[Press Release from Taiyo TechnoRex] Established 4-layer FPC manufacturing technology using MSAP method, achieving 10μm/20μm fine wiring and accelerating expansion into next-generation communications, AI, and ADAS fields.
Taiyo TechnoRex has established manufacturing technology for 4-layer FPC (Flexible Printed Circuit Board) using the MSAP (Modified Semi Additive Process) method, which was developed to improve high-density wiring technology. Compared to conventional methods, it enables high-precision line width management, achieving fine wiring formation of 10μm/20μm (line/space) in 4-layer FPCs. This technology ensures high wiring accuracy and reliability of interlayer connections, making it possible to accommodate high-density and high-function circuit designs. The technology is expected to be applied not only in wearable devices and medical equipment but also in next-generation communication devices requiring high-frequency and high-speed transmission technology, AI server-related equipment, and ADAS and autonomous driving-related devices.

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