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  1. Home
  2. Electronic Components and Semiconductors
  3. 太洋テクノレックス 本社 和歌山
  4. Notice of Participation in the 2nd Kansai NePCON Japan Exhibition
COMPANY
  • Mar 11, 2026
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Mar 11, 2026

Notice of Participation in the 2nd Kansai NePCON Japan Exhibition

太洋テクノレックス 太洋テクノレックス 本社 和歌山
[ Kansai ] Nepcon Japan Overview Date: May 13 (Wednesday) to 15 (Friday), 2026, 10:00 AM to 5:00 PM Location: Intex Osaka, Hall 6 Booth: Space number ▲▲▲ (very close to the keynote speech and open seminar venue)
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Liquid Leak Testing Device - A "new" solution to make liquid leaks visible.

Are you aiming for "zero missed leaks" in liquid filling processes? A new liquid leak inspection device utilizing flexible printed circuit boards (FPC)!

An FPC is installed at the mouth of "liquid-filled containers" flowing on production lines such as conveyor belts, enabling instant detection of minute liquid leaks. This contributes to the automation of line stoppages and the elimination of defective products. It is a new inspection solution that realizes "visualization" for quality improvement, cost reduction, and standardization of inspection processes. 【Features】 - High-precision surface detection that surpasses visual inspection capabilities - Inline installation on existing lines is possible (retrofit compatible) - Compatible with various shapes such as bottles, pouches, and nozzles - Eliminates reliance on specific personnel, enabling unmanned operation without the need for training - Automation and standardization of inspection processes through the supplementation of visual inspections - Addresses labor shortages with 24-hour unmanned inspections 【Benefits of Implementation】 - Increased efficiency and improved yield in pre-shipment inspections - Reduced risk of returns and recalls - Lower labor and training costs - Standardization of quality across overseas locations The FPC can be customized according to container shapes through in-house design and manufacturing.

  • Sensors
  • Filling and bottling machines
  • Liquid and beverage filling machines

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EMS - Comprehensive Contracting Services

One-stop service for FPC design, manufacturing, implementation, and finished product assembly all provided by Taiyo Technorex!

We will support the resolution of challenges in your product development and manufacturing in a broader and more flexible manner. ★.。.:*+゜★.。.:*+゜★.。.:*+゜★.。.:*+゜★.。.:*+゜★.。.:*+゜★.。.:*+゜  ☆ ~ ☆ ~ Do you have any of the following concerns? ~☆ ~ ☆   • Looking for a reliable manufacturing partner for new product development   • Considering outsourcing as you do not have a manufacturing line   • Wanting to request complex board assembly and enclosure assembly, including FPC ★.。.:*+゜★.。.:*+゜★.。.:*+゜★.。.:*+゜★.。.:*+゜★.。.:*+゜★.。.:*+゜ Our company has established a system that can consistently handle everything from design to implementation, assembly, inspection, and shipping, and we support the resolution of challenges in your product development and manufacturing in a broader and more flexible manner. You will be able to focus on development while efficiently bringing high-quality products to market. If you would like detailed materials or case studies about our EMS business, please feel free to contact us. We also welcome those who just want to take a look at the materials!

  • Circuit board design and manufacturing
  • EMS

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[Exhibition Report] We exhibited at NEPCON Japan 2026!

Here is a brief introduction to the successful exhibition content.

<Main Exhibition Content> ◆FPC (Flexible Printed Circuit Board)◆   ~Touch, Compare, Experience FPC!~    ●Comparison of weight between rigid boards and FPC    ●Reduction of board area through high-density wiring    ●Improved work efficiency with transparent FPC    ●Introduction of black coverlay, etc.   ~Technical Topics~    ●High-frequency compatible FPC / High-frequency analysis measurement... Proposing optimal designs and materials based on analysis results    ●Fine pitch thick copper FPC... Contributing to miniaturization of devices with high-density wiring    ●Pattern via fill 4-layer FPC... Achieving high-density wiring and pad-on-via    ●6-layer stack via FPC... High-density wiring with stack via structure   ~Our Initiatives~    ●Introduction of "Space" related business    ●Demonstration of "Leak Detection Device" ◆Various Boards and Ceramic Material Systems◆    Introduction of AI technology, final appearance inspection equipment, and electrical inspection equipment    (Semi-automatic appearance inspection equipment TY-VISION M105SC II) Live demonstration ◆Efficiency and Automation◆    Proposal for utilizing FA and collaborative robots    (Appearance inspection system + ASSISTA = Efficiency) Live demonstration

  • Printed Circuit Board
  • Pharmaceutical containers and packaging
  • Cosmetic containers and packaging

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FPC - "Technical Information" - Updated September 2025

I would like to introduce the "Technical Information" related to FPC.

● 6-layer stacked via FPC Achieves further high-density wiring with a stacked via structure using via filling technology. Contributes to improved design flexibility by effectively utilizing wiring space. ● MSAP method Realizes high-precision and high-density fine wiring with enhanced plating. Excellent rectangularity of wiring cross-section allows for wiring formation as envisioned. ● Pattern via fill FPC Achieves high-density wiring and pad-on-via by combining MSAP and via filling methods. ● Fine pitch thick copper FPC Contributes to miniaturization of devices with large current and high-density wiring. ● High-frequency fluorine composite 3-layer FPC Combines noise countermeasures and miniaturization with fluorine composite material FPC that has excellent dielectric properties. Suitable for conversion from coaxial cables. ● High-frequency compatible FPC Proposes optimal design and materials based on analysis results. ● Transparent FPC An FPC with excellent light transmittance and heat resistance, capable of chip mounting. Allows for wiring routing without compromising product design.

  • Printed Circuit Board

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スクリーンショット 2024-01-15 100409.png

Taiyo Technorex Co., Ltd. Company Profile

This is the company profile of Taiyo Technorex. (Company name change effective December 21, 2023)

Taiyo Industrial Co., Ltd. (Established December 1960) Taiyo Technolex Co., Ltd. (Name changed December 2023) [Thoughts Behind the New Company Name] The coined term "TECHNOLEX," derived from "Technology" and "Flexible," symbolizes the flexibility of our main product, FPC (Flexible Printed Circuit Board), as well as our commitment to adapt flexibly not only to conventional technologies but also to new technologies and areas such as technology trading. We are evolving beyond the confines of "industry" and looking towards a transition to a more global market.

  • Printed Circuit Board
  • Transport and handling robots
  • Circuit Board Inspection Equipment

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FPCができるまで看板?.png

[Presentation of Materials] Until FPC is completed...

[Basic Knowledge] The standard manufacturing process of Taiyo Industry, which has focused on small quantities of a wide variety of products, has been documented!

This document introduces the manufacturing process of FPC (Flexible Printed Circuit) conducted by Taiyo Techno-Rex Co., Ltd. How are flexible printed circuit boards made? This material is intended for those who want to learn about FPC. It explains the manufacturing process after the design of standard specification FPC. [Contents (excerpt)] ■ Exposure ■ Through-hole drilling ■ Copper plating ■ Dry film lamination ■ Exposure * The PDF version is available for download. * A PowerPoint version is also available upon request.

  • Printed Circuit Board
  • Other electronic parts
  • Other cable related products

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Electronic Components and Semiconductors
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Hyper CLT flooring panel

Civil CLT as common temporary works for public construction | Hyper CLT flooring

  • NEW
  • COMPANY

In public construction civil engineering sites, there are many instances where sheets are used as common temporary facilities, such as construction roads, access roads, heavy machinery work yards, material storage areas, and worker pathways. Traditionally, steel plates were common, but due to their weight, transportation and installation can be cumbersome. Hyper CLT sheets are civil engineering materials made from wooden CLT for civil engineering use. The 5×10 sheet weighs about 230 kg, and the 5×20 sheet weighs about 460 kg, making them lightweight and easy to transport, install, and remove, even with small machinery. They can be widely utilized for temporary roads, heavy machinery scaffolding, pathways within the site, and protection of material storage in public works. Since they are made of wood, they also contribute to environmental aspects such as reducing summer heat reflection, lowering noise, and fixing CO2. They can simultaneously address construction efficiency, safety measures, and environmental considerations, making them effective for innovative proposals in public works. Furthermore, they improve transportation efficiency and reduce labor in site operations as an alternative to steel plates. Hyper CLT sheets are registered technology with the Ministry of Land, Infrastructure, Transport and Tourism under NETIS "TH-250021-A." They are recommended for companies considering civil engineering, civil engineering use, and civil engineering CLT. Feel free to request materials or consult about implementation. They are temporary materials that also help improve site evaluations in public works. Please consider them.

Jun 28, 2026

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[YouTube Update] Differences in Cleansing Ingredients You Should Know Before Developing an Original Shampoo

  • NEW
  • COMPANY

We have released a new video on our company’s YouTube channel. The theme of this video is "The World of Amino Acid-Based Shampoos." Amino acid-based shampoos have become popular in recent years, but the lather, feel, and finish can vary greatly depending on the cleansing ingredients used. In this video, we clearly explain the changes in user experience based on the differences in cleansing ingredients by comparing two types of amino acid-based shampoos. We hope you can use this as a hint for developing original shampoos and differentiation.

Jun 26, 2026

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The 2nd Japan Go IPO Summit held in Tokyo in response to the growing momentum of Japanese companies in the U.S. capital markets.

  • NEW
  • COMPANY

New York and Tokyo, June 26, 2026 - (JCN Newswire) - This year's successful listing of PayPay Corporation (hereinafter "PayPay") on NASDAQ has provided a significant boost. The question now facing Japan's leading innovation companies is no longer "Is a U.S. listing feasible?" but rather "How can we attract global capital and build companies that align with global growth strategies?" The 2nd Japan Go IPO Summit will be held on September 16, 2026, at the Grand Hyatt Tokyo to address this question. This summit is hosted by MarcumAsia and organized by AUM Advisors. To register for this invitation-only event, please apply here: Japan GO IPO Summit Attendee Information https://events.marcumasia.com/view.php?id=32

Jun 26, 2026

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[Ministry of Economy, Trade and Industry Sponsored Seminar] "Eliminating Failures in AI Implementation" - Explanation of Successful Patterns in Manufacturing Sites with Real Examples (7/3)

  • NEW
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Our company representative, Shibata, will be speaking as a lecturer at the "Mikata Project" AI Utilization Seminar for the automotive industry, hosted by the Chubu Bureau of Economy, Trade and Industry. ■ Title: AI Implementation Course Leading to Results - Learning Success Patterns and Practical Processes from Real Examples in Manufacturing Sites "We implemented AI, but it is not being used on-site and is left unattended" and "The implementation has become the goal without yielding results" - we have seen many such stumbling blocks in manufacturing sites. In the seminar, based on real examples, we will discuss common patterns for successful implementation that lead to results, pitfalls to avoid, and practical processes to ensure AI is continuously used. We will also propose specific measures for sites struggling with technology transfer and dependency on individuals. ■ Event Overview Date: July 3, 2026 (Friday) 13:30 - 16:00 Venue: TKP Meitetsu Nagoya Station Conference Center + Online Participation Fee: Free / Application Deadline: June 30 (Tuesday) Organizer: Chubu Bureau of Economy, Trade and Industry (Automotive Industry "Mikata Project") Co-presenter: Satoru Hayami, Waseda University For details and registration, please visit the official page of the Chubu Bureau of Economy, Trade and Industry. If you are struggling with AI implementation in manufacturing sites, please feel free to consult us, regardless of region or industry.

Jun 26, 2026

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We will be exhibiting at "Okayama Monozukuri NEXT 2026"!

  • NEW
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July 16 (Thursday) 10:00 AM - 6:00 PM Venue: Convex Okayama Small Exhibition Hall

Jun 26, 2026

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