #FlexiblePrintedCircuitBoard
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超細線高密度FPC.png

Ultra-fine line high-density FPC (high-precision flexible printed circuit board)

Ultra-fine lines, high density, and high-resolution flexible printed circuit boards have made it possible to form ultra-fine circuits through the integration of MSAP technology and via filling techniques!

The miniaturization and high functionality of electronic devices are advancing, and along with this, there is a demand for finer circuit formation. One method for forming wiring by etching copper foil (subtractive method) and a high-resolution circuit formation method involves forming wiring on ultra-thin copper foil through plating (semi-additive method). The method we are introducing this time is one of the semi-additive processes called "MSAP (Modified Semi Additive Process)." By using the MSAP method, it has become possible to form ultra-fine and high-density patterns that are difficult to achieve with the subtractive method. Additionally, by combining it with the "via filling technology" that fills through-hole holes with copper plating, it becomes possible to create wiring on the through-holes as well, further increasing wiring density. **Features of the MSAP Method** - Circuit formation through plating deposition enables high-precision fine wiring. - Excellent rectangularity of wiring cross-sections contributes to reduced transmission loss. - Superior for high-frequency substrates/IC mounting. By merging these two processing technologies, we have realized "ultra-fine high-density FPC." #FlexibleSubstrate #Substrate #HighPrecisionSubstrate #Flex #FlexiblePrintedCircuitBoard

  • Printed Circuit Board
  • Circuit board design and manufacturing

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Material Evaluation Services: FPC, MPI, PTFE (Flexible Substrate)

From high-frequency applications to the design, manufacturing, evaluation testing, and analysis reports of flexible printed circuit boards with various characteristics!

We support the evaluation of high-frequency characteristics of materials under development. Our company has the know-how to handle everything from short-term prototypes to mass production of FPCs. We can provide optimal proposals tailored to the needs of material manufacturers, flexible printed circuit board manufacturers, and various equipment manufacturers. We assist in evaluating the various characteristics of new materials that are being improved daily.

  • Printed Circuit Board

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高周波対応FPC?.png

High-frequency compatible FPC

Supports low transmission loss and impedance matching! There are various applications such as mobile electronic devices and IoT devices.

"High-Frequency Compatible FPC" and "High-Frequency Compatible Flexible Printed Circuit Board" are products designed to support low transmission loss and impedance matching. Specifications include coplanar lines, microstrip lines, and strip lines. They can be used for various applications. 【Examples of Applications】 ■ Mobile electronic devices such as smartphones ■ Optical communication modules ■ IoT devices ■ Video equipment (4K/8K) ■ Other alternatives to coaxial cables *For more details, please refer to the PDF document or feel free to contact us. #Flexible #FPC #FlexibleCircuitBoard #FlexiblePrintedCircuitBoard #CircuitBoard #PrintedCircuitBoard #HighFrequency #Impedance #ShortLeadTime #MassProduction

  • Other electronic parts

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多層FPC?.png

Multilayer FPC (multilayer substrate, multilayer flexible printed circuit board)

We will manufacture multi-layer flexible printed circuit boards (3 to 6 layers) entirely from polyimide. Please look forward to our quick delivery response! (Multi-layer boards, FPC)

Taiyo Industry supports everything from prototyping to mass production. ■ Achieves high density through pad-on-bead technology. ■ Compatible with 400μm pitch BGA. ■ Improved design flexibility with multilayer structures for high-density wiring. ■ Also supports impedance management. For more detailed information, please feel free to contact our representative. #Flex #FPC #FlexibleCircuitBoard #FlexiblePrintedCircuitBoard #CircuitBoard #PrintedCircuitBoard #HighFrequency #Impedance

  • Printed Circuit Board
  • Other electronic parts
  • Circuit board design and manufacturing

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Related catalog(2)

"Until FPC is completed..." The manufacturing process has become a document.

"Until FPC is completed..." The manufacturing process has become a document.

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【NEW!】Ultra-fine Wire High-Density FPC

【NEW!】Ultra-fine Wire High-Density FPC

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太洋テクノレックス
Electronic Components and Semiconductors
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Fukuda's leak test, leak inspection, leak detection, leak test, integrity test.

  • NEW
  • PRODUCT

Fukuda Co., Ltd. has been pursuing leak detection for 60 years and is committed to advancing the future of leak testing. 【 Supporting Various Leak Tests: Air Leak Test / Gas Leak Test (Hydrogen Gas, Helium Gas) 】 We develop, manufacture, and sell leak testing equipment to inspect airtightness and sealing properties. We will propose the appropriate testers and devices for each inspection target. 【 Target Industries and Examples of Inspection Targets 】 - Automotive Industry: Engines, FC components, valves and piping, various parts - Electronic Components Industry: Smartphones, keyless switches, various small sensors - Pharmaceuticals / Food / Cosmetics Industry: Bottle containers, syringes, vials, eye drop containers, pillow packaging, PTP packaging We will propose the most suitable leak testers for each industry. 【 ISO Certification 】JIS Q 9001:2015 (ISO 9001:2015)

Mar 31, 2026

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Hyper CLT flooring panel

"Hyper CLT flooring" backed by industry-academia collaboration - a new option born from on-site ideas and university expertise. (NETIS number: TH-250021-A)

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  • PRODUCT

The sheets used at construction sites require various considerations, including strength, workability, transportability, work burden, and safety. What we have developed is the Hyper CLT sheet (NETIS number: TH-250021-A). The Hyper CLT sheet is not just aimed at being a new "wooden sheet." What we value is that it can truly be used on-site and that we can make proposals based on evidence rather than intuition. To achieve this, we have focused on the feedback and usability obtained from actual construction sites while advancing the acquisition and verification of various data through collaboration with universities. Points that may be difficult to see in solo corporate development have been organized from a more objective perspective by incorporating university expertise, which has been reflected in product development. It needs to be evaluated comprehensively, considering weight, maneuverability, burden during installation, consideration for the surrounding environment, and ease of introduction. In this context, the Hyper CLT sheet (NETIS number: TH-250021-A) expands possibilities as a new option based on practical insights gained on-site and data support through collaboration with universities.

Mar 31, 2026

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■■ Air Leak Tester | FLA-0200 / FLA-0201 series ■■ Fukuda's new flagship model. Equipped with mastering correction function, it enables high-precision measurements in a short time.

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Fukuda's new flagship model. - Masterless type (FLA-0200 series) - General type (FLA-0201 series) Two models of air leak testers. With the mastering correction function, high-precision measurements can be achieved in a short time. Please take a look at the catalog.

Mar 31, 2026

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[Cast Iron Crack] We will repair cracks in metal products without applying heat.

  • NEW
  • COMPANY

The "Mechanical Stitching Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without causing any thermal impact to the base material. Repairs can be carried out even in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If a detailed technical explanation is needed, please contact us.

Mar 31, 2026

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[Cast Iron Crack Repair] We repair cracks in metal products without applying heat.

  • NEW
  • COMPANY

The "Mechanical Stitching Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without causing any thermal impact to the base material. Repairs can be carried out in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If a detailed technical explanation is needed, please contact us.

Mar 31, 2026

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