Liquid Leak Testing Device - A "new" solution to make liquid leaks visible.

Taiyo TechnoRex has established manufacturing technology for 4-layer FPC (Flexible Printed Circuit Board) using the MSAP (Modified Semi Additive Process) method, which was developed to improve high-density wiring technology. Compared to conventional methods, it enables high-precision line width management, achieving fine wiring formation of 10μm/20μm (line/space) in 4-layer FPCs. This technology ensures high wiring accuracy and reliability of interlayer connections, making it possible to accommodate high-density and high-function circuit designs. The technology is expected to be applied not only in wearable devices and medical equipment but also in next-generation communication devices requiring high-frequency and high-speed transmission technology, AI server-related equipment, and ADAS and autonomous driving-related devices.

**SPEXA - International Space Business Expo Overview** Date: May 27 (Wed) - 29 (Fri), 2026, 10:00 - 17:00 Location: Tokyo Big Sight, South Hall Booth: No. S10-40 (Wakayama Prefecture) **Exhibition Content** ■ Efforts in FPC Development for the Space Industry We are promoting the development of high-reliability FPCs that can withstand harsh environments. By collaborating with and participating in meetings with space-related companies and organizations, we identify needs and propose wiring and processes based on JAXA specifications. ■ FPC We will introduce PI-based compact and lightweight FPCs. We respond to small lot and short delivery time requirements, meeting the needs of satellite development. Our thin, lightweight, and highly flexible designs enhance design freedom, allowing for consistent support from design to processing to implementation and assembly.

[ Kansai ] Nepcon Japan Overview Date: May 13 (Wednesday) to 15 (Friday), 2026, 10:00 AM to 5:00 PM Location: Intex Osaka, Hall 6 Booth: Space number ▲▲▲ (very close to the keynote speech and open seminar venue)

Our company will exhibit at the "40th InterNepcon Japan" held at Tokyo Big Sight from January 21 (Wednesday) to January 23 (Friday), 2026, with the themes of "Experience," "High Density," and "Space." Here, you will not only be able to see a variety of FPCs (Flexible Printed Circuits) on display but also experience their features by directly touching them. Additionally, we will showcase high-density wiring FPCs with filled via structures, as announced in our October 27, 2025 publication on "Improving High-Density Wiring Formation Technology Using Pattern Via Fill Methods," and introduce the technical advantages and development status of FPCs for the space industry that are currently under development. In particular, for FPCs used in the space industry, which require extremely high reliability, we are advancing development with an eye on the standards set by organizations like JAXA, as they are expected to be used under the most severe environmental conditions, including extreme temperature changes, intense vibrations, gas release (outgassing) in a vacuum, and radiation. We will display prototypes that have undergone special material selection and structural design to achieve heat resistance and vibration resistance under harsh conditions. Please come to our booth to confirm the evolution of FPC technology and its potential that our company is pursuing.