太洋テクノレックス Company Overview

Taiyo TechnoRex has established manufacturing technology for 4-layer FPC (Flexible Printed Circuit Board) using the MSAP (Modified Semi Additive Process) method, which was developed to improve high-density wiring technology. Compared to conventional methods, it enables high-precision line width management, achieving fine wiring formation of 10μm/20μm (line/space) in 4-layer FPCs. This technology ensures high wiring accuracy and reliability of interlayer connections, making it possible to accommodate high-density and high-function circuit designs. The technology is expected to be applied not only in wearable devices and medical equipment but also in next-generation communication devices requiring high-frequency and high-speed transmission technology, AI server-related equipment, and ADAS and autonomous driving-related devices.

~Starting the demonstration of high-reliability FPC through space environment testing~ Taiyo Techno Rex Co., Ltd. has recently signed a business outsourcing contract with Jinsei Co., Ltd. regarding the space environment testing of our space-use FPC (Flexible Printed Circuit) cables. Our FPC will be mounted on the engineering model of the small satellite "Cubesat" developed by Jinsei, and various tests simulating the space environment will be conducted. This testing is an important initiative aimed at confirming and demonstrating functionality in future orbital operations. In outer space, resistance to extremely harsh conditions such as extreme temperature changes, radiation, and intense vibrations is required. We view this initiative not only as limited to space applications but also as an opportunity to demonstrate FPC technology that exhibits high reliability even under extreme conditions. Moving forward, we will continue to develop and provide high-reliability FPCs with an eye toward expanding into a wide range of fields, including aerospace, industrial equipment, automotive devices, and various inspection equipment, where high quality and reliability are essential.

**SPEXA - International Space Business Expo Overview** Date: May 27 (Wed) - 29 (Fri), 2026, 10:00 - 17:00 Location: Tokyo Big Sight, South Hall Booth: No. S10-40 (Wakayama Prefecture) **Exhibition Content** ■ Efforts in FPC Development for the Space Industry We are promoting the development of high-reliability FPCs that can withstand harsh environments. By collaborating with and participating in meetings with space-related companies and organizations, we identify needs and propose wiring and processes based on JAXA specifications. ■ FPC We will introduce PI-based compact and lightweight FPCs. We respond to small lot and short delivery time requirements, meeting the needs of satellite development. Our thin, lightweight, and highly flexible designs enhance design freedom, allowing for consistent support from design to processing to implementation and assembly.